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Quectel FCS945R Hardware Design

Quectel FCS945R Hardware Design

Fi&bluetooth module series
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FCS945R
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2023-04-14
Status: Preliminary

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Summary of Contents for Quectel FCS945R

  • Page 1 FCS945R Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-04-14 Status: Preliminary...

  • Page 2: Legal Notices

    Wi-Fi&Bluetooth Module At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...

  • Page 3: Third-Party Rights

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Wi-Fi&Bluetooth Module About the Document Revision History Version Date Author Description 2023-04-14 Wain ZHAO Creation of the document 1.0.0 2023-04-14 Wain ZHAO Preliminary FCS945R_Hardware_Design 4 / 50...

  • Page 6: Table Of Contents

    Wi-Fi&Bluetooth Module Contents Safety Information ............................3 About the Document ............................4 Contents ................................ 5 Table Index ..............................7 Figure Index ..............................8 Introduction ............................9 1.1. Special Marks ..........................9 Product Overview ..........................10 2.1. Key Features ..........................11 2.2. Functional Diagram ........................12 RF Performances ..........................
  • Page 7 Wi-Fi&Bluetooth Module 7.3.1. Carrier Tape ........................42 7.3.2. Plastic Reel ........................43 7.3.3. Mounting Direction ......................43 7.3.4. Packaging Process ......................44 Appendix References ......................... 45 FCS945R_Hardware_Design 6 / 50...
  • Page 8 Wi-Fi&Bluetooth Module Table Index Table 1: Special Marks ..........................9 Table 2: Basic Information ........................... 10 Table 3: Key Features ..........................11 Table 4: Wi-Fi Performances ........................13 Table 5: Bluetooth Performances ........................15 Table 6: I/O Parameters Definition ......................17 Table 7: Pin Description ..........................17 Table 8:Power-on Timing Parameters ......................20...
  • Page 9 ......................35 Figure 22: Bottom Dimensions (Bottom View) .................... 36 Figure 23: Recommended Footprint ......................37 Figure 24: FCS945R Top and Bottom Views ....................38 Figure 25: Recommended Reflow Soldering Thermal Profile ..............40 Figure 26: Carrier Tape Dimension Drawing ....................42 Figure 27: Plastic Reel Dimension Drawing ....................43...

  • Page 10: Introduction

    Wi-Fi&Bluetooth Module Introduction This document defines the FCS945R and describes its air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module.

  • Page 11: Product Overview

    Wi-Fi&Bluetooth Module Product Overview FCS945R is a small and high performance IEEE 802.11a/b/g/n Wi-Fi and Bluetooth 5.2 module which supports 1T1R. It provides a SDIO 2.0 interface for Wi-Fi functions and a UART and a PCM interface for Bluetooth functions.

  • Page 12: Key Features

    Typ.: 1.8/3.3 V  Operating temperature : 0 °C to +70 °C  Temperature Ranges Storage temperature: -40 °C to +85 °C  EVB Kit FCS945R-M.2 RF Antenna Interface Wi-Fi/Bluetooth antenna ANT_WIFI/BT  interface 50 Ω characteristic impedance  Application Interface Wi-Fi Application SDIO 2.0...

  • Page 13: Functional Diagram

    Wi-Fi&Bluetooth Module 2.2. Functional Diagram Figure 1: FCS945R Functional Diagram FCS945R_Hardware_Design 12 / 50...

  • Page 14: Rf Performances

    Wi-Fi&Bluetooth Module RF Performances 3.1. Wi-Fi Performances Table 4: Wi-Fi Performances Operating Frequency 2.4 GHz: 2.400–2.4835 GHz 5 GHz: 5.150–5.850 GHz Modulation CCK, BPSK, QPSK, DQPSK, 16QAM, 64QAM Operating Mode   Transmission Data Rate 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps ...
  • Page 15 Wi-Fi&Bluetooth Module 802.11n, HT40 @ MCS 7 ≤ -27 dB 802.11a @ 6 Mbps ≤ -15 dB 802.11a @ 54 Mbps ≤ -25 dB 802.11n, HT20 @ MCS 0 ≤ -15 dB 5 GHz 802.11n, HT20 @ MCS 7 ≤ -28 dB 802.11n, HT40 @ MCS 0 ≤...

  • Page 16: Bluetooth Performances

    Wi-Fi&Bluetooth Module 3.2. Bluetooth Performances Table 5: Bluetooth Performances Operating Frequency 2.400–2.4835 GHz Modulation GFSK, π/4-DQPSK, 8-DPSK Operating Mode Classic Bluetooth (BR + EDR)  Bluetooth Low Energy (BLE)  Unit: dBm, Tolerance: ±2dB Condition Transmitting Power @ Typ. Receiving Sensitivity @ Typ. EDR (π/4-DQPSK) EDR (8-DPSK) BLE (1 Mbps)

  • Page 17: Application Interfaces

    Wi-Fi&Bluetooth Module Application Interfaces 4.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE Keep all RESERVED and unused pins unconnected. Keep all GND pins connected to the ground. FCS945R_Hardware_Design 16 / 50...

  • Page 18: Pin Description

    Wi-Fi&Bluetooth Module 4.2. Pin Description Table 6: I/O Parameters Definition Type Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 7: Pin Description Power Supply Pin Name Pin No. Description Comment Characteristics...
  • Page 19 Wi-Fi&Bluetooth Module SDIO_CMD SDIO command SDIO_CLK SDIO clock SDIO_DATA0 SDIO data bit 0 SDIO_DATA1 SDIO data bit 1 Bluetooth Application Interfaces Pin Name Pin No. Description Comment Characteristics Bluetooth enable BT_EN 3.3 V Active high. control Host wakes up HOST_WAKE_BT Bluetooth Bluetooth wakes up BT_WAKE_HOST...

  • Page 20: Power Supply

    Wi-Fi&Bluetooth Module If unused, keep it open. RESERVED Pins Pin Name Pin No. Comment RESERVED 4, 5, 8, 10, 11, 21, 23, 29, 30, 32, 35, 37–40 Keep them open. 4.3. Power Supply The module is powered by VBAT. It is recommended to use a 3.3 V power supply chip with sufficient up to 0.6 A.
  • Page 21 Wi-Fi&Bluetooth Module The power-up timing of the module is shown below. Figure 4: Power-up Timing NOTE Keep PCM_DIN at low level during the module power-up. Table 8:Power-on Timing Parameters Parameter Min. Typ. Max. Unit T3V3 ramp T1V8 ramp Tnon-rdy FCS945R_Hardware_Design 20 / 50...

  • Page 22: Wi-Fi Application Interface

    Wi-Fi&Bluetooth Module 4.4. Wi-Fi Application Interface Wi-Fi application interface connection between the module and the host is illustrated in the figure below. Figure 5: Wi-Fi Application Interface Connection 4.4.1. SDIO Interface SDIO interface connection between the module and the host is illustrated in the following figure. Figure 6: SDIO Interface Connection FCS945R_Hardware_Design 21 / 50...

  • Page 23: Bluetooth Application Interfaces

    Wi-Fi&Bluetooth Module To ensure compliance of interface design with the SDIO 2.0 specification, it is recommended to adopt the following principles: To avoid jitter of bus, pull up SDIO_CMD and SDIO_DATA_[0:3]/SDIO_CMD to VDD_IO with  resistors respectively. Value range of these resistors should be 10–100 kΩ and the recommended value is 10 kΩ.

  • Page 24: Pcm Interface

    Wi-Fi&Bluetooth Module 4.5.1. PCM Interface The module provides a PCM interface for Bluetooth audio application. It supports the following features: Supports Master and Slave mode  Programmable long/short Frame Sync  Supports 8-bit/16-bit linear PCM formats  PCM Master Clock Output: 64 kHz, 128 kHz, 256 kHz, or 512 kHz ...

  • Page 25: Uart

    Wi-Fi&Bluetooth Module 4.5.2. UART The Module supports Bluetooth HCI (Host Controller Interface) UART defined in Bluetooth Core Specification Version 5.2. It supports hardware flow control, and can be used for data transmission with the host. Pin definitions of the UART interface is shown in the following table The voltage range of the Bluetooth UART is determined by VDD_IO.

  • Page 26: Rf Antenna Interface

    Wi-Fi&Bluetooth Module 4.6. RF Antenna Interface Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

  • Page 27: Rf Routing Guidelines

    Wi-Fi&Bluetooth Module Figure 12: Reference Circuit for RF Antenna Interface 4.6.3. RF Routing Guidelines For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).
  • Page 28 Wi-Fi&Bluetooth Module Figure 15: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 16: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to ...

  • Page 29: Rf Connector Recommendation

    Wi-Fi&Bluetooth Module 4.6.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Receptacle Figure 17: Dimensions of the (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.
  • Page 30 Wi-Fi&Bluetooth Module The following figure describes the space factor of mated connectors. Figure 19: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FCS945R_Hardware_Design 29 / 50...

  • Page 31: Electrical Characteristics & Reliability

    Wi-Fi&Bluetooth Module Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 10: Absolute Maximum Ratings (Unit: V) Parameter Min. Max. VBAT -0.3 VDD_IO -0.3 3.63 5.2. Power Supply Ratings Table 11: Module Power Supply Ratings (Unit: V) Parameter Description Condition Min.

  • Page 32: Power Consumption

    Wi-Fi&Bluetooth Module 5.3. Power Consumption Table 12: Wi-Fi Power Consumption Condition Unit VDD_IO VBAT Tx @ 1 Mbps Tx @ 11 Mbps 802.11b Rx @ 1 Mbps Rx @ 11 Mbps Tx @ 6 Mbps Tx @ 54 Mbps 802.11g Rx @ 6 Mbps Rx @ 54 Mbps 2.4 GHz...

  • Page 33: Esd Protection

    Wi-Fi&Bluetooth Module Tx HT20 @ MCS 7 Rx HT20 @ MCS 0 Rx HT20 @ MCS 7 Tx HT40 @ MCS 0 Tx HT40 @ MCS 7 Rx HT40 @ MCS 0 Rx HT40 @ MCS 7 Table 13: Bluetooth Power Consumption in Non-signalling Modes Mode Transmitting Power VDD_IO...

  • Page 34: Digital I/O Characteristics

    Wi-Fi&Bluetooth Module 5.5. Digital I/O Characteristics Table 15: VDD_IO Low-level I/O Requirements (Unit: V) Parameter Description Min. Max. High-level input voltage Low-level input voltage High-level output voltage 2.97 Low-level output voltage 0.33 Table 16: VDD_IO High-level I/O Requirements (Unit: V) Parameter Description Min.

  • Page 35: Thermal Dissipation

    Wi-Fi&Bluetooth Module 5.6. Thermal Dissipation The module offers the best performance when all internal IC chips are working within their operating temperatures. When the IC chip reaches or exceeds the maximum junction temperature, the module may still work but the performance and function (such as RF output power, data rate, etc.) will be affected to a certain extent.

  • Page 36: Mechanical Information

    Wi-Fi&Bluetooth Module Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 21: Top and Side Dimensions FCS945R_Hardware_Design 35 / 50...
  • Page 37 Wi-Fi&Bluetooth Module Figure 22: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FCS945R_Hardware_Design 36 / 50...

  • Page 38: Recommended Footprint

    Wi-Fi&Bluetooth Module 6.2. Recommended Footprint Figure 23: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCS945R_Hardware_Design 37 / 50...

  • Page 39: Top And Bottom Views

    6.3. Top and Bottom Views Figure 24: FCS945R Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCS945R_Hardware_Design 38 / 50...

  • Page 40: Storage, Manufacturing & Packaging

    Wi-Fi&Bluetooth Module Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

  • Page 41: Manufacturing And Soldering

    Wi-Fi&Bluetooth Module NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.
  • Page 42 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2].

  • Page 43: Packaging Specifications

    Wi-Fi&Bluetooth Module 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 7.3.1.

  • Page 44: Plastic Reel

    Wi-Fi&Bluetooth Module 7.3.2. Plastic Reel Figure 27: Plastic Reel Dimension Drawing Table 19: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 32.5 7.3.3. Mounting Direction Figure 28: Mounting Direction FCS945R_Hardware_Design 43 / 50...

  • Page 45: Packaging Process

    Wi-Fi&Bluetooth Module 7.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.

  • Page 46: Appendix References

    Wi-Fi&Bluetooth Module Appendix References Table 20: Related Documents Document Name [1] Quectel_RF_Layout_Application_Note [2] Quectel_Module_SMT_Application_Note Table 21: Terms and Abbreviations Abbreviation Description Access Point Bluetooth Low Energy BPSK Binary Phase Shift Keying Basic Rate Complementary Code Keying Clear To Send Charged Device Model DBPSK Differential Binary Phase Shift Keying DPSK...
  • Page 47 Wi-Fi&Bluetooth Module Error Vector Magnitude GFSK Gauss frequency Shift Keying Ground Human Body Model Host Controller Interface High Throughput IEEE Institute of Electrical and Electronics Engineers Input/Output Leadless Chip Carrier (package) Mbps Million Bits Per Second Modulation and Coding Scheme Moisture Sensitivity Level Printed Circuit Board Pulse Code Modulation...
  • Page 48 Wi-Fi&Bluetooth Module To Be Determined Transient Voltage Suppressor Transmit Transmit Data UART Universal Asynchronous Receiver/Transmitter Very High Throughput High-level Input Voltage Low-level Input Voltage Vmax Maximum Voltage Vmin Minimum Voltage Vnom Nominal Voltage High-level Output Voltage Low-level Output Voltage VSWR Voltage Standing Wave Ratio Wi-Fi Wireless Fidelity...
  • Page 49 Wi-Fi&Bluetooth Module FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.
  • Page 50 Wi-Fi&Bluetooth Module than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules.
  • Page 51 Wi-Fi&Bluetooth Module iii. for devices with detachable antennals), the maximum antenna gain permitted for devices in the band5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate; iv. where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliantwith the e.iro.

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