Packaging Process - Quectel RM520N-GL Hardware Design

7.4.2. Packaging Process

Each blister tray packs 10 modules. Stack 10 blister
trays with modules together, and put 1 empty blister
tray on the top.
Put seal-packed blister trays into a mini box. One
mini box can pack 100 modules.
RM520N-GL_Hardware_Design
Packing 11 blister trays together and then put
blister trays into a conductive bag, seal and pack
the conductive bag.
Put 4 mini boxes into 1 carton and then seal it.
One carton can pack 400 modules.
Figure 38: Packaging Process
5G Module Series
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