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Quectel AF55C Hardware Design

Quectel AF55C Hardware Design

Automotive wi-fi & bluetooth module
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AF55C
Hardware Design
Automotive Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2023-03-29
Status: Preliminary

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Summary of Contents for Quectel AF55C

  • Page 1 AF55C Hardware Design Automotive Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-03-29 Status: Preliminary...
  • Page 2 Automotive Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Automotive Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description Oir HUANG/ 2023-01-04 Creation of the document Ashley HUANG Oir HUANG/ 1.0.0 2023-03-29 Preliminary Ashley HUANG AF55C_Hardware_Design 4 / 58...

  • Page 6: Table Of Contents

    Automotive Wi-Fi&Bluetooth Module Series Contents Safety Information ............................3 About the Document ..........................4 Contents ..............................5 Table Index ..............................7 Figure Index ..............................8 Introduction ............................9 1.1. Special Marks ..........................9 Product Overview ..........................10 2.1. General Description ......................... 10 2.2.
  • Page 7 Automotive Wi-Fi&Bluetooth Module Series 4.3. Digital I/O Characteristics ......................34 4.4. Power Consumption ......................... 34 4.5. RF Performances ........................38 4.5.1. Wi-Fi Performances ...................... 38 4.5.2. Bluetooth Performances ....................41 4.6. ESD Protection ......................... 41 4.7. Operating and Storage Temperatures ..................42 4.8.
  • Page 8 Automotive Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Marks ..........................9 Table 2: Key Features ..........................10 Table 3: I/O Parameter Definition ....................... 15 Table 4: Pin Description ..........................15 Table 5: Definition of Power Supply and GND Pins ................... 19 Table 6: Pin Definition of WLAN_EN ......................
  • Page 9 Automotive Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ........................12 Figure 2: Pin Assignment (Top View) ......................14 Figure 3: Power-up Timing ......................... 19 Figure 4: Wi-Fi Application Interface Connection ..................20 Figure 5: PCIe Interface Connection ......................21 Figure 6: Bluetooth Interface Connection ....................

  • Page 10: Introduction

    Automotive Wi-Fi&Bluetooth Module Series Introduction This document defines the AF55C and describes its air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up automotive industry mobile applications with the module.

  • Page 11: Product Overview

    Product Overview 2.1. General Description AF55C is an automotive-grade Wi-Fi and Bluetooth module with low power consumption. It is a single-die Wi-Fi and Bluetooth combo solution supporting IEEE 802.11a/b/g/n/ac/ax 2.4 GHz and 5 GHz Wi-Fi standards and Bluetooth 5.2 standard, which enables seamless integration of WLAN and Bluetooth Low Energy (BLE) technologies.
  • Page 12 Automotive Wi-Fi&Bluetooth Module Series ⚫ Wi-Fi Protocol IEEE 802.11a/b/g/n/ac/ax ⚫ Wi-Fi Operation Modes ⚫ Wi-Fi Modulations CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM, 1024QAM ⚫ PCIe Wi-Fi Application Interfaces ⚫ SDIO* Bluetooth Protocol Bluetooth 5.2 GFSK, 8-DPSK, π/4-DQPSK Bluetooth Modulations ⚫ Bluetooth Classic (BR + EDR) Bluetooth Operating Modes ⚫...

  • Page 13: Functional Diagram

    COEX_UART Figure 1: Functional Diagram 2.4. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (V2X&5G EVB) with accessories to control or test the module. For more details, see document [1]. AF55C_Hardware_Design 12 / 58...

  • Page 14: Application Interfaces

    Automotive Wi-Fi&Bluetooth Module Series Application Interfaces 3.1. General Description The module is equipped with 108 LGA pins that can be connected to the cellular application platform. The subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module: ⚫...

  • Page 15: Pin Assignment

    Automotive Wi-Fi&Bluetooth Module Series 3.2. Pin Assignment RESERVED PCM_SYNC RESERVED PCM_DOUT WLAN_DBG PCM_DIN _RXD WLAN_DBG PCM_CLK _TXD RESERVED BT_RTS VBAT BT_CTS VBAT BT_RXD VBAT BT_TXD WLAN_WAKE RESERVED _HOST HOST_WAKE RESERVED _WLAN HOST_WAK RESERVED E_BT GPIO1 RESERVED BT_WAKE_ RESERVED HOST COEX_RXD RESERVED COEX_TXD RESERVED...

  • Page 16: Pin Description

    Automotive Wi-Fi&Bluetooth Module Series 3.3. Pin Description Table 3: I/O Parameter Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current, etc. Table 4: Pin Description Power Supply Pin Name Pin No.
  • Page 17 Automotive Wi-Fi&Bluetooth Module Series Pin Name Pin No. Description Comment Characteristics Wi-Fi function WLAN_EN VDD_IO Active high. enable control PCIe reference PCIE_REFCLK_P clock (+) PCIe reference PCIE_REFCLK_M 9 clock (-) Requires PCIE_TX_P PCIe transmit (+) differential impedance of PCIE_TX_M PCIe transmit (-) 100 Ω.
  • Page 18 Automotive Wi-Fi&Bluetooth Module Series DCE request to BT_RTS send signal to DTE DCE clear to send BT_CTS signal from DTE Bluetooth UART BT_TXD transmit Bluetooth UART BT_RXD receive Control Signals* Pin Name Pin No. Description Comment Characteristics Host wakes up HOST_WAKE_BT Bluetooth Bluetooth wakes up...
  • Page 19 Automotive Wi-Fi&Bluetooth Module Series Wi-Fi and Bluetooth ANT_WIFI/BT antenna interface Wi-Fi antenna ANT_WIFI 50 Ω impedance interface Reserved dedicated ANT_BT Bluetooth antenna interface GPIO Interfaces Pin Name Pin No. Description Comment Characteristics General-purpose GPIO1 input/output General-purpose GPIO2 input/output General-purpose GPIO3 input/output General-purpose If unused, keep...

  • Page 20: Power Supply

    Automotive Wi-Fi&Bluetooth Module Series 3.4. Power Supply The following table shows the power supply and ground pins of the module. Table 5: Definition of Power Supply and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit 19, 20, VBAT Power supply for the module Power supply for the module’s I/O pins...

  • Page 21: Wlan_En

    Wi-Fi function enable control Active high. NOTE WLAN_EN is a sensitive signal, and it should be ground shielded and be routed as close to AF55C as possible. 3.5.2. PCIe Interfaces The following table shows the pin definition of the PCIe interfaces.
  • Page 22 100 nF PCIE_RX0_P PCIE_TX_P NM_1.5 pF NM_1.5 pF HOST AF55C NM_1.5 pF NM_1.5 pF NM_1.5 pF NM_1.5 pF Figure 5: PCIe Interface Connection To ensure the signal integrity of PCIe interfaces, C1 and C2 should be placed close to the HOST, and C3 and C4 should be placed close to the module.

  • Page 23: Sdio Interfaces

    Automotive Wi-Fi&Bluetooth Module Series ⚫ For PCIe signal traces, the maximum length of each differential data pair (Tx/Rx/REFCLK) is recommended to be less than 300 mm, and each differential data pair matching should be less than 0.7 mm. ⚫ Spacing to all other signals is four times the trace width. ⚫...

  • Page 24: Bluetooth Application Interfaces

    SDIO_DATA2 SDIO_DATA2 Ω SDIO_DATA3 SDIO_DATA3 AF55C HOST Figure 5: SDIO Interface Connection Follow the principles below in the SDIO circuit design: ⚫ To avoid jitter of bus, it is recommended to reserve resistors R1–R6 (10–100 kΩ) to pull up SDIO traces to VDD_1V8.

  • Page 25: Bt_En

    Automotive Wi-Fi&Bluetooth Module Series UART2 UART BT_EN BT_EN (GPIO) AF55C HOST Figure 6: Bluetooth Interface Connection 3.6.1. BT_EN BT_EN is used to control the Bluetooth function of the module. Bluetooth function will be enabled when BT_EN is at high level. This pin has an internal 50 KΩ pull-down resistor by default.

  • Page 26: Bluetooth Uart

    PCM_SYNC PCM_SYNC PCM_DIN PCM_DOUT PCM_DIN PCM_DOUT AF55C HOST Figure 7: PCM Interface Connection 3.6.3. Bluetooth UART The module serves as DCE (Data Communication Equipment), which is connected in the traditional DCE-DTE (Data Terminal Equipment) mode. The following table shows the pin definition of Bluetooth UART.

  • Page 27: Control Signals

    Automotive Wi-Fi&Bluetooth Module Series 3.7. Control Signals* 3.7.1. HOST_WAKE_BT & BT_WAKE_HOST Table 12: Pin Definition of HOST_WAKE_BT & BT_WAKE_HOST Pin Name Pin No. Description Comment HOST_WAKE_BT Host wakes up Bluetooth If unused, keep them open. BT_WAKE_HOST Bluetooth wakes up the host 3.7.2.

  • Page 28: Wlan_Slp_Clk

    Automotive Wi-Fi&Bluetooth Module Series COEX_TXD COEX_RXD COEX_RXD COEX_TXD AF55C HOST Figure 9: Coexistence UART Interface Connection 3.9. WLAN_SLP_CLK The module will fail to turn on and work without sleep clock, so an external 32.768 kHz sleep clock connecting to WLAN_SLP_CLK is necessary.

  • Page 29: Operating Frequencies

    When L1, L2, C1 and C2 are not mounted, C3, R1 and C4 comprise a π-type matching circuit. Capacitors (C1, C2, C3 and C4) and inductors (L1 and L2) are not mounted by default, and R1 is only mounted with 0 Ω resistor. ANT_WIFI AF55C Figure 10: RF Antenna Reference Design AF55C_Hardware_Design 28 / 58...

  • Page 30: Rf Routing Guidelines

    Automotive Wi-Fi&Bluetooth Module Series 3.10.3. RF Routing Guidelines For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).

  • Page 31: Antenna Design Requirements

    Automotive Wi-Fi&Bluetooth Module Series Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, the following principles should be complied with RF layout design: ⚫ Use impedance simulation tool to control the characteristic impedance of RF traces to 50 Ω. ⚫...

  • Page 32: Rf Connector Recommendation

    Automotive Wi-Fi&Bluetooth Module Series Input Impedance (Ω) Polarization Type Vertical 3.10.5. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 15: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.
  • Page 33 Automotive Wi-Fi&Bluetooth Module Series Figure 16: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 17: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. AF55C_Hardware_Design 32 / 58...

  • Page 34: Electrical Characteristics & Reliability

    Automotive Wi-Fi&Bluetooth Module Series Electrical Characteristics & Reliability 4.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital pins of the module are listed in the following table. Table 19: Absolute Maximum Ratings (Unit: V) Parameter Min.

  • Page 35: Digital I/O Characteristics

    Automotive Wi-Fi&Bluetooth Module Series 4.3. Digital I/O Characteristics Table 21: VDD_IO I/O Requirements (Unit: V) Parameter Description Min. Max. High-level input voltage 0.65 × VDD_IO Low-level input voltage 0.35 × VDD_IO High-level output voltage VDD_IO - 0.40 Low-level output voltage 0.45 4.4.
  • Page 36 Automotive Wi-Fi&Bluetooth Module Series Tx HT20 @ MCS 0 Tx HT20 @ MCS 7 802.11n (5 GHz) Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 Tx VHT20 @ MCS 0 Tx VHT20 @ MCS 8 Tx VHT40 @ MCS 0 802.11ac (5 GHz) Tx VHT40 @ MCS 9 Tx VHT80 @ MCS 0...
  • Page 37 Automotive Wi-Fi&Bluetooth Module Series Rx @ 6 Mbps 802.11a (5 GHz) Rx @ 54 Mbps Rx HT20 @ MCS 0 Rx HT20 @ MCS 7 802.11n (5 GHz) Rx HT40 @ MCS 0 Rx HT40 @ MCS 7 Rx VHT20 @ MCS 0 Rx VHT20 @ MCS 8 Rx VHT40 @ MCS 0 802.11ac (5 GHz)
  • Page 38 Automotive Wi-Fi&Bluetooth Module Series Tx MIMO HT40 @ MCS 0 Tx MIMO HT40 @ MCS 7 Tx MIMO VHT20 @ MCS 0 Tx MIMO VHT20 @ MCS 8 Tx MIMO VHT40 @ MCS 0 802.11ac (5 GHz) Tx MIMO VHT40 @ MCS 9 Tx MIMO VHT80 @ MCS 0 Tx MIMO VHT80 @ MCS 9 Tx MIMO HE20 @ MCS 0...

  • Page 39: Rf Performances

    NOTE 1. The power consumption data above is for reference only, which may vary among different modules. For detailed information, please contact Quectel Technical Support for the power consumption test report of the module. 2. Wi-Fi power consumption default test...
  • Page 40 Automotive Wi-Fi&Bluetooth Module Series 802.11a @ 6 Mbps ± 2.5 802.11a @ 54 Mbps ± 2.5 802.11n, HT20 @ MCS 0 ± 2.5 802.11n, HT20 @ MCS 7 ± 2.5 802.11n, HT40 @ MCS 0 ± 2.5 802.11n, HT40 @ MCS 7 ±...
  • Page 41 Automotive Wi-Fi&Bluetooth Module Series 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7 802.11ax, HE20 @ MCS 0 802.11ax, HE20 @ MCS 11 Table 26: Rx Sensitivity at 5 GHz (Unit: dBm) Standard 802.11 (Max.) Receiving Sensitivity (Typ.) 802.11a @ 6 Mbps 802.11a @ 54 Mbps 802.11n, HT20 @ MCS 0 802.11n, HT20 @ MCS 7...

  • Page 42: Bluetooth Performances

    Automotive Wi-Fi&Bluetooth Module Series NOTE 1. The sensitivity data above is for reference only, which may vary among different modules. For detailed information, please contact Quectel Technical Support for the Rx sensitivity test report of the module. 2. Rx sensitivity default test...

  • Page 43: Operating And Storage Temperatures

    Automotive Wi-Fi&Bluetooth Module Series ±6 ±10 Antenna interfaces ±0.5 ±1 Other interfaces 4.7. Operating and Storage Temperatures Table 29: Operating and Storage Temperatures (Unit: ° C) Parameter Min. Typ. Max. Operating temperature range Storage temperature range 4.8. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures.
  • Page 44 Automotive Wi-Fi&Bluetooth Module Series prevent the heatsink from falling off during the drop, vibration test, or transportation. Screw Heatsink Heatsink Module Module Figure 18: Placement and Fixing of the Heatsink AF55C_Hardware_Design 43 / 58...

  • Page 45: Mechanical Information

    Automotive Wi-Fi&Bluetooth Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 5.1. Mechanical Dimensions of the Module Figure 19: Top and Side Dimensions AF55C_Hardware_Design 44 / 58...
  • Page 46 Automotive Wi-Fi&Bluetooth Module Series Figure 20: Bottom Dimension (Perspective View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. AF55C_Hardware_Design 45 / 58...

  • Page 47: Recommended Footprint

    Automotive Wi-Fi&Bluetooth Module Series 5.2. Recommended Footprint Figure 21: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. AF55C_Hardware_Design 46 / 58...

  • Page 48: Top And Bottom Views

    5.3. Top and Bottom Views Figure 22: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. AF55C_Hardware_Design 47 / 58...

  • Page 49: Storage, Manufacturing & Packaging

    Automotive Wi-Fi&Bluetooth Module Series Storage, Manufacturing & Packaging 6.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 50: Manufacturing And Soldering

    Automotive Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking.
  • Page 51 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

  • Page 52: Packaging Specifications

    Automotive Wi-Fi&Bluetooth Module Series 6.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 6.3.1.

  • Page 53: Plastic Reel

    Automotive Wi-Fi&Bluetooth Module Series 6.3.2. Plastic Reel Figure 25: Plastic Reel Dimension Drawing Table 32: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 44.5 6.3.3. Mounting Direction Figure 26: Mounting Direction AF55C_Hardware_Design 52 / 58...

  • Page 54: Packaging Process

    Automotive Wi-Fi&Bluetooth Module Series 6.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 250 modules.

  • Page 55: Appendix References

    Automotive Wi-Fi&Bluetooth Module Series Appendix References Table 33: Related Documents Document Name [1] Quectel_V2X&5G_EVB_User_Guide [2] Quectel_RF_Layout_Application_Note [3] Quectel_Module_SMT_Application_Note Table 34: Terms and Abbreviations Abbreviation Description Access Point Bluetooth Low Energy BPSK Binary Phase Shift Keying Basic Rate Complementary Code Keying DPSK Differential Phase Shift Keying DQPSK...
  • Page 56 Automotive Wi-Fi&Bluetooth Module Series Integrated Circuit IEEE Institute of Electrical and Electronics Engineers Input/Output Land Grid Array Long Term Evolution Mbps Megabits per second Modulation and Coding Scheme Printed Circuit Board PCIe Peripheral Component Interconnect Express Pulse Code Modulation Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency...
  • Page 57 Automotive Wi-Fi&Bluetooth Module Series Vmax Maximum Voltage Vmin Minimum Voltage Vnom Nominal Voltage VSWR Voltage Standing Wave Ratio Wi-Fi Wireless-Fidelity WLAN Wireless Local Area Network FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device.
  • Page 58 Automotive Wi-Fi&Bluetooth Module Series to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;...
  • Page 59 Automotive Wi-Fi&Bluetooth Module Series 1. Cet appareil peut ne pas causer d'interférence. L'appareil doit accepter toute interférence, y compris celles qui peuvent entraî ner un fonctionnement indé sirable de l'appareil. This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment.

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