Electrical Specifications
Table 10.
Voltage and Current Specifications for the Dual-Core, Low-Voltage SFF
Processor
Symbol
I
Deep Sleep
CC
I
HFM
DSLP
SuperLFM
I
I
Deeper Sleep
DPRSLP
CC
I
I
Intel Enhanced Deeper Sleep
DC4
CC
I
I
Deep Power Down Technology State (C6)
DPWDN
CC
V
Power Supply Current Slew Rate at Processor
CC
dI
CC/
DT
Package Pin
I
I
for V
CCA
CC
CCA
I
for V
CC
CCP
I
CCP
for V
I
CC
CCP
NOTES:
1.
Each processor is programmed with a maximum valid voltage identification value (VID), which is set at
manufacturing and cannot be altered. Individual maximum VID values are calibrated during manufacturing
such that two processors at the same frequency may have different settings within the VID range. Note
that this differs from the VID employed by the processor during a power management event (Intel Thermal
Monitor 2, Enhanced Intel SpeedStep Technology, or Enhanced Halt State).
2.
The voltage specifications are assumed to be measured across V
a 100-MHz bandwidth oscilloscope, 1.5-pF maximum probe capacitance, and 1-MΩ minimum impedance.
The maximum length of ground wire on the probe should be less than 5 mm. Ensure external noise from
the system is not coupled in the scope probe.
3.
Specified at 105 °C T
4.
Specified at the nominal V
5.
Measured at the bulk capacitors on the motherboard.
6.
V
tolerance shown in
CC,BOOT
7.
Based on simulations and averaged over the duration of any change in current. Specified by design/
characterization at nominal V
8.
This is a power-up peak current specification that is applicable when V
9.
This is a steady-state I
10.
Processor I
requirements in Intel Dynamic Acceleration Technology mode are lesser than I
CC
11.
The maximum delta between Intel Enhanced Deeper Sleep and LFM on the processor will be lesser than or
equal to 300 mV.
12.
Instantaneous current I
current will be less than maximum specified I
current levels described herein.
Datasheet
Parameter
Supply
Supply before V
Stable
CC
Supply after V
Stable
CC
.
J
.
CC
Figure 7
and
Figure
. Not 100% tested.
CC
current specification that is applicable when both V
CC
of 36 A has to be sustained for short time (t
CC_CORE_INST
Min
Typ
—
—
—
—
—
—
—
CC_SENSE
8.
CCP
. VR OCP threshold should be high enough to support
CCDES
Max
Unit
—
10.5
A
3, 4, 12
7.5
—
6.5
A
—
5.6
A
—
3.2
A
—
600
mA/µs
—
130
mA
4.5
A
—
2.5
A
and V
pins at socket with
SS_SENSE
is high and V
is low.
CC_CORE
and V
are high.
CCP
CC_CORE
in HFM
CC
) of 35 µs. Average
INST
Notes
3, 4
3, 4
3, 4
7, 9
10
11
39
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