6.1.2
Thermal Metrology
The minimum and maximum case temperatures (T
Table
6-4,
geometric top center of the processor integrated heat spreader (IHS).
illustrates the location where T
detailed guidelines on temperature measurement methodology, refer to the Quad-Core
Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG).
Figure 6-6.
Case Temperature (T
Note:
Figure is not to scale and is for reference only.
6.2
Processor Thermal Features
®
6.2.1
Intel
Quad-Core Intel® Xeon® Processor 5400 Series provides two thermal monitor
features, Intel® Thermal Monitor 1 and Intel® Thermal Monitor 2. The Intel® Thermal
Monitor 1 and Intel® Thermal Monitor 2 must both be enabled in BIOS for the
processor to be operating within specifications. When both are enabled, Intel® Thermal
Monitor 2 will be activated first and Intel® Thermal Monitor 1 will be added if Intel®
Thermal Monitor 2 is not effective.
6.2.1.1
Intel® Thermal Monitor 1
The Intel® Thermal Monitor 1 feature helps control the processor temperature by
activating the Thermal Control Circuit (TCC) when the processor silicon reaches its
maximum operating temperature. The TCC reduces processor power consumption as
90
Table
6-5, and
Table
6-7, and
CASE
) Measurement Location
CASE
Thermal Monitor Features
) are specified in
CASE
Table 6-9
and
Table 6-11
temperature measurements should be made. For
Thermal Specifications
Table
6-2,
are measured at the
Figure 6-6