Absolute Maximum Ratings; Thermal Resistance; Esd Caution - Analog Devices ADP50460008 Owner's Manual

ADP50460008

ABSOLUTE MAXIMUM RATINGS

Table 7.
Parameter
VBATT to GND
VREGO to GND
VDD to GND
VDDIO to GND
PVIN2 to PGND2
PVIN3 to PGND3
PVIN4 to PGND4
PVIN6 to PGND6
PVIN7 to PGND7
VIN5 to GND
VIN8 to GND
VOUT1 to PGND1
VOUT2 to PGND2
VOUT5 to GND
PGNDx to GND
SW1 to PGND1
SWA2 to PGND2
SWB2 to PGND2
SW3 to PGND3
SW4 to PGND4
SW6 to PGND6
SW7 to PGND7
OVP7 to GND
LSTR7 to BLGND7
ISET7 to GND
BLGND7 to GND
EN to GND
I to I
VIN5 VOUT5
FB3 to GND
FB4 to GND
FB6 to GND
BU3INT to RTCGND
XIN and XOUT to RTCGND
CLKO to GND
SCL and SDA to GND
POCO to GND
ALMO to GND
TEST1 to GND
TEST2 to GND
TEST3 to GND
TEST4 to GND
Storage Temperature Range
Operating Ambient Temerature Range
Operating Junction Temperature Range
1
To guarantee reliability, it is recommended that the ADP5046 not be operated
with an average T of >90°C for an extended period of time.
J
Rating
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +3.6 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3V to VIN5 + 0.3 V
−0.3 V to +0.3 V
−0.5 V to +6.5 V
−2.0 V to +6.5 V
−0.5 V to +6.5 V
−2.0 V to +6.5 V
−2.0 V to +6.5 V
−2.0 V to +6.5 V
−0.5 V to +27 V
−0.3 V to +27 V
−0.3 V to +6.5 V
−0.3 V to VDD + 0.3 V
−0.3 V to +0.3 V
−0.3 V to +6.5 V
1 A
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +6.5 V
−0.3 V to +3.6 V
−0.3 V to BU3INT + 0.3 V
−0.3 V to VREGO + 0.3 V
−0.3 V to VDDIO + 0.3 V
−0.3 V to VREGO + 0.3 V
−0.3 V to VREGO + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−65°C to +150°C
−25°C to +85°C
1
−25°C to +125°C
Rev. Sp0 | Page 10 of 60
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

THERMAL RESISTANCE

θ is specified for worst-case conditions; that is, a device
JA
soldered in a circuit board for surface-mount packages. Note
that actual θ depends on the application environment.
JA
Table 8. Thermal Resistance
PCB Type 1
1S0P
2S2P
1
PCB type conforms to JEDEC51-9.
2
1.25 W power dissipation.

ESD CAUTION

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θ 2 Unit
JA
60.6 °C/W
26.9 °C/W