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CORE 2 DUO E6000 - UPDATE 3-2008
INTEL CORE 2 DUO E6000 - UPDATE 3-2008 Manuals
Manuals and User Guides for INTEL CORE 2 DUO E6000 - UPDATE 3-2008. We have
6
INTEL CORE 2 DUO E6000 - UPDATE 3-2008 manuals available for free PDF download: Design Manuallines, Datasheet, Specification, Product Brief
Intel CORE 2 DUO E6000 - UPDATE 3-2008 Design Manuallines (148 pages)
Thermal and Mechanical Design Guidelines
Brand:
Intel
| Category:
Computer Hardware
| Size: 3.94 MB
Table of Contents
Table of Contents
3
Revision History
9
1 Introduction
11
Document Goals and Scope
11
Importance of Thermal Management
11
Document Goals
11
Document Scope
12
References
13
Definition of Terms
13
2 Processor Thermal/Mechanical Information
15
Mechanical Requirements
15
Processor Package
15
Figure 2-1. Package IHS Load Areas
15
Heatsink Attach
17
Thermal Requirements
18
Processor Case Temperature
18
Thermal Profile
19
Figure 2-2. Processor Case Temperature Measurement Location
19
Figure 2-3. Example Thermal Profile
20
Heatsink Design Considerations
21
Tcontrol
21
Heatsink Size
22
Heatsink Mass
22
Package IHS Flatness
23
Thermal Interface Material
23
System Thermal Solution Considerations
24
Chassis Thermal Design Capabilities
24
Improving Chassis Thermal Performance
24
Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions
24
Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions
24
Summary
25
System Integration Considerations
25
3 Thermal Metrology
27
Characterizing Cooling Performance Requirements
27
Example
28
Figure 3-1. Processor Thermal Characterization Parameter Relationships
28
Processor Thermal Solution Performance Assessment
29
Local Ambient Temperature Measurement Guidelines
29
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX
31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink
31
Processor Case Temperature Measurement Guidelines
32
4 Thermal Management Logic and Thermal Monitor Feature
33
Processor Power Dissipation
33
Thermal Monitor Implementation
33
PROCHOT# Signal
34
Thermal Control Circuit
34
Thermal Monitor
34
Thermal Monitor 2
35
Figure 4-1. Thermal Monitor Control
35
Operation and Configuration
36
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering
36
On-Demand Mode
37
System Considerations
37
Operating System and Application Software Considerations
38
THERMTRIP# Signal
38
Cooling System Failure Warning
38
Digital Thermal Sensor
38
Platform Environmental Control Interface (PECI)
39
Figure 4-3. TCONTROL for Digital Thermal Sensor
39
5 Balanced Technology Extended (BTX) Thermal/Mechanical Design Information
41
Overview of the Balanced Technology Extended (BTX) Reference Design
41
Target Heatsink Performance
41
Acoustics
42
Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance
42
Table 5-2. Acoustic Targets
43
Effective Fan Curve
44
Voltage Regulator Thermal Management
45
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion
45
Altitude
46
Reference Heatsink Thermal Validation
46
Environmental Reliability Testing
46
Structural Reliability Testing
46
Table 5-3. VR Airflow Requirements
46
Figure 5-2. Random Vibration PSD
47
Figure 5-3. Shock Acceleration Curve
48
Power Cycling
49
Recommended Bios/Cpu/Memory Test Procedures
49
Material and Recycling Requirements
49
Safety Requirements
50
Geometric Envelope for Intel Reference BTX Thermal Module Assembly
50
Figure 5-4. Intel Type II TMA 65W Reference Design
50
Preload and TMA Stiffness
51
Structural Design Strategy
51
TMA Preload Versus Stiffness
51
Figure 5-5. Upward Board Deflection During Shock
51
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
52
Stiffness
52
Table 5-4. Processor Preload Limits
52
Figure 5-7. Thermal Module Attach Pointes and Duct-To-SRM Interface Features
53
6 ATX Thermal/Mechanical Design Information
55
ATX Reference Design Requirements
55
Figure 6-1. D60188-001Reference Design - Exploded View
56
Figure 6-2. E18764-001 Reference Design - Exploded View
57
Figure 6-3. Bottom View of Copper Core Applied by TC-1996 Grease
57
Validation Results for Reference Design
58
Heatsink Performance
58
Table 6-1. D60188-001 Reference Heatsink Performance
58
Table 6-2. E18764-001 Reference Heatsink Performance
58
Acoustics
59
Table 6-3. Acoustic Results for ATX Reference Heatsink (D60188-001)
59
Table 6-4. Acoustic Results for ATX Reference Heatsink (E18764-001)
59
Altitude
60
Heatsink Thermal Validation
60
Environmental Reliability Testing
61
Structural Reliability Testing
61
Figure 6-4. Random Vibration PSD
61
Figure 6-5. Shock Acceleration Curve
62
Power Cycling
63
Recommended Bios/Cpu/Memory Test Procedures
63
Material and Recycling Requirements
63
Safety Requirements
64
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design
64
Reference Attach Mechanism
65
Structural Design Strategy
65
Figure 6-6. Upward Board Deflection During Shock
65
Mechanical Interface to the Reference Attach Mechanism
66
Figure 6-7. Reference Clip/Heatsink Assembly
66
Figure 6-8. Critical Parameters for Interfacing to Reference Clip
67
Figure 6-9. Critical Core Dimension
67
7 Intel Quiet System Technology (Intel QST)
69
Intel ® QST Algorithm
69
Output Weighting Matrix
70
Proportional-Integral-Derivative (PID)
70
Figure 7-1. Intel ® QST Overview
70
Figure 7-2. PID Controller Fundamentals
71
Board and System Implementation of Intel
72
Qst
72
Figure 7-3. Intel QST Platform Requirements
72
Figure 7-4. Example Acoustic Fan Speed Control Implementation
73
Intel ® QST Configuration and Tuning
74
Fan Hub Thermistor and Intel
74
Qst
74
Figure 7-5. Digital Thermal Sensor and Thermistor
74
Appendix Alga775 Socket Heatsink Loading
75
LGA775 Socket Heatsink Considerations
75
Metric for Heatsink Preload for Atx/Uatx Designs Non-Compliant with Intel Reference Design
75
Heatsink Preload Requirement Limitations
75
Motherboard Deflection Metric Definition
76
Table 7-1. Board Deflection Configuration Definitions
76
Board Deflection Limits
77
Figure 7-6. Board Deflection Definition
77
Board Deflection Metric Implementation Example
78
Additional Considerations
79
Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit
79
Heatsink Selection Guidelines
80
Appendix B Heatsink Clip Load Metrology
81
Overview
81
Test Preparation
81
Heatsink Preparation
81
B.1 Overview
81
B.2 Test Preparation
81
B.2.1 Heatsink Preparation
81
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket - Bottom View
82
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket - Side View
83
Figure 7-10. Preload Test Configuration
83
Typical Test Equipment
84
Test Procedure Examples
84
Table 7-2. Typical Test Equipment
84
Preload Degradation under Bake Conditions
85
Time-Zero, Room Temperature Preload Measurement
85
Appendix C Thermal Interface Management
87
Bond Line Management
87
Interface Material Area
87
Interface Material Performance
87
Case Temperature Reference Metrology
89
Appendix D Case Temperature Reference Metrology
89
Objective and Scope
89
Supporting Test Equipment
89
Figure 7-11. Omega Thermocouple
90
Thermal Calibration and Controls
91
IHS Groove
91
D.4 IHS Groove
91
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 O'clock Exit
92
Figure 7-14. IHS Groove at 6 O'clock Exit on the 775-LAND LGA Package
94
Figure 7-15. IHS Groove at 6 O'clock Exit Orientation Relative to the LGA775
94
Socket
94
Thermocouple Attach Procedure
95
Thermocouple Conditioning and Preparation
95
Figure 7-16. Inspection of Insulation on Thermocouple
95
Thermocouple Attachment to the IHS
96
Figure 7-17. Bending the Tip of the Thermocouple
96
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
96
Figure 7-19. Thermocouple Bead Placement
97
Figure 7-20. Position Bead on the Groove Step
98
Figure 7-21. Detailed Thermocouple Bead Placement
98
Figure 7-22. Third Tape Installation
98
Figure 7-23. Measuring Resistance between Thermocouple and IHS
99
Figure 7-24. Applying Flux to the Thermocouple Bead
100
Figure 7-25. Cutting Solder
100
Solder Process
101
D.5.3 Solder Process
101
Figure 7-26. Positioning Solder on IHS
101
Figure 7-27. Solder Station Setup
102
Figure 7-28. View through Lens at Solder Station
103
Figure 7-29. Moving Solder Back Onto Thermocouple Bead
103
Figure 7-30. Removing Excess Solder
104
Cleaning and Completion of Thermocouple Installation
105
Figure 7-31. Thermocouple Placed into Groove
105
Figure 7-32. Removing Excess Solder
105
Figure 7-33. Filling Groove with Adhesive
106
Figure 7-34. Application of Accelerant
106
Figure 7-35. Removing Excess Adhesive from IHS
107
Figure 7-36. Finished Thermocouple Installation
107
Thermocouple Wire Management
108
Figure 7-37. Thermocouple Wire Management
108
Appendix E Legacy Fan Speed Control
109
Thermal Solution Design
109
Determine Thermistor Set Points
109
Minimum Fan Speed Set Point
110
Figure 7-38. Thermistor Set Points
110
Board and System Implementation
111
Choosing Fan Speed Control Settings
111
Figure 7-39. Example Fan Speed Control Implementation
111
Figure 7-40. Fan Speed Control
112
Figure 7-41. Temperature Range = 5 °C
113
Figure 7-42. Temperature Range = 10 °C
114
Combining Thermistor and On-Die Thermal Sensor Control
115
Interaction of Thermal Profile and T
115
Control
115
Figure 7-43. On-Die Thermal Sensor and Thermistor
115
Table 7-3. FSC Definitions
116
Figure 7-44. FSC Definition Example
117
Table 7-4. ATX FSC Settings
118
Table 7-5. Balanced Technology Extended (BTX) Fan Speed Control Settings
119
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations
121
Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified
122
Figure 7-46. Thermal Sensor Location Illustration
123
Appendix G Fan Performance for Reference Design
125
Table 7-6. Fan Electrical Performance Requirements
125
Figure 7-48. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
128
Figure 7-49. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
128
Figure 7-61. Intel ® D60188-001 Reference Solution Assembly
128
Figure 7-62. Intel ® D60188-001 Reference Solution Heatsink
128
Figure 7-63. Intel ® E18764-001 Reference Solution Assembly
128
Appendix H Mechanical Drawings
128
Figure 7-47. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height
128
Appendix I Intel Enabled Reference Solution Information
146
Reference Design
146
Table 7-8. D60188-001 Reference Thermal Solution Providers
146
Table 7-9. E18764-001 Reference Thermal Solution Providers
147
Table 7-10. Balanced Technology Extended (BTX) Reference Thermal Solution
148
Providers
148
Advertisement
Intel CORE 2 DUO E6000 - UPDATE 3-2008 Datasheet (122 pages)
Intel Core 2 Extreme Processor X6800Δ and Intel Core 2 Duo Desktop Processor E6000Δ and E4000Δ Sequences
Brand:
Intel
| Category:
Computer Hardware
| Size: 1.96 MB
Table of Contents
Table of Contents
3
Revision History
7
Introduction
11
Core™2 Duo Desktop Processors
11
Terminology
12
Processor Terminology
12
Core™2 Duo Desktop Processor
12
References
14
Reference Documents
14
Electrical Specifications
15
Power and Ground Lands
15
Decoupling Guidelines
15
VCC Decoupling
15
Vtt Decoupling
15
Voltage Identification
16
FSB Decoupling
16
Voltage Identification Definition
17
Market Segment Identification (MSID)
18
Reserved, Unused, and TESTHI Signals
18
Market Segment Selection Truth Table for MSID[1:0]
18
Voltage and Current Specification
19
Absolute Maximum and Minimum Ratings
19
Absolute Maximum and Minimum Ratings
20
DC Voltage and Current Specification
20
Voltage and Current Specifications
20
VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache
23
CC Static and Transient Tolerance for Processors with 4 MB L2 Cache
23
V Static and Transient Tolerance for Processors with 2 MB L2 Cache
24
VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache
25
VCC
25
CC Static and Transient Tolerance for Processors with 2 MB L2 Cache
25
Signaling Specifications
26
Die Voltage Validation
26
VCC
26
FSB Signal Groups
27
CMOS and Open Drain Signals
28
Signal Characteristics
28
Signal Reference Voltages
28
Processor DC Specifications
29
GTL+ Signal Group DC Specifications
29
Open Drain and TAP Output Signal Group DC Specifications
29
GTL+ Front Side Bus Specifications
30
CMOS Signal Group DC Specifications
30
GTL+ Bus Voltage Definitions
30
Clock Specifications
31
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
31
FSB Frequency Select Signals (BSEL[2:0])
31
Core Frequency to FSB Multiplier Configuration
31
Phase Lock Loop (PLL) and Filter
32
BCLK[1:0] Specifications (CK505 Based Platforms)
32
BSEL[2:0] Frequency Table for BCLK[1:0]
32
Front Side Bus Differential BCLK Specifications
32
Differential Clock Waveform
33
Differential Clock Crosspoint Specification
33
Differential Measurements
33
BCLK[1:0] Specifications (CK410 Based Platforms)
34
Differential Clock Crosspoint Specification
34
Front Side Bus Differential BCLK Specifications
34
PECI DC Specifications
35
PECI DC Electrical Limits
35
Package Mechanical Specifications
37
Package Mechanical Drawing
37
Processor Package Assembly Sketch
37
Processor Package Drawing Sheet 3 of 3
40
Processor Component Keep-Out Zones
41
Package Loading Specifications
41
Package Handling Guidelines
41
Processor Loading Specifications
41
Package Insertion Specifications
42
Processor Mass Specification
42
Processor Materials
42
Processor Markings
42
Processor Top-Side Markings Example for the Intel
42
Processor Top-Side Markings Example for the Intel
43
Processor Land Coordinates
45
Processor Land Coordinates and Quadrants (Top View)
45
Land Listing and Signal Descriptions
47
Processor Land Assignments
47
Land-Out Diagram (Top View - Left Side)
48
Land-Out Diagram (Top View - Right Side)
49
Alphabetical Land Assignments
50
Numerical Land Assignment
60
Alphabetical Signals Reference
70
Signal Description (Sheet 1 of 9)
70
Thermal Specifications and Design Considerations
79
Processor Thermal Specifications
79
Thermal Specifications
79
Processor Thermal Specifications
80
Thermal Profile
81
MB L2 Cache)
82
Thermal Profile
82
Thermal Profile
83
MB L2 Cache)
83
Thermal Profile
84
Thermal Profile
85
Thermal Metrology
86
Processor Thermal Features
86
Thermal Monitor
86
Thermal Monitor 2
87
On-Demand Mode
88
Thermal Monitor 2 Frequency and Voltage Ordering
88
PROCHOT# Signal
89
THERMTRIP# Signal
89
Thermal Diode
90
Thermal "Diode" Parameters Using Diode Model
90
Thermal "Diode" Parameters Using Transistor Model
91
Thermal Diode Interface
91
Platform Environment Control Interface (PECI)
92
Introduction
92
Key Difference with Legacy Diode-Based Thermal Management
92
Conceptual Fan Control on PECI-Based Platforms
93
Conceptual Fan Control on Thermal Diode-Based Platforms
93
PECI Specifications
94
PECI Command Support
94
PECI Device Address
94
PECI Fault Handling Requirements
94
PECI Gettemp0() Error Code Support
94
Gettemp0() Error Codes
94
Features
95
Power-On Configuration Options
95
Clock Control and Low Power States
95
Power-On Configuration Option Signals
95
Normal State
96
HALT and Extended HALT Powerdown States
96
HALT Powerdown State
96
Processor Low Power State Machine
96
Extended HALT Powerdown State
97
Stop Grant and Extended Stop Grant States
97
Stop Grant State
97
Extended HALT Snoop State, Extended Stop Grant Snoop State
98
Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State
98
Extended Stop Grant State
98
HALT Snoop State, Stop Grant Snoop State
98
Enhanced Intel Speedstep Technology
98
Boxed Processor Specifications
101
Mechanical Representation of the Boxed Processor
101
Mechanical Specifications
102
Boxed Processor Cooling Solution Dimensions
102
Space Requirements for the Boxed Processor (Side View)
102
Space Requirements for the Boxed Processor (Top View)
102
Boxed Processor Fan Heatsink Weight
103
Electrical Requirements
103
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
103
Fan Heatsink Power Supply
103
Space Requirements for the Boxed Processor (Overall View)
103
Boxed Processor Fan Heatsink Power Cable Connector Description
104
Fan Heatsink Power and Signal Specifications
104
Thermal Specifications
105
Boxed Processor Cooling Requirements
105
Baseboard Power Header Placement Relative to Processor Socket
105
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
106
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
106
Fan Speed Control Operation (Intel Core2 Extreme Processor X6800 Only)
107
Fan Speed Control Operation (Intel Core2 Duo Desktop Processor E6000 and E4000 Sequences Only)
107
Boxed Processor Fan Heatsink Set Points
108
Fan Heatsink Power and Signal Specifications
108
Balanced Technology Extended (BTX) Boxed Processor Specifications
111
Mechanical Representation of the Boxed Processor with a Type I TMA
111
Mechanical Specifications
112
Cooling Solution Dimensions
112
Mechanical Representation of the Boxed Processor with a Type II TMA
112
Requirements for the Balanced Technology Extended (BTX) Type I Keep-Out Volumes
113
Boxed Processor Thermal Module Assembly Weight
114
Requirements for the Balanced Technology Extended (BTX) Type II Keep-Out Volume
114
Boxed Processor Support and Retention Module (SRM)
115
Assembly Stack Including the Support and Retention Module
115
Electrical Requirements
116
Thermal Module Assembly Power Supply
116
Boxed Processor TMA Power Cable Connector Description
116
Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)
117
TMA Power and Signal Specifications
117
Thermal Specifications
118
Boxed Processor Cooling Requirements
118
Variable Speed Fan
118
Boxed Processor TMA Set Points
119
TMA Set Points for 3-Wire Operation of BTX Type I and Type II Boxed Processors
119
Debug Tools Specifications
121
Logic Analyzer Interface (LAI)
121
Mechanical Considerations
121
Electrical Considerations
121
INTEL CORE 2 DUO E6000 - UPDATE 3-2008 Datasheet (118 pages)
Brand:
INTEL
| Category:
Computer Hardware
| Size: 1.81 MB
Table of Contents
Table of Contents
3
Revision History
7
Core™2 Duo Desktop
9
Introduction
11
Terminology
12
Processor Terminology
12
References
14
Reference Documents
14
Electrical Specifications
15
Power and Ground Lands
15
Decoupling Guidelines
15
VCC Decoupling
15
Vtt Decoupling
15
FSB Decoupling
16
Voltage Identification
16
Voltage Identification Definition
17
Market Segment Identification (MSID)
18
Reserved, Unused, and TESTHI Signals
18
Market Segment Selection Truth Table for MSID[1:0]
18
Voltage and Current Specification
19
Absolute Maximum and Minimum Ratings
19
DC Voltage and Current Specification
20
Voltage and Current Specifications
20
VCC Static and Transient Tolerance
23
VCC
23
Die Voltage Validation
24
VCC Overshoot
24
Signaling Specifications
25
FSB Signal Groups
25
Signal Characteristics
26
Signal Reference Voltages
26
CMOS and Open Drain Signals
27
Processor DC Specifications
27
GTL+ Signal Group DC Specifications
27
Open Drain and TAP Output Signal Group DC Specifications
27
GTL+ Front Side Bus Specifications
28
CMOS Signal Group DC Specifications
28
GTL+ Bus Voltage Definitions
28
Clock Specifications
29
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
29
FSB Frequency Select Signals (BSEL[2:0])
29
Core Frequency to FSB Multiplier Configuration
29
Phase Lock Loop (PLL) and Filter
30
BCLK[1:0] Specifications (CK505 Based Platforms)
30
BSEL[2:0] Frequency Table for BCLK[1:0]
30
Front Side Bus Differential BCLK Specifications
30
Differential Clock Waveform
31
Differential Clock Crosspoint Specification
31
Differential Measurements
31
BCLK[1:0] Specifications (CK410 Based Platforms)
32
Differential Clock Crosspoint Specification
32
PECI DC Specifications
33
PECI DC Electrical Limits
33
Package Mechanical Specifications
35
Package Mechanical Drawing
35
Processor Package Assembly Sketch
35
Processor Package Drawing Sheet 1 of 3
36
Processor Package Drawing Sheet 2 of 3
37
Processor Package Drawing Sheet 3 of 3
38
Processor Component Keep-Out Zones
39
Package Loading Specifications
39
Package Handling Guidelines
39
Processor Loading Specifications
39
Package Insertion Specifications
40
Processor Mass Specification
40
Processor Materials
40
Processor Markings
40
Processor Top-Side Markings Example for the Intel
40
Processor E6000 Series with 4 MB L2 Cache with 1333 Mhz FSB
40
Core™2 Duo Desktop
41
Processor Top-Side Markings Example for the Intel
41
Processors E6000 Series with 4 MB L2 Cache with 1066 Mhz FSB
41
Processors E6000 Series with 2 MB L2 Cache
41
Processors E4000 Series with 2 MB L2 Cache
42
Processor Land Coordinates
43
Processor Land Coordinates and Quadrants (Top View)
43
Land Listing and Signal Descriptions
45
Processor Land Assignments
45
Land-Out Diagram (Top View - Left Side)
46
Land-Out Diagram (Top View - Right Side)
47
Alphabetical Land Assignments
48
Numerical Land Assignment
58
VCC CC Static and Transient Tolerance
62
Alphabetical Signals Reference
68
Signal Description (Sheet 1 of 9)
68
Thermal Specifications and Design Considerations
77
Processor Thermal Specifications
77
Thermal Specifications
77
Thermal Profile 1
79
Thermal Profile 2
80
Thermal Profile 4
82
Thermal Profile 5
83
Thermal Metrology
84
Processor Thermal Features
84
Thermal Monitor
84
Thermal Monitor 2
85
On-Demand Mode
86
Thermal Monitor 2 Frequency and Voltage Ordering
86
PROCHOT# Signal
87
THERMTRIP# Signal
87
Thermal Diode
88
Thermal "Diode" Parameters Using Diode Model
88
Thermal "Diode" Parameters Using Transistor Model
89
Thermal Diode Interface
89
Platform Environment Control Interface (PECI)
90
Introduction
90
Key Difference with Legacy Diode-Based Thermal Management
90
Processor PECI Topology
90
Conceptual Fan Control on PECI-Based Platforms
91
Conceptual Fan Control on Thermal Diode-Based Platforms
91
PECI Specifications
92
PECI Command Support
92
PECI Device Address
92
PECI Fault Handling Requirements
92
PECI Gettemp0() Error Code Support
92
Gettemp0() Error Codes
92
Features
93
Power-On Configuration Options
93
Clock Control and Low Power States
93
Power-On Configuration Option Signals
93
Normal State
94
HALT and Extended HALT Powerdown States
94
HALT Powerdown State
94
Processor Low Power State Machine
94
Extended HALT Powerdown State
95
Stop Grant and Extended Stop Grant States
95
Stop Grant State
95
Extended Stop Grant State
96
HALT Snoop State, Stop Grant Snoop State
96
State, and Stop Grant Snoop State
96
Enhanced Intel Speedstep Technology
96
Extended HALT Snoop State, Extended Stop Grant Snoop State
96
Boxed Processor Specifications
99
Mechanical Representation of the Boxed Processor
99
Mechanical Specifications
100
Boxed Processor Cooling Solution Dimensions
100
Space Requirements for the Boxed Processor (Side View)
100
Space Requirements for the Boxed Processor (Top View)
100
Boxed Processor Fan Heatsink Weight
101
Electrical Requirements
101
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
101
Fan Heatsink Power Supply
101
Space Requirements for the Boxed Processor (Overall View)
101
Boxed Processor Fan Heatsink Power Cable Connector Description
102
Fan Heatsink Power and Signal Specifications
102
Thermal Specifications
103
Boxed Processor Cooling Requirements
103
Baseboard Power Header Placement Relative to Processor Socket
103
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
104
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
104
Fan Speed Control Operation (Intel Core2 Extreme Processor X6800 Only)
105
Fan Speed Control Operation (Intel Core2 Duo Desktop Processor E6000 and E4000 Series Only)
105
Core2 Duo Desktop
105
Boxed Processor Fan Heatsink Set Points
105
Fan Heatsink Power and Signal Specifications
106
Balanced Technology Extended (BTX) Boxed Processor Specifications
107
Mechanical Representation of the Boxed Processor with a Type I TMA
107
Mechanical Specifications
108
Cooling Solution Dimensions
108
Mechanical Representation of the Boxed Processor with a Type II TMA
108
Requirements for the Balanced Technology Extended (BTX) Type I Keep-Out
109
Boxed Processor Thermal Module Assembly Weight
110
Requirements for the Balanced Technology Extended (BTX) Type II Keep-Out
110
Boxed Processor Support and Retention Module (SRM)
111
Assembly Stack Including the Support and Retention Module
111
Electrical Requirements
112
Thermal Module Assembly Power Supply
112
Boxed Processor TMA Power Cable Connector Description
112
Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)
113
TMA Power and Signal Specifications
113
Thermal Specifications
114
Boxed Processor Cooling Requirements
114
Variable Speed Fan
114
Boxed Processor TMA Set Points
115
TMA Set Points for 3-Wire Operation of BTX Type I and Type II Boxed Processors
115
Debug Tools Specifications
117
Logic Analyzer Interface (LAI)
117
Mechanical Considerations
117
Electrical Considerations
117
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INTEL CORE 2 DUO E6000 - UPDATE 3-2008 Specification (72 pages)
Brand:
INTEL
| Category:
Computer Hardware
| Size: 0.53 MB
Table of Contents
Table of Contents
3
Contents
3
Revision History
4
Preface
6
Summary Tables of Changes
8
Identification Information
17
Component Identification Information
20
Errata
23
Specification Changes
70
Specification Clarifications
71
Documentation Changes
72
Intel CORE 2 DUO E6000 - UPDATE 3-2008 Specification (71 pages)
Specification Update
Brand:
Intel
| Category:
Computer Hardware
| Size: 0.53 MB
Table of Contents
Table of Contents
3
Contents
3
Revision History
4
Preface
6
Summary Tables of Changes
8
Identification Information
17
Component Identification Information
20
Errata
23
Software Interrupts
49
Specification Changes
69
Specification Clarifications
70
Documentation Changes
71
Intel CORE 2 DUO E6000 - UPDATE 3-2008 Product Brief (2 pages)
Intel Core2 Duo Desktop processors Product Brief
Brand:
Intel
| Category:
Computer Hardware
| Size: 0.79 MB
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