Unified Retention System Support; Figure 31. Unified Retention System And Unified Backplate Assembly - Intel S5500WB12V Specification

Intel® Server Board S5500WB TPS Design and Environmental Specifications
®
Thermal Solution STS100P – Passive 1U/2U heatsink was tested for
Note: The Intel
processors up to and including 95-W TDP (Thermal Design Power). Product order code:
BXSTS100P
9.3.1

Unified Retention System Support

®
The server board complies with the Intel Unified Retention System (URS) and the Unified
Backplate Assembly. The server board ships with a made-up assembly of Independent Loading
Mechanism (ILM) and Unified Backplate at each processor socket.
The URS retention transfers load to the server board via the unified backplate assembly. The
URS spring, captive in the heatsink, provides the necessary compressive load for the thermal
interface material. All components of the URS heatsink solution are captive to the heatsink and
only require a Philips* screwdriver to attach to the unified backplate assembly. See the
following figure for the stacking order of the URS components.
The ILM and unified backplate are removable, allowing for the use of non-Intel heatsink
retention solutions.

Figure 31. Unified Retention System and Unified Backplate Assembly

Revision 1.9 81
Intel order number E53971-008