Table of Contents
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7.2.
Top and Bottom Views .............................................................................................................. 76
7.3.
M.2 Connector ........................................................................................................................... 76
7.4.
Packaging ................................................................................................................................. 76
7.4.1.
Blister Tray ..................................................................................................................... 76
7.4.2.
Packaging Process ........................................................................................................ 78
8
Appendix A References ..................................................................................................................... 79
9
Appendix B Operating Frequency.................................................................................................... 82
RM520N-GL_Hardware_Design
5G Module Series
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