Intel E5410 - Cpu Xeon Quad Core 2.33Ghz Fsb1333Mhz 12M Lga771 Tray Datasheet page 80

Thermal Specifications
Processor Thermal Features). Systems that implement fan speed control must be
designed to use this data. Systems that do not alter the fan speed only need to
guarantee the case temperature meets the thermal profile specifications.
The Quad-Core Intel® Xeon® Processor X5482, and Quad-Core Intel® Xeon®
Processor E5400 Series, and Quad-Core Intel® Xeon® Processor L5400 Series support
a single Thermal Profile (see Figure 6-1, and Figure 6-3 and Figure 6-4; Table 6-1, and
Table 6-6, and Table 6-8). With this Thermal Profile, it is expected that the Thermal
Control Circuit (TCC) would only be activated for very brief periods of time when
running the most power-intensive applications. Refer to the Quad-Core Intel® Xeon®
Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG) for details on
system thermal solution design, thermal profiles and environmental considerations.
The Quad-Core Intel® Xeon® Processor L5408 supports a Thermal Profile with nominal
and short-term conditions designed to meet NEBS level 3 compliance (see Figure 6-5).
Operation at either thermal profile should result in virtually no TCC activation. Refer to
the Quad-Core Intel® Xeon® Processor L5408 Series in Embedded Applications
Thermal/Mechanical Design Guidelines (TMDG).
The Quad-Core Intel® Xeon® Processor X5400 Series supports a dual Thermal Profile,
either of which can be implemented. Both ensure adherence to the Intel reliability
requirements. Thermal Profile A (see Figure 6-2; Table 6-3) is representative of a
volumetrically unconstrained thermal solution (that is, industry enabled 2U heatsink).
In this scenario, it is expected that the Thermal Control Circuit (TCC) would only be
activated for very brief periods of time when running the most power intensive
applications. Thermal Profile B (see Figure 6-2; Table 6-5) is indicative of a constrained
thermal environment (that is, 1U form factor). Because of the reduced cooling
capability represented by this thermal solution, the probability of TCC activation and
performance loss is increased. Additionally, utilization of a thermal solution that does
not meet Thermal Profile B will violate the thermal specifications and may result in
permanent damage to the processor. Intel has developed these thermal profiles to
allow customers to choose the thermal solution and environmental parameters that
best suit their platform implementation. Refer to the Quad-Core Intel® Xeon®
Processor 5400 Series Thermal/Mechanical Design Guidelines (TMDG) for details on
system thermal solution design, thermal profiles and environmental considerations.
The upper point of the thermal profile consists of the Thermal Design Power (TDP)
defined in Table 6-1 for the Quad-Core Intel® Xeon® Processor X5482, Table 6-3 for
the Quad-Core Intel® Xeon® Processor X5400 Series, Table 6-6 for the Quad-Core
Intel® Xeon® Processor E5400 Series, and Table 6-8 for the Quad-Core Intel® Xeon®
Processor L5400 Series and the associated T values. The lower point of the thermal
CASE
profile is the T at 0 W power (or no power draw)
CASE_MAX
Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 6-2 for the Quad-Core Intel® Xeon® Processor X5482 (C-step) and Quad-Core
Intel® Xeon® Processor X5492, Table 6-4 and Table 6-5 for the Quad-Core Intel®
Xeon® Processor X5400 Series, Table 6-7 for the Quad-Core Intel® Xeon® Processor
E5400 Series and Table 6-9Quad-Core Intel® Xeon® Processor L5400 Series instead of
the maximum processor power consumption. The Thermal Monitor feature is intended
to help protect the processor in the event that an application exceeds the TDP
recommendation for a sustained time period. For more details on this feature, refer to
Section 6.2. To ensure maximum flexibility for future requirements, systems should be
designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower
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