Emc Regulatory Compliance - Motorola MVME2301 Installation And Use Manual

Specifications
B

EMC Regulatory Compliance

B-4
achieved with 10 CFM and 490 LFM flowing over the module. Less
airflow is required to cool the module in environments having
lower maximum ambients. Under more favorable thermal
conditions, it may be possible to operate the module reliably at
higher than 55û C with increased airflow. It is important to note that
there are several factors, in addition to the rated CFM of the air
mover, which determine the actual volume and speed of air flowing
over a module.
The MVME230x was tested in anEMC-compliant chassis and meets
the requirements for Class B equipment. Compliance was achieved
under the following conditions:
Shielded cables on all external I/O ports.
Cable shields connected to chassis ground via metal shell
connectors bonded to a conductive module front panel.
Conductive chassis rails connected to chassis ground. This
provides the path for connecting shields to chassis ground.
Front panel screws properly tightened.
All peripherals were EMC-compliant.
For minimum RF emissions, it is essential that the conditions above
be implemented. Failure to do so could compromise the FCC
compliance of the equipment containing the module.
The MVME230x is a board level product and meant to be used in
standard VME applications. As such, it is the responsibility of the
OEM to meet the regulatory guidelines as determined by its
application.
All external I/O connectors are shielded to aid in meeting EMC
emissions standards. MVME230x boards are tested in an MCG
chassis for EMC compliance.