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Quectel EG91 Series Hardware Design

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EG91
Hardware Design
LTE Standard Module Series
Rev. EG91_Hardware_Design_V1.4
Date: 2019-03-29
Status: Released
www.quectel.com

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Summary of Contents for Quectel EG91 Series

  • Page 1 EG91 Hardware Design LTE Standard Module Series Rev. EG91_Hardware_Design_V1.4 Date: 2019-03-29 Status: Released www.quectel.com...
  • Page 2 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 3: About The Document

    LTE Standard Module Series EG91 Hardware Design About the Document History Revision Date Author Description Felix YIN/ 2017-03-22 Yeoman CHEN/ Initial Jackie WANG 1. Added band B28A. 2. Updated the description of UMTS and GSM features in Table 2. 3. Updated the functional diagram in Figure 1. 4.
  • Page 4 LTE Standard Module Series EG91 Hardware Design 11. Updated antenna requirements in Table 25. 12. Updated RF output power in Table 32. 1. Added new variants EG91-NS, EG91-V, EG91-EC and related contents. 2. Opened pin 24 as ADC0 and added related contents.

  • Page 5: Table Of Contents

    LTE Standard Module Series EG91 Hardware Design Contents About the Document ..........................2 Contents ..............................4 Table Index ..............................6 Figure Index ..............................8 Introduction ............................10 1.1. Safety Information........................11 Product Concept ..........................12 2.1. General Description ........................ 12 2.2.
  • Page 6 LTE Standard Module Series EG91 Hardware Design 3.15. STATUS ..........................48 3.16. ADC Interface ......................... 49 3.17. Behaviors of RI ........................50 3.18. USB_BOOT Interface ......................51 GNSS Receiver ..........................53 4.1. General Description ........................ 53 4.2. GNSS Performance ........................ 53 4.3.
  • Page 7 LTE Standard Module Series EG91 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EG91 SERIES MODULE ............... 12 TABLE 2: KEY FEATURES OF EG91 MODULE ....................13 TABLE 3: IO PARAMETERS DEFINITION ......................19 TABLE 4: PIN DESCRIPTION ........................... 19 TABLE 5: OVERVIEW OF OPERATING MODES .....................
  • Page 8 LTE Standard Module Series EG91 Hardware Design TABLE 43: EG91-EX CONDUCTED RF RECEIVING SENSITIVITY ............... 74 TABLE 44: ELECTROSTATIC DISCHARGE CHARACTERISTICS ..............75 TABLE 45: RECOMMENDED THERMAL PROFILE PARAMETERS ............... 83 TABLE 46: RELATED DOCUMENTS ........................ 86 TABLE 47: TERMS AND ABBREVIATIONS ...................... 86 TABLE 48: DESCRIPTION OF DIFFERENT CODING SCHEMES ..............
  • Page 9 LTE Standard Module Series EG91 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ....................... 16 FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................... 18 FIGURE 3: SLEEP MODE APPLICATION VIA UART ..................27 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP ............ 28 FIGURE 5: SLEEP MODE APPLICATION WITH RI ..................
  • Page 10 LTE Standard Module Series EG91 Hardware Design FIGURE 39: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ....76 FIGURE 40: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB) ................................... 77 FIGURE 41: MODULE TOP AND SIDE DIMENSIONS ..................78 FIGURE 42: MODULE BOTTOM DIMENSIONS (TOP VIEW) .................

  • Page 11: Introduction

    LTE Standard Module Series EG91 Hardware Design Introduction This document defines the EG91 module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG91 module.

  • Page 12: Safety Information

    EG91 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 13: Product Concept

    HSPA+, HSDPA, HSUPA, WCDMA, EDGE and GPRS networks. It can also provide voice functionality to meet customers’ specific application demands. The following table shows the frequency bands of EG91 series module. Table 1: Frequency Bands of EG91 Series Module LTE Bands WCDMA...

  • Page 14: Key Features

    LTE Standard Module Series EG91 Hardware Design With a compact profile of 29.0mm × 25.0mm × 2.3mm, EG91 can meet almost all requirements for M2M applications such as automotive, smart metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc. EG91 is an SMD type module which can be embedded into applications through its 106 LGA pads.
  • Page 15 LTE Standard Module Series EG91 Hardware Design Support EDGE multi-slot class 33 (33 by default) Support GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) Downlink coding schemes: CS 1-4 and MCS 1-9 Uplink coding schemes: CS 1-4 and MCS 1-9 Max 296Kbps (DL)/Max 236.8Kbps (UL) Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/NITZ/CMUX*/HTTPS*/ SMTP*/MMS*/FTPS*/SMTPS*/SSL*/FILE* protocols...

  • Page 16: Functional Diagram

    LTE Standard Module Series EG91 Hardware Design Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT AT Commands commands NETLIGHT pin for network activity status indication Network Indication Including main antenna interface (ANT_MAIN), Rx-diversity antenna Antenna Interfaces (ANT_DIV) interface and GNSS antenna interface (ANT_GNSS) Size: (29.0±...

  • Page 17: Evaluation Board

    GNSS antenna interface is only supported on EG91-NA/-NS/-VX/-EX. 2.4. Evaluation Board Quectel provides a complete set of evaluation tools to facilitate the use and testing of EG91 module. The evaluation tool kit includes the evaluation board (UMTS&LTE EVB), USB data cable, earphone, antenna and other peripherals.

  • Page 18: Application Interfaces

    LTE Standard Module Series EG91 Hardware Design Application Interfaces 3.1. General Description EG91 is equipped with 62-pin 1.1mm pitch SMT pads plus 44-pin ground/reserved pads that can be connected to customers’ cellular application platforms. Sub-interfaces included in these pads are described in detail in the following chapters: ...

  • Page 19: Pin Assignment

    LTE Standard Module Series EG91 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EG91 module. ANT_GNSS (EG91-NA/-NS/-VX/-EX) ANT_DIV (EG91-E) USIM_GND PCM_CLK USIM1_CLK PCM_SYNC USIM1_DATA USIM2_PRESENCE PCM_DIN USIM1_RST PCM_DOUT USIM1_VDD USIM2_CLK USIM1_PRESENCE USB_VBUS USB_DP USIM2_RST I2C_SDA I2C_SCL USB_DM USIM2_DATA...

  • Page 20: Pin Description

    LTE Standard Module Series EG91 Hardware Design NOTES PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset. Keep all RESERVED pins and unused pins unconnected. GND pads should be connected to ground in the design. Definition of pin 49 and 56 are different among EG91-E/-NS/-VX/-EX and EG91-NA.
  • Page 21 LTE Standard Module Series EG91 Hardware Design It must be able to Vmax=4.3V Power supply for provide sufficient VBAT_RF 52, 53 Vmin=3.3V module’s RF part current up to 1.8A in a Vnorm=3.8V burst transmission. Power supply for Provide 1.8V for Vnorm=1.8V external GPIO’s pull up VDD_EXT...
  • Page 22 LTE Standard Module Series EG91 Hardware Design Compliant with USB USB differential Require differential USB_DP 2.0 standard data bus (+) impedance of 90Ω. specification. Compliant with USB USB differential Require differential USB_DM 2.0 standard data bus (-) impedance of 90Ω. specification.
  • Page 23 LTE Standard Module Series EG91 Hardware Design For 1.8V (U)SIM: max=0.45V min=1.35V Reset signal of USIM1_RST (U)SIM card For 3.0V (U)SIM: max=0.45V min=2.55V min=-0.3V 1.8V power domain. USIM1_ (U)SIM card max=0.6V If unused, keep it PRESENCE insertion detection min=1.2V open. max=2.0V For 1.8V (U)SIM: Vmax=1.9V...
  • Page 24 LTE Standard Module Series EG91 Hardware Design min=2.55V min=-0.3V 1.8V power domain. USIM2_ (U)SIM card max=0.6V If unused, keep it PRESENCE insertion detection min=1.2V open. max=2.0V Main UART Interface Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain. max=0.45V Ring indicator If unused, keep it...
  • Page 25 LTE Standard Module Series EG91 Hardware Design open. min=-0.3V 1.8V power domain. max=0.6V DBG_RXD Receive data If unused, keep it min=1.2V open. max=2.0V PCM Interface Pin Name Pin No. Description DC Characteristics Comment min=-0.3V 1.8V power domain. max=0.6V PCM_DIN PCM data input If unused, keep it min=1.2V open.
  • Page 26 LTE Standard Module Series EG91 Hardware Design ADC Interface Pin Name Pin No. Description DC Characteristics Comment General purpose Voltage range: If unused, keep it ADC0 analog to digital 0.3V to VBAT_BB open. converter SPI Interface Pin Name Pin No. Description DC Characteristics Comment...

  • Page 27: Operating Modes

    LTE Standard Module Series EG91 Hardware Design min=-0.3V Application 1.8V power domain. max=0.6V AP_READY processor sleep If unused, keep it min=1.2V state detection open. max=2.0V Force the module to min=-0.3V 1.8V power domain. enter into max=0.6V It is recommended to USB_BOOT emergency min=1.2V...

  • Page 28: Power Saving

    LTE Standard Module Series EG91 Hardware Design Mode AT+CFUN command or W_DISABLE# pin can set the module to enter into airplane mode. Airplane In this case, RF function will be invalid. Mode In this mode, the current consumption of the module will be reduced to the minimal level. Sleep Mode During this mode, the module can still receive paging message, SMS, voice call and TCP/UDP data from the network normally.

  • Page 29: Usb Application With Usb Remote Wakeup Function

    LTE Standard Module Series EG91 Hardware Design  When EG91 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.17 for details about RI behavior.  AP_READY will detect the sleep state of host (can be configured to high level or low level detection). Please refer to AT+QCFG="apready"* command for details.

  • Page 30: Usb Application Without Usb Suspend Function

    LTE Standard Module Series EG91 Hardware Design  Execute AT+QSCLK=1 command to enable sleep mode.  Ensure the DTR is held at high level or keep it open.  The host’s USB bus, which is connected with the module’s USB interface, enters into suspended state. The following figure shows the connection between the module and the host.

  • Page 31: Airplane Mode

    LTE Standard Module Series EG91 Hardware Design Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host. Please refer to document [1] for more details about EG91 power management application.

  • Page 32: Decrease Voltage Drop

    LTE Standard Module Series EG91 Hardware Design Table 6: Pin Definition of VBAT and GND Pin Name Pin No. Description Min. Typ. Max. Unit Power supply for module’s VBAT_RF 52, 53 RF part. Power supply for module’s VBAT_BB 32, 33 baseband part.

  • Page 33: Reference Design For Power Supply

    LTE Standard Module Series EG91 Hardware Design VBAT VBAT_RF VBAT_BB 100nF 10pF 100uF 33pF 100uF 100nF 33pF 10pF WS4.5D3HV Module Figure 8: Star Structure of the Power Supply 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source.

  • Page 34: Power-On/Off Scenarios

    LTE Standard Module Series EG91 Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description DC Characteristics Comment max=2.1V The output voltage is 0.8V PWRKEY...
  • Page 35 LTE Standard Module Series EG91 Hardware Design PWRKEY Close to S1 Figure 11: Turn on the Module Using Button The power-on scenario is illustrated in the following figure. NOTE VBAT ≥500ms =0.8V PWRKEY ≤0.5V About 100ms VDD_EXT ≥100ms, after this time, the BOOT_CONFIG & U SB _BOOT pi n s can b e se t hi gh l eve l by external circuit.

  • Page 36: Turn Off Module

    LTE Standard Module Series EG91 Hardware Design NOTES Please make sure that VBAT is stable before pulling down PWRKEY pin. The time between them is no less than 30ms. PWRKEY can be pulled down directly to GND with a recommended 10K resistor if module needs to be powered on automatically and shutdown is not needed.

  • Page 37: Reset The Module

    LTE Standard Module Series EG91 Hardware Design NOTES In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, the power supply can be cut off.

  • Page 38: U)Sim Interfaces

    LTE Standard Module Series EG91 Hardware Design RESET_N Close to S2 Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. VBAT ≤ 460ms ≥ 150ms ≥ 1.3V RESET_N ≤ 0.5V Module Running Resetting Restart...
  • Page 39 LTE Standard Module Series EG91 Hardware Design Table 9: Pin Definition of (U)SIM Interfaces Pin Name Pin No. Description Comment Either 1.8V or 3.0V is USIM1_VDD Power supply for (U)SIM1 card supported by the module automatically. USIM1_DATA Data signal of (U)SIM1 card USIM1_CLK Clock signal of (U)SIM1 card USIM1_RST...
  • Page 40 LTE Standard Module Series EG91 Hardware Design VDD_EXT USIM1_VDD 100nF (U)SIM Card Connector USIM_GND USIM_VDD USIM_RST Module USIM_CLK USIM_PRESENCE USIM_DATA 33pF 33pF 33pF Figure 17: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector If (U)SIM card detection function is not needed, please keep USIM_PRESENCE unconnected. A reference circuit of (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure.

  • Page 41: Usb Interface

    LTE Standard Module Series EG91 Hardware Design the trace width of ground and USIM_VDD no less than 0.5mm to maintain the same electric potential. Make sure the bypass capacitor between USIM_VDD and USIM_GND less than 1uF, and place it as close to (U)SIM card connector as possible.
  • Page 42 LTE Standard Module Series EG91 Hardware Design The USB interface is recommended to be reserved for firmware upgrade in customers’ design. The following figure shows a reference circuit of USB interface. Test Points Minimize these stubs Module NM_0R NM_0R ESD Array USB_VBUS USB_DM USB_DM...

  • Page 43: Uart Interfaces

    LTE Standard Module Series EG91 Hardware Design 3.11. UART Interfaces The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features.  The main UART interface supports 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps, 460800bps, 921600bps and 3000000bps baud rates, and the default is 115200bps.
  • Page 44 LTE Standard Module Series EG91 Hardware Design Table 13: Logic Levels of Digital I/O Parameter Min. Max. Unit -0.3 0.45 1.35 The module provides 1.8V UART interfaces. A level translator should be used if customers’ application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended.

  • Page 45: Pcm And I2C Interfaces

    LTE Standard Module Series EG91 Hardware Design 4.7K VDD_EXT VDD_EXT Module MCU/ARM VDD_EXT VCC_MCU 4.7K GPIO EINT GPIO Figure 21: Reference Circuit with Transistor Circuit NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12.
  • Page 46 LTE Standard Module Series EG91 Hardware Design 125us PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 22: Primary Mode Timing 125us PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design.
  • Page 47 LTE Standard Module Series EG91 Hardware Design Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. Description Comment PCM_DIN PCM data input 1.8V power domain PCM_DOUT PCM data output 1.8V power domain PCM data frame PCM_SYNC 1.8V power domain synchronization signal PCM_CLK...

  • Page 48: Spi Interface

    LTE Standard Module Series EG91 Hardware Design 3.13. SPI Interface SPI interface of EG91 acts as the master only. It provides a duplex, synchronous and serial communication link with the peripheral devices. It is dedicated to one-to-one connection, without chip select. Its operation voltage is 1.8V with clock rates up to 50MHz.

  • Page 49: Status

    LTE Standard Module Series EG91 Hardware Design The following tables describe the pin definition and logic level changes of NETLIGHT in different network status. Table 16: Pin Definition of Network Status Indicator Pin Name Pin No. Description Comment NETLIGHT Indicate the module’s network activity status 1.8V power domain Table 17: Working State of Network Status Indicator Pin Name...

  • Page 50: Adc Interface

    LTE Standard Module Series EG91 Hardware Design Table 18: Pin Definition of STATUS Pin Name Pin No. Description Comment 1.8V power domain. STATUS Indicate the module’s operating status If unused, keep it open. The following figure shows the reference circuit of STATUS. VBAT Module 2.2K...

  • Page 51: Behaviors Of Ri

    LTE Standard Module Series EG91 Hardware Design Table 20: Characteristics of ADC Interface Parameter Min. Typ. Max. Unit ADC0 Voltage Range VBAT_BB ADC Resolution bits NOTES It is prohibited to supply any voltage to ADC pins when VBAT is removed. It is recommended to use resistor divider circuit for ADC application.

  • Page 52: Usb_Boot Interface

    LTE Standard Module Series EG91 Hardware Design 3.18. USB_BOOT Interface EG91 provides a USB_BOOT pin. Customers can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter into emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface.
  • Page 53 LTE Standard Module Series EG91 Hardware Design NOTE VBAT ≥500ms V H =0.8V PWRKEY V IL ≤0.5V About 100ms VDD_EXT Setting USB_BOOT to high level between VBAT rising on and VDD_EXT rising on can let the module enter into emergency download mode. USB_BOOT RESET_N Figure 29: Timing Sequence for Entering into Emergency Download Mode...

  • Page 54: Gnss Receiver

    LTE Standard Module Series EG91 Hardware Design GNSS Receiver 4.1. General Description EG91 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG91 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default.

  • Page 55: Layout Guidelines

    LTE Standard Module Series EG91 Hardware Design Autonomous Hot start @open sky XTRA enabled Accuracy Autonomous CEP-50 <2.5 (GNSS) @open sky NOTES Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.

  • Page 56: Antenna Interfaces

    LTE Standard Module Series EG91 Hardware Design Antenna Interfaces EG91 antenna interfaces include a main antenna interface and an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface which is only supported on EG91-NA/-NS/-VX/-EX.

  • Page 57: Reference Design Of Rf Antenna Interface

    LTE Standard Module Series EG91 Hardware Design WCDMA B2 1850~1910 1930~1990 WCDMA B4 1710~1755 2110~2155 WCDMA B5 824~849 869~894 WCDMA B8 880~915 925~960 LTE-FDD B1 1920~1980 2110~2170 LTE FDD B2 1850~1910 1930~1990 LTE-FDD B3 1710~1785 1805~1880 LTE FDD B4 1710~1755 2110~2155 LTE FDD B5 824~849...

  • Page 58: Reference Design Of Rf Layout

    LTE Standard Module Series EG91 Hardware Design Main Module antenna ANT_MAIN Diversity antenna ANT_DIV Figure 30: Reference Circuit of RF Antenna Interface NOTES Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the receiving sensitivity. ANT_DIV function is enabled by default.
  • Page 59 LTE Standard Module Series EG91 Hardware Design Figure 32: Coplanar Waveguide Design on a 2-layer PCB Figure 33: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: EG91_Hardware_Design...

  • Page 60: Gnss Antenna Interface

    LTE Standard Module Series EG91 Hardware Design  Use impedance simulation tool to control the characteristic impedance of RF traces as 50Ω.  The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.

  • Page 61: Antenna Installation

    LTE Standard Module Series EG91 Hardware Design 0.1uF GNSS Antenna Module 47nH 100pF ANT_GNSS Figure 35: Reference Circuit of GNSS Antenna NOTES An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. 5.3.

  • Page 62: Recommended Rf Connector For Antenna Installation

    LTE Standard Module Series EG91 Hardware Design (EGSM900,WCDMA B5/B8, LTE B5/B8/B12/B13/B20/B26/B28) Cable Insertion Loss: < 1.5dB (DCS1800, WCDMA B1/B2/B4, LTE B1/B2/B3/B4/B25) Cable insertion loss: < 2dB (LTE B7) NOTE It is recommended to use a passive GNSS antenna when LTE B13 is supported, as the use of active antenna may generate harmonics which will affect the GNSS performance.
  • Page 63 LTE Standard Module Series EG91 Hardware Design Figure 37: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 38: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EG91_Hardware_Design 62 / 93...

  • Page 64: Electrical, Reliability And Radio Characteristics

    LTE Standard Module Series EG91 Hardware Design Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 29: Absolute Maximum Ratings Parameter Min.

  • Page 65: Operation And Storage Temperatures

    LTE Standard Module Series EG91 Hardware Design Voltage drop during Maximum power control burst transmission level on EGSM900 Peak supply Maximum power control current (during VBAT level on EGSM900 transmission slot) USB connection USB_VBUS 5.25 detection 6.3. Operation and Storage Temperatures The operation and storage temperatures are listed in the following table.

  • Page 66: Current Consumption

    LTE Standard Module Series EG91 Hardware Design 6.4. Current Consumption The values of current consumption are shown below. Table 32: EG91-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspended) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state...
  • Page 67 LTE Standard Module Series EG91 Hardware Design EGSM900 1DL/4UL @29.26dBm DCS1800 4DL/1UL @29.2dBm DCS1800 3DL/2UL @29.13dBm DCS1800 2DL/3UL @29.01dBm DCS1800 1DL/4UL @28.86dBm EGSM900 4DL/1UL PCL=8 @27.1dBm EGSM900 3DL/2UL PCL=8 @27.16dBm EGSM900 2DL/3UL PCL=8 @26.91dBm EGSM900 1DL/4UL PCL=8 @26.12dBm EDGE data transfer DCS1800 4DL/1UL PCL=2 @25.54dBm DCS1800 3DL/2UL PCL=2 @25.68dBm...
  • Page 68 LTE Standard Module Series EG91 Hardware Design WCDMA B1 CH10700 @23.06dBm WCDMA voice call WCDMA B8 CH3012 @23.45dBm Table 33: EG91-NA Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=64 (USB suspended) Sleep state WCDMA PF=512 (USB disconnected) LTE-FDD PF=64 (USB disconnected)
  • Page 69 LTE Standard Module Series EG91 Hardware Design LTE-FDD B5 CH2525 @23.39 dBm LTE-FDD B12 CH5060 @23.16 dBm LTE-FDD B13 CH5230 @23.36 dBm WCDMA B2 CH9938 @23.34 dBm WCDMA WCDMA B4 CH1537 @23.47 dBm voice call WCDMA B5 CH4357 @ 23.37 dBm Table 34: EG91-NS Current Consumption Parameter Description...
  • Page 70 LTE Standard Module Series EG91 Hardware Design WCDMA B5 HSDPA CH4407 @23.05 dBm WCDMA B5 HSUPA CH4407 @ 22.91 dBm LTE-FDD B2 CH1100 @23.26 dBm LTE-FDD B4 CH2175 @23.52 dBm LTE-FDD B5 CH2525 @23.51 dBm LTE data LTE-FDD B12 CH5060 @23.39 dBm transfer LTE-FDD B13 CH5230 @23.54 dBm LTE-FDD B25 CH8590@ 23.64 dBm...
  • Page 71 LTE Standard Module Series EG91 Hardware Design Table 36 : EG91-EX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=5 (USB suspended) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=64 (USB suspended) WCDMA PF=512 (USB disconnected)
  • Page 72 LTE Standard Module Series EG91 Hardware Design DCS1800 2DL/3UL @TBD dBm DCS1800 1DL/4UL @TBD dBm EGSM900 4DL/1UL PCL=8 @TBD dBm EGSM900 3DL/2UL PCL=8 @TBD dBm EGSM900 2DL/3UL PCL=8 @TBD dBm EGSM900 1DL/4UL PCL=8 @TBD dBm EDGE data transfer DCS1800 4DL/1UL PCL=2 @TBD dBm DCS1800 3DL/2UL PCL=2 @TBD dBm DCS1800 2DL/3UL PCL=2 @TBD dBm DCS1800 1DL/4UL PCL=2 @TBD dBm...

  • Page 73: Rf Output Power

    LTE Standard Module Series EG91 Hardware Design Table 37: GNSS Current Consumption of EG91 Parameter Description Conditions Typ. Unit Cold start @Passive Antenna Searching Hot Start @Passive Antenna (AT+CFUN=0) VBAT (GNSS) Lost state @Passive Antenna Tracking Open Sky @Passive Antenna (AT+CFUN=0) 6.5.

  • Page 74: Rf Receiving Sensitivity

    LTE Standard Module Series EG91 Hardware Design 6.6. RF Receiving Sensitivity The following tables show the conducted RF receiving sensitivity of EG91 module. Table 39: EG91-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP EGSM900 -108.6dBm -102dBm DCS1800 -109.4 dBm -102dbm WCDMA B1 -109.5dBm...
  • Page 75 LTE Standard Module Series EG91 Hardware Design LTE-FDD B13 (10M) -102.5dBm -93.3dBm -99.2dBm -100dBm Table 41: EG91-NS Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP WCDMA B2 -104.7dBm -110dBm -111dBm -112.5dBm WCDMA B4 -106.7dBm -110dBm -111dBm -112.5dBm WCDMA B5 -104.7dBm -111dBm -111.5dBm...

  • Page 76: Electrostatic Discharge

    LTE Standard Module Series EG91 Hardware Design WCDMA B8 -103.7dBm LTE-FDD B1 (10M) -96.3dBm LTE-FDD B3 (10M) -93.3dBm LTE-FDD B7 (10M) -94.3dBm -93.3dBm LTE-FDD B8 (10M) LTE-FDD B20 (10M) -93.3dBm LTE-FDD B28 (10M) -94.8dBm 6.7. Electrostatic Discharge The module is not protected against electrostatic discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components.
  • Page 77 LTE Standard Module Series EG91 Hardware Design  Do not place components on the opposite side of the PCB area where the module is mounted, in order to facilitate adding of heatsink when necessary.  Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance.
  • Page 78 LTE Standard Module Series EG91 Hardware Design Thermal Pad Thermal Pad EG91 Module Heatsink Heatsink Application Board Shielding Cover Application Board Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) NOTES The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.).

  • Page 79: Mechanical Dimensions

    LTE Standard Module Series EG91 Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm. The tolerances for dimensions without tolerance values are ± 0.05mm. 7.1. Mechanical Dimensions of the Module 25±0.15 2.30±0.2 Figure 41: Module Top and Side Dimensions...
  • Page 80 LTE Standard Module Series EG91 Hardware Design Figure 42: Module Bottom Dimensions (Top View) EG91_Hardware_Design 79 / 93...

  • Page 81: Recommended Footprint

    LTE Standard Module Series EG91 Hardware Design 7.2. Recommended Footprint Figure 43: Recommended Footprint (Top View) NOTE For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. EG91_Hardware_Design 80 / 93...

  • Page 82: Design Effect Drawings Of The Module

    Figure 44: Top View of the Module Figure 45: Bottom View of the Module NOTE These are design effect drawings of EG91 module. For more accurate pictures, please refer to the module that you get from Quectel. EG91_Hardware_Design 81 / 93...

  • Page 83: Storage, Manufacturing And Packaging

    LTE Standard Module Series EG91 Hardware Design Storage, Manufacturing and Packaging 8.1. Storage EG91 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: Mounted within 168 hours at the factory environment of ≤30ºC/60%RH.

  • Page 84: Manufacturing And Soldering

    LTE Standard Module Series EG91 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass.

  • Page 85: Packaging

    LTE Standard Module Series EG91 Hardware Design Max slope 2 to 3°C/sec Reflow time (D: over 220°C) 40 to 60 sec Max temperature 238°C ~ 245°C Cooling down slope 1 to 4°C/sec Reflow Cycle Max reflow cycle 8.3. Packaging EG91 is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application.
  • Page 86 LTE Standard Module Series EG91 Hardware Design 48.5 Cover tape Direction of feed +0.20 44.5 -0.00 Figure 48: Reel Dimensions 1083 Carrier tape Carrier tape unfolding packing module Figure 49: Tape and Reel Directions EG91_Hardware_Design 85 / 93...

  • Page 87: Appendix A References

    LTE Standard Module Series EG91 Hardware Design Appendix A References Table 46: Related Documents Document Name Remark Power Management Application Note Quectel_EC2x&EG9x&EM05_Power_Management_ for EC25, EC21, EC20 R2.0, EC20 Application_Note R2.1, EG95, EG91 and EM05 AT Commands Manual for EG95 and Quectel_EG9x_AT_Commands_Manual EG91 Quectel_EC25&EC21_GNSS_AT_Commands_...
  • Page 88 LTE Standard Module Series EG91 Hardware Design DFOTA Delta Firmware Upgrade Over-The-Air Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GMSK Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate HSPA High Speed Packet Access HSDPA...
  • Page 89 LTE Standard Module Series EG91 Hardware Design Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency RHCP Right Hand Circularly Polarized Receive Short Message Service Time Division Duplexing Transmitting Direction Uplink UMTS Universal Mobile Telecommunications System Unsolicited Result Code...
  • Page 90 LTE Standard Module Series EG91 Hardware Design Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access EG91_Hardware_Design 89 / 93...

  • Page 91: Appendix B Gprs Coding Schemes

    LTE Standard Module Series EG91 Hardware Design Appendix B GPRS Coding Schemes Table 48: Description of Different Coding Schemes Scheme CS-1 CS-2 CS-3 CS-4 Code Rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits Data Rate Kb/s 9.05 13.4 15.6...

  • Page 92: Appendix C Gprs Multi-Slot Classes

    LTE Standard Module Series EG91 Hardware Design Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions.
  • Page 93 LTE Standard Module Series EG91 Hardware Design EG91_Hardware_Design 92 / 93...

  • Page 94: Appendix D Edge Modulation And Coding Schemes

    LTE Standard Module Series EG91 Hardware Design Appendix D EDGE Modulation and Coding Schemes Table 50: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK 13.4kbps 26.8kbps 53.6kbps CS-3:...

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