Absolute Maximum Ratings; Order Information; Pin Configuration - Analog Devices Linear ADI Power LTM4681 Manual

LTM4681

ABSOLUTE MAXIMUM RATINGS

(Note 1)
Terminal Voltages:
V (Note 4), SV , I
INnn IN_nn
V , RUNP .................................... –0.3V to 18V
IN_VBIAS
+
(SV – I ), (I
IN_nn IN_nn IN_nn
SWn ............................ −1V to 18V, −5V to 18V Transient
INTV , V ......................................... –0.3V to 6V
CC_nn BIAS
V ........................................................ –0.3V to 3.6V
OUTn
+
V ........................................................ –0.3V to 6V
OSNSn
−
V ..................................................... –0.3V to 0.3V
OSNSn
RUNn, SDA_nn, SCL_nn, ALERT_nn ......... –0.3V to 5.5V
FSWPH_nn_CFG, VOUTn_CFG,
VTRIMn_CFG, ASEL_nn ..................... –0.3V to 2.75V
FAULTn, SYNC_nn, SHARE_CLK_nn,
WP_nn, PGOODn .................................. −0.3V to 3.6V
COMPna, COMPnb .................................... –0.3V to 2.7V
TSNSn ....................................................... –0.3V to 0.8V
n = 0, 1, 2, 3 and nn = 01, 23
V and V are outputs not to be driven.
DD33_nn DD25_nn
Temperatures
Internal Operating Temperature Range
(Notes 2, 13, 16, 17) .......................... –40°C to 125°C
Storage Temperature Range .................. –55°C to 125°C
Peak Solder Reflow Package Body Temperature ... 245°C

ORDER INFORMATION

PART NUMBER PAD OR BALL FINISH
LTM4681EY#PBF
SAC305 (RoHS)
LTM4681IY#PBF
LTM4681IY SnPb (63/37)
• Contact the factory for parts specified with wider operating temperature
ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.
4
+ −
, I ,
IN_nn IN_nn
+ −
– I ) ....... –0.3V to 0.3V
IN_nn
PART MARKING*
DEVICE
LTM4681Y
LTM4681Y
LTM4681Y
For more information

PIN CONFIGURATION

1 2
VTRIM1_CFG
V
DD25_01
SW0
SHARE_CLK_01
VTRIM0_CFG
V
DD33_01
–
V
OSNS1
COMP1b
+
V
OSNS1
COMP1a
SW1
PGOOD1
PGOOD0
SV
IN_01
INTV
CC_01
V
IN_VBIAS
+
V
OSNS2
SW2
–
V
OSNS2
COMP2a
COMP2b
TSNS2
SDA_23
SYNC_23
SW3
ALERT_23
SCL_23
RUN3
T = 125°C, θ
JMAX
NOTE:
1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS, WEIGHT = 10g.
2) θ VALUE IS OBTAINED WITH DEMO BOARD.
JA
3) REFER TO PAGES 71, 75, 76 FOR LAB MEASUREMENT AND DERATING INFORMATION.
PACKAGE
FINISH CODE TYPE
e1
BGA
e0
• Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures
• LGA and BGA Package and Tray Drawings
www.analog.com
TOP VIEW
3 4 5 6 7 8 9 10 11 12 13 14 15
V
GND
OUT0
SDA_01
V
SCL_01
IN01
WP_01
V
OUT1
GND
GND
V
RUNP
BIAS
–
IN_23
+
V
V
IN_23
IN23 OUT2
TSNS3
RUN2
V
GND
OUT3
BGA PACKAGE
330-LEAD (15mm × 22mm × 8.17mm)
= 2.8°C/W, θ = 1.4°C/W, θ = 4.73°C/W
JCtop JCbottom JA
MSL TEMPERATURE RANGE
RATING (SEE NOTE 2)
4 –40°C to 125°C
A
B
ALERT_01
C
SYNC_01
D
TSNS1
TSNS0
E
SGND01
F
G
COMP0a
COMP0b
H
–
V
OSNS0
+
IN_01
J
+
V
OSNS0
–
IN_01
K
L
M
N
INTV
CC_23
SV
IN_23
P
R
+
V
OSNS3
PGOOD2
T
–
V
OSNS3
PGOOD3
U
SGND23
V
COMP3a
FAULT2
W
COMP3b
FAULT3
Y
WP_23
V
DD33_23
AA
AB
Rev. A