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Quectel FGH100M Hardware Design

Quectel FGH100M Hardware Design

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FGH100M
Hardware Design
Wi-Fi Module Series
Version: 1.0.0
Date: 2023-03-22
Status: Preliminary

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Summary of Contents for Quectel FGH100M

  • Page 1 FGH100M Hardware Design Wi-Fi Module Series Version: 1.0.0 Date: 2023-03-22 Status: Preliminary...
  • Page 2 Wi-Fi Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...

  • Page 3: Safety Information

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: About The Document

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: Contents

    Wi-Fi Module Series About the Document Revision History Version Date Author Description Paul YU/James XIONG/ 2023-03-22 Creation of the document Adam ZENG Paul YU/James XIONG/ 1.0.0 2023-03-22 Preliminary Adam ZENG FGH100M_Hardware_Design 4 / 41...

  • Page 6: Table Of Contents

    Wi-Fi Module Series Contents Safety Information ............................3 About the Document ..........................4 Contents ..............................5 Table Index ..............................7 Figure Index ..............................8 Introduction ............................9 1.1. Special Mark ..........................9 Product Overview ..........................10 2.1. Key Features ..........................11 2.2.
  • Page 7 Wi-Fi Module Series 7.3.2. Plastic Reel ........................37 7.3.3. Mounting Direction ......................37 7.3.4. Packaging Process ....................... 38 Appendix References ........................39 FGH100M_Hardware_Design 6 / 41...
  • Page 8 Wi-Fi Module Series Table Index Table 1: Special Mark........................... 9 Table 2: Basic Information ......................... 10 Table 3: Key Features ..........................11 Table 4: Wi-Fi Performances ........................13 Table 5: Wi-Fi Power Consumption ......................14 Table 6: I/O Parameters Definition ......................16 Table 7: Pin Description ..........................
  • Page 9 Wi-Fi Module Series Figure Index Figure 1: Functional Diagram ........................12 Figure 2: Pin Assignment (Top View) ......................15 Figure 3: Reference Circuit of Power Supply ..................... 19 Figure 4: SDIO Interface Connection ......................20 Figure 5: Reference Circuit for RF Antenna Interface ................22 Figure 6: Microstrip Design on a 2-layer PCB ...................

  • Page 10: Introduction

    Wi-Fi Module Series Introduction This document defines the FGH100M and describes its air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

  • Page 11: Product Overview

    Wi-Fi Module Series Product Overview FGH100M is a long-range and low power Wi-Fi HaLow module compliant with IEEE 802.11ah Wi-Fi standard. It operates in Sub-1 GHz frequency band and features 32.5 Mbps maximum transmission rate. It provides SDIO 2.0 interface for Wi-Fi function.

  • Page 12: Key Features

    Typ.: 3.3 V ⚫ Operating temperature : -30 to +85 ° C Temperature Ranges ⚫ Storage temperature: -40 to +95 ° C EVB Kit FGH100M-M.2 RF Antenna Interface ⚫ ANT_WIFI Antenna Interface ⚫ 50 Ω impedance Application Interface Application Interfaces SDIO 2.0, JTAG...

  • Page 13: Rf Performances

    Wi-Fi Module Series RF Performances 3.1. Wi-Fi Performances Table 4: Wi-Fi Performances Operating Frequency Sub-1 GHz: 902 ~ 928 MHz Modulation OFDM, BPSK, QPSK, 16QAM, 64QAM Operating Mode ⚫ ⚫ Transmission Data Rate ⚫ 1 MHz: MCS 0–7, MCS 10 ⚫...
  • Page 14 Wi-Fi Module Series Table 5: Wi-Fi Power Consumption Condition Unit VDD_FEM VBAT 1 MHz @ MCS 0 2 MHz @ MCS 0 4 MHz @ MCS 0 8 MHz @ MCS 0 802.11ah, Tx 1 MHz @ MCS 7 @ 915 MHz 2 MHz @ MCS 7 4 MHz @ MCS 7 8 MHz @ MCS 7...

  • Page 15: Application Interfaces

    Wi-Fi Module Series Application Interfaces 4.1. Pin Assignment GPIO7 GPIO8 VDD_FEM GPIO9 GPIO10 SDIO_DATA1 WAKEUP_IN SDIO_DATA0 RESET_N SDIO_CLK RESERVED SDIO_CMD GPIO0 VDDIO Power SDIO JTAG GPIO RESERVED Figure 2: Pin Assignment (Top View) NOTE Keep all RESERVED or unused pins unconnected. All GND pins should be connected to ground.

  • Page 16: Pin Description

    Wi-Fi Application Interface Pin Name Pin No. Description Comment Characteristics Require differential SDIO_CLK SDIO clock VDDIO impedance of 50 Ω. The SDIO interface can be multiplexed into SPI. For more details, please contact Quectel Technical Support. FGH100M_Hardware_Design 16 / 41...
  • Page 17 Pin Name Pin No. Description Comment Characteristics Being multiplexed into BUSY interface to indicate General-purpose GPIO0 Wi-Fi status. If needed, input/output please contact Quectel Technical Support. General-purpose GPIO1 input/output General-purpose VDDIO GPIO2 input/output General-purpose GPIO3 If unused, keep them open.
  • Page 18 Wi-Fi Module Series General-purpose GPIO6 input/output General-purpose GPIO7 input/output General-purpose GPIO8 input/output General-purpose GPIO9 input/output General-purpose GPIO10 input/output RF Antenna Interface Pin Name Pin No. Description Comment Characteristics Wi-Fi antenna 50 Ω impedance. ANT_WIFI interface Control Signals Pin Name Pin No. Description Comment Characteristics...

  • Page 19: Power Supply

    Wi-Fi Module Series 4.3. Power Supply The module is powered by VBAT. It is recommended to use a power supply chip with sufficient up to 1.5 A. For better power supply performance, it is recommended to parallel a 47 μF decoupling capacitor, and 1 μF and 100 nF filter capacitors near the module’s VBAT pin.

  • Page 20: Wi-Fi Application Interface

    The module provides SDIO 2.0 interface for Wi-Fi function. If power saving mode is used, a GPIO of the host is needed to be set as a CMOS input pin to receive the BUSY signal from the pin 10 (GPIO0) of the module. If needed, please contact Quectel Technical Support. 4.4.1. SDIO Interface SDIO interface connection between the module and the host is illustrated in the following figure.

  • Page 21: Jtag Interface

    Wi-Fi Module Series 4.5. JTAG Interface The module provides a JTAG interface for module debugging and testing. Its circuit will only be reset by JTAG_TRST pin. Ensure the pin 35 (JTAG_TRST) is pulled down to GND with a 10 kΩ resistor during power-up.

  • Page 22: Reference Design

    Wi-Fi Module Series 4.6.1. Reference Design A reference circuit for the RF antenna interface is shown below. It is recommended to reserve a π-type matching circuit and add ESD protection components for better RF performance. Reserved matching components (R1, C1, C2, and D1) shall be placed as close to the antenna as possible. C1, C2 and D1 are not mounted by default.
  • Page 23 Wi-Fi Module Series Figure 7: Coplanar Waveguide Design on a 2-layer PCB Figure 8: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 9: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) FGH100M_Hardware_Design 23 / 41...

  • Page 24: Rf Connector Recommendation

    Wi-Fi Module Series To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. ⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.
  • Page 25 Wi-Fi Module Series U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 11: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 12: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com.

  • Page 26: Electrical Characteristics & Reliability

    Wi-Fi Module Series Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 9: Absolute Maximum Ratings (Unit: V) Parameter Min. Max. VBAT -0.3 VDD_FEM -0.3 VDDIO -0.3 5.2. Power Supply Ratings Table 10: Module Power Supply Ratings (Unit: V) Parameter Min.

  • Page 27: Esd Protection

    Wi-Fi Module Series 5.3. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module; add ESD protection components to the ESD sensitive interfaces and points in the product design.
  • Page 28 Wi-Fi Module Series ⚫ Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. ⚫ Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. ⚫...

  • Page 29: Mechanical Information

    Wi-Fi Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 14: Top and Side Dimensions FGH100M_Hardware_Design 29 / 41...
  • Page 30 Wi-Fi Module Series Figure 15: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FGH100M_Hardware_Design 30 / 41...

  • Page 31: Recommended Footprint

    Wi-Fi Module Series 6.2. Recommended Footprint Figure 16: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FGH100M_Hardware_Design 31 / 41...

  • Page 32: Top And Bottom Views

    6.3. Top and Bottom Views Figure 17: Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FGH100M_Hardware_Design 32 / 41...

  • Page 33: Storage, Manufacturing & Packaging

    Wi-Fi Module Series Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 34: Manufacturing And Soldering

    Wi-Fi Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
  • Page 35 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [3].

  • Page 36: Packaging Specifications

    Wi-Fi Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 7.3.1.
  • Page 37 Wi-Fi Module Series 7.3.2. Plastic Reel Figure 20: Plastic Reel Dimension Drawing Table 15: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 24.5 7.3.3. Mounting Direction Figure 21: Mounting Direction FGH100M_Hardware_Design 37 / 41...
  • Page 38 Wi-Fi Module Series 7.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules.
  • Page 39 Wi-Fi Module Series Appendix References Table 16: Related Documents Document Name [1] Quectel_FGH100M-M.2_User_Guide [2] Quectel_RF_Layout_Application_Note [3] Quectel_Module_SMT_Application_Note Table 17: Terms and Abbreviations Abbreviation Description Access Point BPSK Binary Phase Shift Keying Complementary Code Keying Charge Device Model COMS Complementary Metal Oxide Semiconductor Central Processing Unit Electrostatic Discharge Error Vector Magnitude...
  • Page 40 Wi-Fi Module Series IEEE Institute of Electrical and Electronics Engineers Input/Output JTAG Joint Test Action Group Land Grid Array MBIST Memory Build-In-Self Test Mbps Million Bits Per Second Modulation and Coding Scheme Moisture Sensitivity Levels OFDM Orthogonal Frequency-Division Multiplexing Printed Circuit Board Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying...
  • Page 41 Wi-Fi Module Series High-level Input Voltage Low-level Input Voltage Vmax Maximum Voltage Vmin Minimum Voltage Vnom Nominal Voltage High-level Output Voltage Low-level Output Voltage VSWR Voltage Standing Wave Ratio Wi-Fi Wireless Fidelity FGH100M_Hardware_Design 41 / 41...
  • Page 42 Quectel that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by...
  • Page 43 Antenna (1) The antenna must be installed such that 20 cm is maintained between the antenna and users, (2) The transmitter module may not be co-located with any other transmitter or antenna. In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC ID cannot be used on the final product.
  • Page 44 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual...
  • Page 45 Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
  • Page 46 This device is intended only for OEM integrators under the following conditions: (For module device use) 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required.
  • Page 47 Industry Canada Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device.
  • Page 48 Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires.
  • Page 49 Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

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