Balanced Technology Extended (BTX) Boxed Processor Specifications
Figure 47.
Boxed Processor TMA Set Points
Table 41.
TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed
Processors
Boxed Processor
TMA Set Point
(ºC)
X ≤ 23
Y = 29
Z ≥ 35.5
NOTES:
1.
Set point variance is approximately ±1°C from Thermal Module Assembly to Thermal
Module Assembly.
If the boxed processor TMA 4-pin connector is connected to a 4-pin motherboard
header and the motherboard is designed with a fan speed controller with PWM output
(see CONTROL in
boxed processor will operate as described in the following paragraphs.
As processor power has increased, the required thermal solutions have generated
increasingly more noise. Intel has added an option to the boxed processor that allows
system integrators to have a quieter system in the most common usage.
The 4-wire PWM controlled fan in the TMA solution provides better control over chassis
acoustics. It allows better granularity of fan speed and lowers overall fan speed than a
voltage-controlled fan. Fan RPM is modulated through the use of an ASIC located on
Datasheet
Increasing Fan
Speed & Noise
Lower Set Point
Lowest Noise Level
X
Internal Chassis Temperature (Degrees C)
Boxed Processor Fan Speed
When the internal chassis temperature is below or equal to this
set point, the fan operates at its lowest speed. Recommended
maximum internal chassis temperature for nominal operating
environment.
When the internal chassis temperature is at this point, the fan
operates between its lowest and highest speeds.
Recommended maximum internal chassis temperature for
worst-case operating environment.
When the internal chassis temperature is above or equal to this
set point, the fan operates at its highest speed.
Table
40) and remote thermal diode measurement capability, the
Higher Set Point
Highest Noise Level
Y
Z
Notes
1
1
119
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