Dns - Siemens HIPATH 8000 HIPATH 8000 Administrator's Manual

DNS

The phone uses
to perform the following:
• Resolve the IP address of servers that have been configured as names
(DNS A,AAAA records).
• Resolve the IP address of the domain part of users called by URL (DNS
A,AAAA records).
• Identify the location of servers and provide for failover and load balan-
cing (DNS A, AAAA and DNS SRV).
For DNS services to be used on the phone the following must be config-
ured either manually or provided by DHCP:
• DNS Domain Name
• Prim DNS IP addr
• Sec DNS IP addr
If a DNS Domain Name and one or both of the DNS IP addresses
have been configured, then additionally the following host names
can be entered alternatively to the corresponding IP addresses:
• SIP addresses
(server, gateway, registrar)
• Download server IP address or DNS name
• SNMP Trap IP address or DNS name
• SNTP server address or DNS name
• Message Waiting IP address
• Ping page 207
The Primary DNS server IP address must be configured if DNS is to be
used however the secondary server is optional. The purpose of the sec-
ondary server is to allow a backup DNS server to be used in the system
environment to increase system availability and reliability.
The phone can contact several types of server for different reasons (SNTP ,
SNMP , SIP server etc). If a server has been configured by name and not IP
address the phone will provide a DNS lookup to resolve the name to an IP
address when the server needs to be contacted. To optimize network traf-
fic performance the phone caches the result of the normal A and AAAA
record lookups and will not re-issue a request to the DNS server to resolve
that address again until the Time To Live value from the previous lookup
has expired. This mechanism does not currently apply to DNS SRV look-
ups.
If a secondary DNS server has been configured and the primary fails to re-
spond to a request, that request will be re-issued to the secondary DNS
server.
DNS services provided the phones operating system
page 182
page 207
page 212
page 214
Technical Overview
page 183
page 219
page 219
page 203
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