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The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 27
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 27.
Processor Thermal Specifications
Core
Processor
Frequency
Number
(GHz)
E6850
3.00
E6750
2.66
E6550
2.33
E6540
2.33
E6700
2.66
E6600
2.40
E6420
2.13
E6320
1.86
E4600
2.40
E4500
2.20
E4400
2.00
E6400
2.13
E6300
1.86
E4400
2.00
E4300
1.80
X6800
2.93
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the
maximum power that the processor can dissipate.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP.
2.
Therefore, the maximum T
figure and associated table for the allowed combinations of power and T
3. Refer to the "Component Identification Information" section of the Intel
®
Intel
Core™2 Duo Desktop Processor E6000 and E4000 Sequence Specification Update for processor specific
Idle power.
4. 775_VR_CONFIG_06/775_VR_CONFIG_05B guidelines provide a design target for meeting future thermal
requirements.
5. Specification is at 35 °C T
Specification is at 50 °C T
6.
7. These processors have CPUID = 06FDh.
8. These processors have CPUID = 06F2h.
80
instead of the maximum processor power consumption. The Thermal Monitor
Thermal
Extended
Design
HALT
1,2
Power (W)
Power (W)
65.0
8.0
65.0
8.0
65.0
8.0
65.0
8.0
65.0
20.0/12.0
65.0
22.0/12.0
65.0
12.0
65.0
12.0
65.0
8.0
65.0
8.0
65.0
8.0
65.0
22.0/12.0
65.0
22.0/12.0
65.0
12.0
65.0
12.0
75.0
22.0
will vary depending on the TDP of the individual processor. Refer to thermal profile
C
and typical voltage loadline.
C
and typical voltage loadline.
C
Thermal Specifications and Design Considerations
Section
5.2. In all cases the Thermal Monitor and
775_VR_
CONFIG_05B/
3
4
06 Guidance
775_VR_CONFIG_
06
775_VR_CONFIG_
06
775_VR_CONFIG_
06
775_VR_CONFIG_
06
775_VR_CONFIG_
05B
.
C
®
Core™2 Extreme Processor X6800 and
Minimum
Maximum
T
(°C)
T
(°C)
C
C
5
See
5
Table
28,
5
Figure 20
5
5
See
5
Table
29,
5
Figure 21
5
5
See
5
Table
30,
Figure 22
5
5
See
5
Table
31,
5
Figure 23
5
See
5
Table
32,
Figure 24
Datasheet
Notes
5
5
5
5
6
6
6
6
5
5
5, 7
6
6
6, 8
6
6
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