Figure 2.12 Illustration Of Heat Spreader Assembly - Data Modul MIO-2261 User Manual

Intel atom n2600/n2800 pico-itx sbc, ddr3, 18/24-bit lvds, vga, 1 gbe, half-size mini pcie, 4 usb, 2 com, smbus, i2c, msata & mioe
Table of Contents

Advertisement

2.3.2.3
Another Thermal Solution - Heat Spreader
MIO-2261 has an optional heat spreader to make whole system more compact.
Using a heat spreader to conduct heat to your chassis can help a lot when system is
extra compact or limited space for heat convection. Here are some guidelines for
heat spreader:
1.
For best heat conduction, the gap between chassis and heat spreader should
be smaller, the smaller the better.
2.
The height of existing heat spreader is 11.2mm (Advantech P/N:
1960055791T001). If you need some other height to fit chassis better, Advan-
tech could customize it for you. (Please contact our sales for details)
3.
There are thermal grease and screws in heat spreader kit, thermal grease helps
conduct better if chassis is quite close to heat spreader. Another suggestion is
to use a thermal pad if the chassis isn't close enough to the heat spreader. (The
gap is suggested to be less than 3mm for better heat conduction)

Figure 2.12 Illustration of heat spreader assembly

Data Modul AG - www.data-modul.com
17
MIO-2261 User Manual

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the MIO-2261 and is the answer not in the manual?

Questions and answers

Subscribe to Our Youtube Channel

Table of Contents