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1.1.2.6 Back-plane Board
Internal backplane boards separate the front and rear sections of the
AR3016G. The PCB board provides logic level signals and low voltage
power paths. They contain no user-serviceable components.
1.2. AR3016G Components
The AR3016G houses many active components and most of them can be
accessed through either the front or rear panel. The modular design of the
active components facilitates their easy installation and removal. Hot-swap
mechanisms are incorporated to eliminate power surges and signal glitches
that might occur while removing or installing these modules. Each
component is further described below:
1.2.1 LCD Panel
PN: IFT-9273CHandLLCD
The LCD panel shown in Figure 1-6 consists of a 16x2-character LCD
screen with push buttons and LED status indicators. The LCD front panel
provides full access to all RAID configuration settings and monitoring
functions. After powering up the subsystem, the initial screen will show the
subsystem model name. A different name may be assigned for the
subsystem, controller or different logical drive. This will enable easier
identification in a topology with numerous arrays.
AR3016G Components
Cooling modules: The redundant cooling modules provide
ventilation to reduce the temperature within the subsystem. (See
Section 1.2.8.)
Figure 1-6: LCD Panel
AR3016G
1-5
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