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- Page 1 ® Intel 945G Express Chipset Graphics and Memory Controller Hub (GMCH) for Embedded Applications Thermal Design Guide August 2005 Order #308643-001...
- Page 2 Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval system, or transmitted in any form or by any means without the express written consent of Intel Corporation.
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Page 3: Table Of Contents
® Intel 945G Express Chipset GMCH Thermal Design Guide Contents Contents Introduction.......................... 5 Scope........................5 Terminology ......................5 Reference Documents....................7 Product Specifications......................8 Package Description....................8 Non-Grid Array Package Ball Placement ..............8 Package Loading Specifications................9 Thermal Specifications ..................... 9 Thermal Design Power (TDP) .................. - Page 4 GMCH Thermal Design Power Specifications............10 Table GMCH Thermal Requirements ................... 14 Table Reference Thermal Solution Environmental Reliability Requirements ...... 18 Table 1U Intel Reference Heat Sink Enabled Suppliers ............19 Revision History Date Revision Description August 2005 Initial release.
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Page 5: Introduction
Scope This document applies only to the implementation of the 945G Express Chipset GMCH in the 1U and larger server form factors. For more information on server system form factors visit, www.ssiforum.org. For information on the desktop computer application of the 945G Express ®... - Page 6 ® Intel 945G Express Chipset GMCH Thermal Design Guide Introduction Term Description mBGA Mini ball grid array. A smaller version of the BGA. Wire bonded package with die encased with a mold encapsulant. GMCH Graphic memory controller hub. The chipset component that contains the processor and memory interface and integrated graphics core.
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Page 7: Reference Documents
LGA775 Socket Mechanical Design Guide Available electronically (see Note) Thin Client Electronic Bay Server Specifications http://www.ssiforum.org Various System Thermal Design Suggestions http://www.formfactors.org NOTE: Contact your Intel field sales representative for the latest revision and order number of this document. Order #308643... -
Page 8: Product Specifications
® The Intel 945G Express Chipset GMCH is available in a 34 mm (1.34 in.) x 34 mm (1.34 in.) Flip Chip Ball Grid Array (FCBGA) package with 1202 solder balls. The die size is currently 9.6 mm (0.378 in.) x 10.6 mm (0.417 in.). A mechanical drawing of the package is shown in Figure 10, Appendix B. -
Page 9: Package Loading Specifications
Thermal Specifications To ensure proper operation and reliability of the 945G Express Chipset GMCH, the temperature must be at or below the maximum value specified in Table 2. System and component level thermal enhancements are required to dissipate the heat generated and maintain the GMCH within specifications. -
Page 10: Methodology
Since the number of applications available today is beyond what Intel can test, only real world high-power applications are tested to predict TDP. The values determined are used to set specific data transfer rates. The projection for TDP assumes GMCH operation at T . -
Page 11: Thermal Metrology
Thermal Metrology Thermal Metrology The system designer must measure temperatures in order to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques of measuring chipset component case temperatures. Case Temperature Measurements To ensure functionality and reliability, the chipset GMCH is specified for proper operation when is maintained at or below the maximum temperature listed in Table 2. -
Page 12: Airflow Characterization
Figure 4 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm (1.0 in.) apart. Locations for both single and paired thermocouples are presented. - Page 13 ® Intel 945G Express Chipset GMCH Thermal Design Guide Thermal Metrology be compatible with chassis layouts due to the proximity of the processor to the GMCH. The user may have to adjust the locations for a specific chassis. Be aware that sensors may need to be aligned perpendicular to the airflow velocity vector or an inaccurate measurement may result.
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Page 14: Reference Thermal Solution
Assuming these boundary conditions are met, the reference thermal solutions will meet the thermal specifications for the 945G GMCH. Table 4 shows the required thermal performance for the GMCH. The thermal designer must carefully select the location to measure airflow to get a representative sampling. -
Page 15: Figure 5 Thermal Solution Performance
® Intel 945G Express Chipset GMCH Thermal Design Guide Reference Thermal Solution Figure 5 Thermal Solution Performance Sink-to-Ambient Case-to-Ambient Airflow (LFM) Figure 6 Typical 1U Server Motherboard Component Placement Caution: Heat sink orientation alone does not guarantee that 200 lfm (1.02 m/s) airflow speed will be achieved. -
Page 16: Mechanical Design Envelope
(Honeywell* PCM45F) is pre-applied to the heat sink bottom over an area which contacts the package die. ® For information on the reference solution for the ATX and BTX form factors refer to the Intel 945G/945P Express Chipset Family Thermal and Mechanical Design Guidelines. Figure 7 1U GMCH Heat Sink 4.3.1... -
Page 17: Thermal Interface Material (Tim)
TIM and application process must be properly designed. The 945G GMCH reference thermal solution uses Honeywell* PCM45F. Alternative materials can be used at the user’s discretion. Regardless, the entire heat sink assembly, including the heat sink, TIM, attach method must be validated for specific applications. -
Page 18: Environmental Reliability Requirements
® Intel 945G Express Chipset GMCH Thermal Design Guide Reference Thermal Solution Figure 9 GMCH Retention Mechanism Component Keep-out Zone 0.070" Component Keepout 0.896 2x 0.060 0.120 0.345 (0.345) 0.225 0.100" Component 0.170 Keepout 1.156 See Detail A (0.165) Detail A 0.100... -
Page 19: Appendix A Enabled Suppliers
408-919-6178 juliaj@foxconn.com Note: These vendors and devices are listed by Intel as a convenience to Intel’s general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice. -
Page 20: Appendix B Mechanical Drawings
® Intel 945G Express Chipset GMCH Thermal Design Guide echanical Drawings Appendix B Mechanical Drawings This appendix contains the following mechanical drawings: Drawing Name Page Number Package Drawing Reference Thermal Solution Assembly 1U Copper Heat Sink Heat Sink Gasket Torsional Heat Sink Attach Clip... -
Page 21: Figure 10 Package Drawing
® Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 1 Package Drawing Order #308643... -
Page 22: Figure 11 Reference Thermal Solution Assembly
® Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 2 Reference Thermal Solution Assembly Order #308643... -
Page 23: Figure 12 1U Copper Heat Sink
® Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 3 1U Copper Heat Sink Order #308643... -
Page 24: Figure 13 Heat Sink Gasket
® Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 4 Heat Sink Gasket Order #308643... -
Page 25: Figure 14 Torsional Heat Sink Attach Clip
® Intel 945G Express Chipset GMCH Thermal Design Guide Mechanical Drawings Figure 5 Torsional Heat Sink Attach Clip Order #308643...