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Quectel RM520N-GL Hardware Design

Quectel RM520N-GL Hardware Design

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RM520N-GL
Hardware Design
5G Module Series
Version: 1.0.0
Date: 2022-03-22
Status: Preliminary
RM520N-GL_Hardware_Design
1 / 84

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Summary of Contents for Quectel RM520N-GL

  • Page 1 RM520N-GL Hardware Design 5G Module Series Version: 1.0.0 Date: 2022-03-22 Status: Preliminary RM520N-GL_Hardware_Design 1 / 84...
  • Page 2 5G Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    5G Module Series About the Document Revision History Version Date Author Description Wynna SHU/ 2021-11-25 Creation of the document Simon WANG Juriyi XIE/ 1.0.0 2021-03-22 Wynna SHU/ Preliminary Simon WANG RM520N-GL_Hardware_Design 4 / 84...

  • Page 6: Table Of Contents

    5G Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................8 Figure Index ............................... 10 Introduction ............................11 1.1. Introduction ..........................11 1.2. Reference Standard ........................11 1.3. Special Mark ..........................12 Product Concept ..........................
  • Page 7 5G Module Series 4.3.1. PCIe Operating Mode ....................46 4.3.2. Pin Definition of PCIe ..................... 47 4.3.3. Reference Design for PCIe .................... 48 4.4. Control and Indication Interfaces ....................50 4.4.1. W_DISABLE1# ....................... 50 4.4.2. W_DISABLE2#* ......................51 4.4.3. LED_WWAN#......................... 52 4.4.4.
  • Page 8 5G Module Series 7.2. Top and Bottom Views ......................76 7.3. M.2 Connector ........................... 76 7.4. Packaging ..........................76 7.4.1. Blister Tray ........................76 7.4.2. Packaging Process ......................78 Appendix A References ........................79 Appendix B Operating Frequency....................82 RM520N-GL_Hardware_Design 7 / 84...
  • Page 9 Table 27: Configuration Pins List of M.2 Specification ................55 Table 28: Configuration Pins of the Module ....................55 Table 29: RM520N-GL Pin Definition of Antenna Interfaces ..............56 Table 30: RM520N-GL Conducted Receiving Sensitivity (Unit: dBm) ............57 Table 31: Cellular Output Power ........................ 60 Table 32: GNSS Frequency ........................
  • Page 10 5G Module Series Table 42: Electrostatic Discharge Characteristics (Temperature: 25 º C, Humidity: 40 %) ....... 71 Table 43: Absolute Maximum Ratings ....................... 73 Table 44: Operating and Storage Temperatures ..................74 Table 45: Related Documents ........................79 Table 46: Terms and Abbreviations ......................79 Table 47: Operating Frequencies (5G) ......................
  • Page 11 Figure 34: Placement and Fixing of the Heatsink ..................73 Figure 35: Mechanical Dimensions of the Module (Unit: mm) ..............75 Figure 36: RM520N-GL Top and Bottom Views ..................76 Figure 37: Blister Tray Dimension Drawing ....................77 Figure 38: Packaging Process ........................78...

  • Page 12: Introduction

    5G Module Series Introduction 1.1. Introduction The document introduces RM520N-GL module and describes its air interface and hardware interfaces which are connected to your applications. This document helps you quickly understand the interface specifications, electrical and mechanical details, as well as other related information of the module. To facilitate its application in different fields, reference design is also provided for reference.

  • Page 13: Special Mark

    (*) after a model indicates that the sample of the model is currently unavailable. CE Statement Regulatory Conformance Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [RM520N-GL] is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com...
  • Page 14 5G Module Series FCC ID: XMR2023RM520NGL 4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, maximum antenna gain (including cable loss) must not exceed: radiation, maximum antenna gain （dBi） （dBi） (including cable loss) must not exceed: FCC Max Antenna Gain IC Max Antenna Gain Operating Band...
  • Page 15 5G Module Series NR Band n41 MIMO 3.00 3.00 NR Band n48/n48 MIMO (3550-3700) -2.00 NR Band n48/n48 MIMO (3550-3650) 5.00 NR Band n48/n48 MIMO (3650-3700) 5.00 NR Band n66 5.00 5.00 NR Band n70 5.00 NR Band n71 8.48 11.92 NR Band n77 2.00...
  • Page 16 5G Module Series Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the equipment. To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring that the after the module is installed and operational the host continues to be compliant with the Part 15B...

  • Page 17: Product Concept

    RM520N-GL is a 5G NR/LTE-FDD/LTE-TDD/WCDMA wireless communication module with receive diversity. It provides data connectivity on 5G NR SA and NSA, LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. RM520N-GL is standard M.2 Key-B WWAN module. For more details, see PCI Express M.2 Specification Revision 4.0, Version 1.0...

  • Page 18: Key Features

    Smart TV ⚫ Outdoor live devices ⚫ Wireless router and switch ⚫ Other wireless terminal devices 2.2. Key Features Table 3: Key Features of RM520N-GL Feature Details Function Interface PCI Express M.2 Interface ⚫ Supply voltage: 3.135–4.4 V Power Supply ⚫...
  • Page 19 Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 AT Commands ⚫ Quectel enhanced AT commands HPUE is only for single carrier. 5G NR FDD bands only support 15 kHz SCS, and NR TDD bands only support 30 kHz SCS.

  • Page 20: Evaluation Board

    All hardware components are fully compliant with EU RoHS directive 2.3. Evaluation Board To help you develop applications conveniently with the module, Quectel supplies an evaluation board (5G-M2 EVB), a USB to RS-232 converter cable, a USB type-C cable, antennas, and other peripherals to control or test the module.

  • Page 21: Functional Diagram

    5G Module Series 2.4. Functional Diagram The following figure shows a block diagram of RM520N-GL. ⚫ Power management ⚫ Baseband ⚫ LPDDR4X SDRAM + NAND Flash ⚫ Radio frequency ⚫ M.2 Key-B interface Figure 1: Functional Diagram 2.5. Pin Assignment The following figure shows the pin assignment of the module.

  • Page 22: Pin Description

    5G Module Series PIN75 PIN74 PIN11 PIN10 PIN2 PIN1 Figure 2: Pin Assignment NOTE Pin 68 is to be multiplexed into AP2SDX_STATUS. 、 Pin 64 is to be multiplexed into SDX2AP_STATUS. Pin 62 is to be multiplexed into SDX2AP_E911_STATUS. 2.6. Pin Description RM520N-GL_Hardware_Design 21 / 84...
  • Page 23 5G Module Series Table 4: Definition of I/O Parameters Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Pull Up Pull Down The following table shows the pin definition and description of the module. Table 5: Pin Description Pin Name Description...
  • Page 24 5G Module Series USB_DP USB differential data (+) Airplane mode control. W_DISABLE1# 1.8/3.3 V Active LOW USB_DM USB differential data (-) RF status indication LED_WWAN# LED. Active LOW Ground Notch Notch Notch Notch Notch Notch Notch Notch Notch Notch Notch Notch Notch Notch...
  • Page 25 5G Module Series USIM1_VDD USIM1_RST DO, PD (U)SIM1 card reset 1.8/3.0 V USB 3.1 super-speed USB_SS_TX_P transmit (+) USIM1_VDD USIM1_CLK DO, PD (U)SIM1 card clock 1.8/3.0 V Ground USIM1_VDD USIM1_DATA DIO, PU (U)SIM1 card data 1.8/3.0 V USB 3.1 super-speed USB_SS_RX_M receive (-) Power supply for...
  • Page 26 OD in PCIe EP mode, and as DI in PCIe RC mode. PCIe EP mode is configured by default. If this function is required, please contact Quectel for more details Please note that COEX_RXD and COEX_TXD cannot be used as general UART ports.
  • Page 27 5G Module Series Connected to GND CONFIG_1 internally Vmin = 3.135 V Power supply for the Vnom = 3.7 V module Vmax = 4.4 V Ground Vmin = 3.135 V Power supply for the Vnom = 3.7 V module Vmax = 4.4 V Ground Vmin = 3.135 V Power supply for the...

  • Page 28: Operating Characteristics

    5G Module Series Operating Characteristics 3.1. Operating Modes The table below briefly summarizes the various operating modes of RM520N-GL. Table 6: Overview of Operating Modes Mode Details Software is active. The module has registered on the network, and it Idle is ready to send and receive data.
  • Page 29 5G Module Series DRX OFF Run Time Figure 3: DRX Run Time and Current Consumption in Sleep Mode The following part of this section presents the power saving procedure and sleep mode of the module. If the host supports USB suspend/resume and remote wakeup function, the following two conditions must be met to make the module enter sleep mode.

  • Page 30: Airplane Mode

    ⚫ Supports Non-X86 systems and X86 system (supports BIOS PCIe early initial) RM520N-GL can also be reprogrammed to PCIe mode based on eFuse. If switched to PCIe mode by burnt eFuse, the communication cannot be switched back to USB mode.

  • Page 31: Power Supply

    5G Module Series Note that if the host does not support firmware upgrade through PCIe, the firmware can be upgraded by the 5G-M2 EVB, which could be connected to PC with a USB type-B cable. For more details, see document [2]. 3.3.

  • Page 32: Reference Design For Power Supply

    5G Module Series In addition, to guarantee stability of the power supply, it is recommended to use a TVS with working peak reverse voltage of 5 V. Module VCC (3.7 V Typ.) 2, 4 220 μ F 68 pF 6.8 nF 220 pF 100nF 3, 5, 11...

  • Page 33: Monitor The Power Supply

    5G Module Series NOTE To avoid damages to the internal flash, DON'T cut off the power supply before the module is completely turned off by pulling down FULL_CARD_POWER_OFF# pin for more than 900 ms, and DON'T cut off power supply directly when the module is working. 3.3.3.
  • Page 34 5G Module Series It is recommended to use a host GPIO to control FULL_CARD_POWER_OFF#. A simple reference circuit is illustrated in the following figure. Host Module 1.8 V or 3.3 V FULL_CARD_POWER_OFF# GPIO PMIC 100k NOTE: The voltage of pin 6 should be no less than 1.19 V when it is at HIGH level. Figure 8: Turn on the Module with a Host GPIO The timing of turn-on scenario is illustrated by the following figure.

  • Page 35: Turn Off

    5G Module Series Table 9: Trun-on Timing of the Module Symbol Min. Typ. Max. Comment 100ms - System turn-on time depending on the host. VCC-FCPO# The time when the module requests the PCIe clock from 100 ms - FCPO#-CLKREQ# the host. The time when the host GPIO controls the module to exit 100 ms FCPO#-PERST#...

  • Page 36: Reset

    5G Module Series The timing of turning-off scenario is illustrated by the following figure. 3.7 V VCC(H) ≥ 1.19 V FULL_CARD_ FCPO# POWER_OFF# ≤ 0.7 V RESET#-FCPO# 1.8 V RESET# Execute AT+CFUN=0, PERST#-RESET# and the module responds OK PCIE_RST_N Module Status Active Turn-off procedure Running...
  • Page 37 5G Module Series Table 11: Definition of RESET# Pin Pin No. Pin Name Description DC Characteristics Comment Reset the module. Internally pulled up to RESET# DI, PU 1.8 V Active LOW 1.8 V. The module can be reset by pulling down the RESET# . An open collector/drain driver or a button can be used to control RESET#.
  • Page 38 5G Module Series Figure below illustrates the timing of the module’s warm reset when only the reset signal is pulled low. In this reset mode, the power of the module will not be turned off. The timing is recommended for module’s reset with a button.
  • Page 39 5G Module Series 3.7 V VCC(H) FCPO# ≥ 1.19 V FULL_CARD_ RST#-FCPO# POWER_OFF# 1.8 V PERST#-RST# RESET# FCPO#-CLKREQ# PCIE_CLKREQ_N Execute AT+CFUN=0, FCPO#-PERST# and the module responds OK REFCLK-PERST# PCIE_RST_N PERST#-RESET# PCIE_REFCLK Module Status Active Resetting Booting NOTE: 1. The timing parameters after the host pulls up FULL_CARD_POWER_OFF# refer to the boot timing of the PCIe mode module.

  • Page 40: Application Interfaces

    The (U)SIM interface circuitry meets ISO/IEC 7816-3, ETSI and IMT-2000 requirements. Both Class B (3.0 V) and Class C (1.8 V) (U)SIM cards are supported. 4.1.1. Pin definition of (U)SIM RM520N-GL has two (U)SIM interfaces, and supports dual SIM single standby. Table 14: Pin Definition of (U)SIM Interface Pin No.

  • Page 41: U)Sim Hot-Plug

    5G Module Series USIM2_VDD USIM2_VDD Power supply for (U)SIM2 card 1.8/3.0V USIM2_VDD USIM2_DATA DIO, PU (U)SIM2 card data 1.8/3.0 V USIM2_VDD USIM2_CLK DO, PD (U)SIM2 card clock 1.8/3.0 V USIM2_VDD USIM2_RST DO, PD (U)SIM card reset 1.8/3.0 V USIM2_DET DI, PD (U)SIM2 card hot-plug detect 1.8 V 4.1.2.

  • Page 42: Normally Closed (U)Sim Card Connector

    5G Module Series Parameter <enable> Integer type. Enable or disable (U)SIM card detection. Disable Enable <insert_level> Integer type. The level of (U)SIM detection pin when a (U)SIM card is inserted. Low level High level NOTE Hot-plug function is invalid if the configured value of <insert_level> is inconsistent with hardware design.

  • Page 43: Normally Open (U)Sim Card Connector

    5G Module Series 4.1.4. Normally Open (U)SIM Card Connector With a normally open (U)SIM card connector, CD1 and CD2 of the connector are disconnected when there is no (U)SIM card inserted. (U)SIM card detection by low level is applicable to this type of connector. Once (U)SIM hot-plug is enabled by executing AT+QSIMDET=1,0, a (U)SIM card insertion will drive USIM_DET from high to low level, and the removal of it will drive USIM_DET from low to high level.

  • Page 44: U)Sim2 Card Compatible Design

    5G Module Series USIM_VDD Module (U)SIM Card Connector 100 nF 10-20k USIM_VDD 22 Ω USIM_RST 22 Ω USIM_CLK USIM_DET 22 Ω USIM_DATA TVS array 10 pF 10 pF 10 pF NOTE: All these resistors, capacitors and TVS should be close to (U)SIM card connector in PCB layout. Figure 17: Reference Circuit for a 6-Pin (U)SIM Card Connector 4.1.6.

  • Page 45: U)Sim Design Notices

    5G Module Series 4.1.7. (U)SIM Design Notices To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design. ⚫ Place the (U)SIM card connector as close to the module as possible, (U)SIM card related resistance and capacitance and ESD devices should be placed close to the card connector.
  • Page 46 5G Module Series USB_SS_RX_P USB 3.1 super-speed receive (+) For more details about the USB 3.1 Gen2 & 2.0 specifications, please visit http://www.usb.org/home. The USB 2.0 interface is recommended to be reserved for firmware upgrade in designs. The following figure shows a reference circuit of USB 3.1 & 2.0 interface. Host Module USB_SS_RX_P...

  • Page 47: Pcie Interface

    5G Module Series you should pay attention to the selection of the device. Typically, the stray capacitance should be less than 1.0 pF for USB 2.0, and less than 0.15 pF for USB 3.1. ⚫ Keep the ESD protection devices as close to the USB connector as possible. ⚫...

  • Page 48: Pin Definition Of Pcie

    5G Module Series If the optional parameter is specified, set PCIe RC/EP mode: If there is any error: ERROR Maximum Response Time 300 ms The command takes effect after the module is restarted. Characteristics The configuration will be saved automatically. Parameter <mode>...

  • Page 49: Reference Design For Pcie

    5G Module Series of 85 Ω PCIE_TX_M PCIe transmit (-) PCIe reset PCIE_RST_N 1.8/3.3 V Active LOW PCIe clock request PCIE_CLKREQ_N 1.8/3.3 V Active LOW PCIe wake up PCIE_WAKE_N 1.8/3.3 V Active LOW 4.3.3. Reference Design for PCIe The following figure shows a reference circuit for the PCIe interface. Host Module R4 0 Ω...
  • Page 50 5G Module Series capacitors on your schematic and PCB. The following principles of PCIe interface design should be complied with to meet PCIe specification. ⚫ Keep the PCIe data and control signals away from sensitive circuits and signals, such as RF, audio, crystal, and oscillator signals.

  • Page 51: Control And Indication Interfaces

    5G Module Series 4.4. Control and Indication Interfaces The following table shows the pin definition of control and indication pins. Table 19: Pin Definition of Control and Indication Interfaces Pin No. Pin Name Description DC Characteristics Airplane mode control W_DISABLE1# Pulled up by default 1.8/3.3 V Active LOW...

  • Page 52: W_Disable2

    5G Module Series 4.4.2. W_DISABLE2#* The module provides a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2# pin is pulled up by default. Driving it LOW will disable the GNSS function. The combination of W_DISABLE2# pin and AT commands can control the GNSS function. Table 21: GNSS Function Status W_DISABLE2# Level AT Commands...

  • Page 53: Led_Wwan

    5G Module Series 4.4.3. LED_WWAN# The LED_WWAN# signal is used to indicate RF status of the module, and its sink current is up to 10 mA. To reduce current consumption of the LED, a current-limited resistor must be placed in series with the LED, as illustrated in the figure below.

  • Page 54: Dpr

    5G Module Series Always at high level Idle/Sleep Host Module VCC_IO_HOST WAKE_ON_WAN# GPIO Wake up the host NOTE: The voltage level on VCC_IO_HOST depends on the host side due to the open drain in pin 23. Figure 23: WAKE_ON_WAN# Signal Reference Circuit 4.4.5.

  • Page 55: Cellular/Wlan Coex Interface

    Power supply for 1.8 V VDDIO_1V8 Antenna tuner Max. output current: 50 mA NOTE If RFFE function is required, please contact Quectel for more details. Please note that COEX_RXD and COEX_TXD cannot be used as general UART ports. RM520N-GL_Hardware_Design 54 / 84...

  • Page 56: Configuration Pins

    CONFIG_3 Module Type and Port (Pin 21) (Pin 69) (Pin 75) (Pin 1) Main Host Interface Configuration Quectel defined Table 28: Configuration Pins of the Module Pin No. Pin Name Description CONFIG_0 Not connected internally CONFIG_1 Connected to GND internally...

  • Page 57: Rf Characteristics

    RF Characteristics This chapter mainly describes RF characteristics of the module. 5.1. Cellular Antenna Interfaces 5.1.1. Pin Definition The pin definition of antenna interfaces is shown below. Table 29: RM520N-GL Pin Definition of Antenna Interfaces Description Comment Name Antenna 0 interface: 5G NR: Refarmed: LB TX0 /PRX &...

  • Page 58: Rx Sensitivity

    ANT3 n77/n78/n79 DRX MIMO LTE: LB TX1/DRX & MHB DRX & UHB DRX MIMO & LAA DRX WCDMA: LMB DRX GNSS: L1 5.1.2. Rx Sensitivity Table 30: RM520N-GL Conducted Receiving Sensitivity (Unit: dBm) Mode Frequency Primary Diversity SIMO 3GPP (SIMO) WCDMA B1 -106.7 dBm...
  • Page 59 5G Module Series LTE-FDD B8 (10 MHz) -93.3 dBm LTE-FDD B12(B17) (10 MHz) -93.3 dBm LTE-FDD B13 (10 MHz) -93.3 dBm LTE-FDD B14 (10 MHz) -93.3 dBm LTE-FDD B18 (10 MHz) -96.3 dBm LTE-FDD B19 (10 MHz) -96.3 dBm LTE-FDD B20 (10 MHz) -93.3 dBm LTE-FDD B25 (10 MHz) -92.8 dBm...
  • Page 60 5G Module Series 5G NR-FDD n5 (20 MHz) -91 dBm 5G NR-FDD n7 (20 MHz) -92.0 dBm 5G NR-FDD n8 (20 MHz) -90.0dBm 5G NR-FDD n12 (15 MHz) -84.0 dBm 5G NR-FDD n13 (15 MHz) 5G NR-FDD n14 (10 MHz) -93.8 dBm 5G NR-FDD n18 (15 MHz) 5G NR-FDD n20 (20 MHz)

  • Page 61: Tx Power

    5G Module Series 5.1.3. Tx Power The following table shows the RF output power of the module. Table 31: Cellular Output Power Mode Frequency Max. Min. WCDMA WCDMA bands 24 dBm +1/-3 dB (Class 3) < -50 dBm LTE bands 23 dBm ±...

  • Page 62: Gnss Performance

    5G Module Series QZSS 1575.42 (L1) GLONASS 1597.5–1605.8 1561.098 ± 2.046 GPS/Galileo/QZSS 1176.45 ± 10.23 (GPS L5) 5.2.3. GNSS Performance The following table shows GNSS performance of the module. Table 33: GNSS Performance Parameter Description Conditions Typ. Unit Cold start Autonomous Sensitivity Reacquisition...

  • Page 63: Antenna Connectors

    5G Module Series 5.3. Antenna Connectors 5.3.1. Antenna Connector Size RM520N-GL are mounted with standard 2 mm × 2 mm receptacle antenna connectors for convenient antenna connection. The antenna connector’s PN is IPEX 20579-001E, and the connector dimensions are illustrated as below:...

  • Page 64: Antenna Connector Location

    5G Module Series 5.3.2. Antenna Connector Location RM520N-GL has four antenna connectors each: ANT0, ANT1, ANT2 and ANT3, which are shown as below. ANT0 ANT1 ANT2 ANT3 Figure 26: RM520N-GL Antenna Connectors 5.3.3. Antenna Connector Installation The receptacle RF connector used in conjunction with the module will accept two types of mating plugs that will meet a maximum height of 1.2 mm using a Ø...
  • Page 65 5G Module Series Figure 27: Specifications of Mating Plugs Using Ø 0.81 mm Coaxial Cables The following figure illustrates the connection between the receptacle RF connector on the module and the mating plug using a Ø 0.81 mm coaxial cable. Figure 28: Connection Between RF Connector and Mating Plug Using Ø...

  • Page 66: Recommended Rf Connector Installation

    5G Module Series The following figure illustrates the connection between the receptacle RF connector on the module and the mating plug using a Ø 1.13 mm coaxial cable. Figure 29: Connection Between RF Connector and Mating Plug Using Ø 1.13 mm Coaxial Cable 5.3.4.

  • Page 67: Assemble Coaxial Cable Plug With Jig

    5G Module Series The illustration of pulling out the coaxial cable plug is shown below, θ = 90° is acceptable, while θ ≠ 90° is not. Figure 31: Pull out a Coaxial Cable Plug 5.3.4.2. Assemble Coaxial Cable Plug with Jig The pictures of installing the coaxial cable plug with a jig is shown below, θ...

  • Page 68: Recommended Manufacturers Of Rf Connector And Cable

    5G Module Series 5.3.5. Recommended Manufacturers of RF Connector and Cable RF connecters and cables by I-PEX are recommended. For more details, visit https://www.i-pex.com. 5.4. Antenna Requirements The following table shows the requirements on WCDMA, LTE, 5G NR antenna and GNSS antennas. Table 35: Antenna Requirements Type Requirements...

  • Page 69: Electrical Characteristics And Reliability

    5G Module Series Electrical Characteristics and Reliability 6.1. Power Supply Requirements The typical input voltage of the module is 3.7 V, the following table shows the power supply requirements of the module. Table 36: Power Supply Requirements Parameter Description Min. Typ.
  • Page 70 Power consumption test is carried out at room temperature with EVB and without any thermal dissipation measures. The power consumption above is for reference only, please contact Quectel Technical Supports for detailed power consumption test report of the module. RM520N-GL_Hardware_Design...

  • Page 71: Digital I/O Characteristic

    5G Module Series 6.3. Digital I/O Characteristic Table 38: Logic Levels of 1.8 V Digital I/O Parameter Description Min. Max. Unit Input high voltage 1.65 Input low voltage -0.3 0.54 Output high voltage Output low voltage Table 39: Logic Levels of 3.3 V Digital I/O Parameter Description Min.

  • Page 72: Electrostatic Discharge

    5G Module Series Table 41: (U)SIM 3.0V I/O Requirements Parameter Description Min. Max. Unit USIM_VDD Power supply 3.05 Input high voltage 0.7 × USIM_VDD USIM_VDD + 0.3 Input low voltage -0.3 0.2 × USIM_VDD Output high voltage 0.8 × USIM_VDD USIM_VDD Output low voltage 6.4.

  • Page 73: Thermal Dissipation

    5G Module Series 6.5. Thermal Dissipation Figure 33: Thermal Dissipation Area Inside and on Bottom Side of the Module The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent.

  • Page 74: Absolute Maximum Ratings

    5G Module Series heatsink should be larger than the module area to cover the module completely; Choose the heatsink with adequate fins to dissipate heat; Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module; Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

  • Page 75: Operating And Storage Temperatures

    5G Module Series 6.7. Operating and Storage Temperatures Table 44: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range º C Extended Temperature Range º C Storage temperature Range º C 6.8. Notification Please follow the principles below in module application. 6.8.1.

  • Page 76: Mechanical Dimensions And Packaging

    5G Module Series Mechanical Dimensions and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of RM520N-GL. All dimensions are measured in mm, and the dimensional tolerances are ± 0.15 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 35: Mechanical Dimensions of the Module (Unit: mm)

  • Page 77: Top And Bottom Views

    NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. 7.3. M.2 Connector The module adopts a standard PCI Express M.2 connector which compiles with the directives and standards listed in the PCI Express M.2 Specification.
  • Page 78 5G Module Series Figure 37: Blister Tray Dimension Drawing RM520N-GL_Hardware_Design 77 / 84...

  • Page 79: Packaging Process

    5G Module Series 7.4.2. Packaging Process Each blister tray packs 10 modules. Stack 10 blister Packing 11 blister trays together and then put trays with modules together, and put 1 empty blister blister trays into a conductive bag, seal and pack tray on the top.

  • Page 80: Appendix A References

    5G Module Series Appendix A References Table 45: Related Documents Document Name [1] Quectel_RM520N-GL_CA&EN-DC_Features [2] Quectel_5G-M2_EVB_User_Guide [3] Quectel_RG520N&RG5x0F&RM5x0N&RM5x0F_Series_AT_Commands_Manual Table 46: Terms and Abbreviations Abbreviation Description BIOS Basic Input Output System Bit Per Second Bandwidth CHAP Challenge-Handshake Authentication Protocol COEX Coexistence Customer Premise Equipment Cellular Signal Quality DC-DC...
  • Page 81 5G Module Series End Point Envelope Tracking Frequency Division Duplexing GLONASS Global Navigation Satellite System (Russia) GNSS Global Navigation Satellite System Global Positioning System Global System for Mobile Communications HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access kbps...
  • Page 82 5G Module Series Radio Frequency RFFE RF Front-End Receive Specific Absorption Rate Sub-carrier Spacing Short Message Service Transmission Control Protocol Transmit UART Universal Asynchronous Receiver & Transmitter User Datagram Protocol Uplink Unsolicited Result Code Universal Serial Bus (U)SIM (Universal) Subscriber Identity Module Input High Voltage Level Input Low Voltage Level Output High Voltage Level...

  • Page 83: Appendix B Operating Frequency

    5G Module Series Appendix B Operating Frequency Table 47: Operating Frequencies (5G) Duplex Uplink Operating Band Downlink Operating Band Unit Mode 1920–1980 2110–2170 1850–1910 1930–1990 1710–1785 1805–1880 824–849 869–894 2500–2570 2620–2690 880–915 925–960 699–716 729–746 777–787 746–756 788–798 758–768 815–830 860–875 832–862 791–821...
  • Page 84 5G Module Series 1880–1920 1880–1920 2300–2400 2300–2400 2496–2690 2496–2690 5150–5925 5150–5925 5855–5925 5855–5925 3550–3700 3550–3700 1432–1517 1432–1517 1427–1432 1427–1432 2483.5–2495 2483.5–2495 1920–2010 2110–2200 1710–1780 2110–2200 738–758 1695–1710 1995–2020 663–698 617–652 1427–1470 1475–1518 1432–1517 1427–1432 3300–4200 3300–4200 3300–3800 3300–3800 4400–5000 4400–5000 1710–1785 880–915 832–862...
  • Page 85 5G Module Series 1710–1780 824–849 2496–2690 2496–2690 832–862 1427–1432 832–862 1432–1517 880–915 1427–1432 880–915 1432–1517 2010–2025 5925–7125 5925–7125 2300–2400 1880–1920 1626.5–1660.5 Table 48: Operating Frequencies (2G + 3G + 4G) Duplex Mode Uplink Downlink Unit 1920–1980 2110–2170 PCS1900 B2/BC1 1850–1910 1930–1990 DCS1800 1710–1785...
  • Page 86 5G Module Series 699–716 729–746 777–787 746–756 788–798 758–768 704–716 734–746 815–830 860–875 830–845 875–890 832–862 791–821 1447.9–1462.9 1495.9–1510.9 3410–3490 3510–3590 1626.5–1660.5 1525–1559 1850–1915 1930–1995 814–849 859–894 807–824 852–869 703–748 758–803 717–728 2305–2315 2350–2360 452.5–457.5 462.5–467.5 1452–1496 1900–1920 1900–1920 2010–2025 2010–2025 1850–1910 1850–1910...
  • Page 87 5G Module Series 2300–2400 2300–2400 2496–2690 2496–2690 3400–3600 3400–3600 3600–3800 3600–3800 703–803 703–803 1447–1467 1447–1467 5150–5925 5150–5925 5855–5925 5855–5925 3550–3700 3550–3700 1432–1517 1432–1517 1427–1432 1427–1432 3300–3400 3300–3400 1920–2010 2110–2200 1710–1780 2110–2200 738–758 698–728 753–783 2570–2620 1695–1710 1995–2020 663–698 617–652 451–456 461–466 450–455 460–465...
  • Page 88 5G Module Series 1427–1432 698–716 728–746 410–415 420–425 412–417 422–427 RM520N-GL_Hardware_Design 87 / 84...

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