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Quectel FCS960K-N Hardware Design

Quectel FCS960K-N Hardware Design

Wi-fi&bluetooth module
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FCS960K-N
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2023-06-29
Status: Preliminary

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Summary of Contents for Quectel FCS960K-N

  • Page 1 FCS960K-N Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-06-29 Status: Preliminary...

  • Page 2: Legal Notices

    Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...

  • Page 3: Third-Party Rights

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description 2023-06-29 Wesley WEI Creation of the document 1.0.0 2023-06-29 Wesley WEI Preliminary FCS960K-N_Hardware_Design 4 / 46...

  • Page 6: Table Of Contents

    Wi-Fi&Bluetooth Module Series Contents Safety Information ............................3 About the Document ..........................4 Contents ..............................5 Table Index ..............................7 Figure Index ..............................8 Introduction ............................9 1.1. Special Mark ..........................9 Product Overview ..........................10 2.1. Key Features ..........................11 2.2.
  • Page 7 Wi-Fi&Bluetooth Module Series 6.3. Top and Bottom Views ......................37 Storage, Manufacturing & Packaging ..................... 38 7.1. Storage Conditions........................38 7.2. Manufacturing and Soldering ....................39 7.3. Packaging Specifications ......................41 7.3.1. Carrier Tape ........................41 7.3.2. Plastic Reel ........................42 7.3.3.
  • Page 8 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark........................... 9 Table 2: Basic Information ......................... 10 Table 3: Key Features ..........................11 Table 4: Wi-Fi Performances ........................13 Table 6: Bluetooth Performances ......................15 Table 8: I/O Parameters Definition ......................17 Table 9: Pin Description ..........................
  • Page 9 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ........................12 Figure 2: Pin Assignment (Top View) ......................16 Figure 3 Reference Circuit of Power Supply ....................20 Figure 4: Power-up Timing ......................... 20 Figure 5 Wi-Fi Application Interface Connection ..................21 Figure 6: SDIO Interface Connection ......................

  • Page 10: Introduction

    For example, SDIO_DATA[0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3. Hereby, Quectel Wireless Solutions Co., Ltd. declares that the radio equipment type FCS960K-N is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity is available at the following internet address: http://www.quectel.com/support/technical.htm...

  • Page 11: Product Overview

    Wi-Fi&Bluetooth Module Series Product Overview FCS960K-N is a low-energy, high-performance IEEE 802.11 a/b/g/n/ac/ax Wi-Fi 6 and Bluetooth 5.3 module. It supports 2.4 GHz and 5 GHz dual-band and 1T1R with maximum data transmission rate up to 286.8 Mbps. It provides SDIO 3.0 interface for Wi-Fi functions and UART and PCM interface for Bluetooth functions.

  • Page 12: Key Features

    Within this range, the module’s indicators comply with IEEE and Bluetooth specification requirements. The dedicated Bluetooth antenna interface is optional. For more details, contact Quectel Technical Support. FCS960K-N doesn’t use ANT_BT in module’s CE testing, it’s reserved for client’s design.

  • Page 13: Functional Diagram

    Wi-Fi&Bluetooth Module Series 2.2. Functional Diagram 40 MHz XO VBAT VDD_IO WLAN_EN 2.4G_WLAN/BT_TRX ANT_WIFI/BT BT_EN Diplexer 5G_WLAN_TRX GPIO AIC8800D40 UART HOST_WAKE_BT BT_WAKE_HOST ANT_BT HOST_WAKE_WLAN WLAN_WAKE_HOST SDIO 3.0 USB 2.0 Figure 1 : Functional Diagram FCS960K-N_Hardware_Design 12 / 46...

  • Page 14: Rf Performances

    Wi-Fi&Bluetooth Module Series RF Performances 3.1. Wi-Fi Performances Table 4 : Wi-Fi Performances Operating Frequency 2.4 GHz: 2.400–2.4835 GHz 5 GHz: 5.150–5.850 GHz Modulation DSSS、CCK、BPSK、QPSK、16QAM、64QAM、256QAM、1024QAM Encryption Mode WEP, WPA, WPA2, WPA3-SAE Operating Mode ⚫ ⚫ Transmission Data Rate ⚫ 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps ⚫...
  • Page 15 Wi-Fi&Bluetooth Module Series ≤ -25 dB 802.11g @ 54 Mbps ≤ -5 dB 802.11n, HT20 @ MCS 0 ≤ -27 dB 802.11n, HT20 @ MCS 7 ≤ -5 dB 802.11n, HT40 @ MCS 0 ≤ -27 dB 802.11n, HT40 @ MCS 7 ≤...

  • Page 16: Bluetooth Performances

    Wi-Fi&Bluetooth Module Series 3.2. Bluetooth Performances Table 5: Bluetooth Performances Operating Frequency 2.400–2.4835 GHz Modulation GFSK, π/4-DQPSK, 8-DPSK Operating Mode ⚫ Classic Bluetooth (BR + EDR) ⚫ Bluetooth Low Energy (BLE) Typ.; Unit: dBm; Tolerance: TBD Condition Receiving Sensitivity EDR (π/4-DQPSK) EDR (8-DPSK) BLE (1 Mbps) BLE (2 Mbps)

  • Page 17: Application Interfaces

    Wi-Fi&Bluetooth Module Series Application Interfaces 4.1. Pin Assignment ANT_WIFI/BT ANT_BT DBG_RXD RESERVED RESERVED DBG_TXD FCS960K-N HOST_WAKE_BT PCM_SYNC BT_WAKE_HOST PCM_DIN RESERVED PCM_CLK VBAT PCM_DOUT USB_DM HOST_WAKE_WLAN USB_DP RESERVED Bluetooth Other signals Power WLAN RESERVED GPIO Figure 2 : Pin Assignment (Top View) NOTE Keep all RESERVED and unused pins unconnected.

  • Page 18: Pin Description

    Wi-Fi&Bluetooth Module Series 4.2. Pin Description Table 6 : I/O Parameters Definition Type Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 7 : Pin Description Power Supply Pin Name Pin No.
  • Page 19 50 Ω characteristic antenna interface Bluetooth antenna impedance. ANT_BT interface (optional) The dedicated Bluetooth antenna interface is optional. For more details, contact Quectel Technical Support. FCS960K-N doesn’t use ANT_BT in module’s CE testing, it’s reserved for client’s design. FCS960K-N_Hardware_Design 18 / 46...
  • Page 20 Wi-Fi&Bluetooth Module Series Other Interfaces Pin Name Pin No. Description Comment Characteristics USB differential USB_DM data (-) If unused, keep them USB differential open. USB_DP data (+) Debug UART DBG_TXD transmit Test points must be VDD_IO Debug UART reserved. DBG_RXD receive GPIO Interface Pin Name...

  • Page 21: Power Supply

    Wi-Fi&Bluetooth Module Series 4.3. Power Supply The module is powered by VBAT. It is recommended to use a power supply chip with sufficient of at least 0.5 A. For better power supply performance, it is recommended to parallel a 47 μF decoupling capacitor, and 1 μF and 100 nF filter capacitors near the module’s VBAT pin.

  • Page 22: Wi-Fi Application Interfaces

    Wi-Fi&Bluetooth Module Series 4.4. Wi-Fi Application Interfaces The Wi-Fi application interface connection between the module and the host is illustrated in the following figure SDIO 3.0 SDIO 3.0 HOST_WAKE_WLAN HOST_WAKE_WLAN WLAN_WAKE_HOST WLAN_WAKE_HOST WLAN_EN WLAN_EN Module Host Figure 5 Wi-Fi Application Interface Connection 4.4.1.

  • Page 23: Bluetooth Application Interfaces

    Wi-Fi&Bluetooth Module Series To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles: ⚫ To avoid jitter of bus, pull up SDIO_CLK and SDIO_DATA_[0:3]/SDIO_CMD to VDD_IO with resistors respectively. Value range of these resistors should be 10–100 kΩ and the recommended value is 10 kΩ.

  • Page 24: Uart

    Wi-Fi&Bluetooth Module Series 4.5.1. UART The module supports Bluetooth HCI (Host Controller Interface) UART which supports hardware flow control (RTS/CTS) and can be used for data transmission with the host. The baud rate can be up to 3.25 Mbps. Table 8 : UART Parameters Parameter Description Data Bits Per Frame...

  • Page 25: Rf Antenna Interfaces

    Wi-Fi&Bluetooth Module Series 4.6. RF Antenna Interfaces Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.

  • Page 26: Rf Routing Guidelines

    Wi-Fi&Bluetooth Module Series ANT_WIFI/BT Module Figure 8 : Reference Circuit for RF Antenna Interface 4.6.2. RF Routing Guidelines For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).
  • Page 27 Wi-Fi&Bluetooth Module Series Figure 11 : Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 12 : Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫...

  • Page 28: Rf Connector Recommendation

    Wi-Fi&Bluetooth Module Series 4.6.3. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 13: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector.
  • Page 29 Wi-Fi&Bluetooth Module Series The following figure describes the space factor of mated connectors. Figure 15 : Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FCS960K-N_Hardware_Design 28 / 46...

  • Page 30: Electrical Characteristics & Reliability

    Wi-Fi&Bluetooth Module Series Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 10 : Absolute Maximum Ratings (Unit: V) Parameter Min. Max. VBAT -0.3 VDD_IO -0.3 Voltage at Digital Pins -0.3 5.2. Power Supply Ratings Table 11 : Module Power Supply Ratings (Unit: V) Parameter Description Condition...

  • Page 31: Power Consumption

    Wi-Fi&Bluetooth Module Series 5.3. Power Consumption 5.3.1. Wi-Fi Power Consumption Table 12 : Wi-Fi Power Consumption Condition Unit VDD_IO VBAT 1.94 302.809 Tx @ 1 Mbps 802.11b 4.084 178.482 Tx @ 11 Mbps 3.384 206.316 Tx @ 6 Mbps 802.11g 6.706 96.536 Tx @ 54 Mbps...

  • Page 32: Bluetooth Power Consumption

    Wi-Fi&Bluetooth Module Series 8.774 309.432 Tx VHT40 @ MCS 0 12.114 144.725 Tx VHT40 @ MCS 9 9.271 297.141 Tx HE20 @ MCS 0 13.301 122.743 Tx HE20 @ MCS 11 802.11ax 10.596 302.692 Tx HE40 @ MCS 0 14.321 125.739 Tx HE40 @ MCS 11 5.3.2.

  • Page 33: Esd Protection

    Wi-Fi&Bluetooth Module Series High-level output voltage 0.7 × VDD_IO Low-level output voltage 0.3 × VDD_IO 5.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative. For example, wear anti-static gloves during the development, production, assembly and testing of the module;...
  • Page 34 Wi-Fi&Bluetooth Module Series Choose a TIM (Thermal Interface Material) with high thermal conductivity, good softness and good wettability and place it between the heatsink and the module; Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation.

  • Page 35: Mechanical Information

    Wi-Fi&Bluetooth Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 17 : Top and Side Dimensions FCS960K-N_Hardware_Design 34 / 46...
  • Page 36 Wi-Fi&Bluetooth Module Series Figure 18 : Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FCS960K-N_Hardware_Design 35 / 46...

  • Page 37: Recommended Footprint

    Wi-Fi&Bluetooth Module Series 6.2. Recommended Footprint Figure 19 : Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCS960K-N_Hardware_Design 36 / 46...

  • Page 38: Top And Bottom Views

    6.3. Top and Bottom Views Figure 20 : Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCS960K-N_Hardware_Design 37 / 46...

  • Page 39: Storage, Manufacturing & Packaging

    Wi-Fi&Bluetooth Module Series Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 40: Manufacturing And Soldering

    Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
  • Page 41 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2].

  • Page 42: Packaging Specifications

    Wi-Fi&Bluetooth Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 7.3.1.

  • Page 43: Plastic Reel

    Wi-Fi&Bluetooth Module Series 7.3.2. Plastic Reel Figure 23 : Plastic Reel Dimension Drawing Table 18: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 24.5 7.3.3. Mounting Direction Figure 24 : Mounting Direction FCS960K-N_Hardware_Design 42 / 46...

  • Page 44: Packaging Process

    Wi-Fi&Bluetooth Module Series 7.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules.

  • Page 45: Appendix References

    Wi-Fi&Bluetooth Module Series Appendix References Table 19 : Related Documents Document Name [1] Quectel_RF_Layout_Application_Note [2] Quectel_Module_SMT_Application_Note Table 20 : Terms and Abbreviations Abbreviation Description 1T1R One Transmit One Receive Access Point Bluetooth Low Energy BPSK Binary Phase Shift Keying Basic Rate Complementary Code Keying Clear To Send DPSK...
  • Page 46 Wi-Fi&Bluetooth Module Series Error Vector Magnitude GFSK Gauss Frequency Shift Keying Ground Host Controller Interface High Efficiency Human Body Model High Throughput IEEE Institute of Electrical and Electronics Engineers Input/Output Leadless Chip Carrier (package) Mbps Million Bits Per Second Modulation and Coding Scheme Moisture Sensitivity Levels Printed Circuit Board Pulse Code Modulation...
  • Page 47 Wi-Fi&Bluetooth Module Series Surface Mount Technology Station To Be Determined Transient Voltage Suppressor Transmit UART Universal Asynchronous Receiver/Transmitter Universal Serial Bus Very High Throughput High-level Input Voltage Low-level Input Voltage Vmax Maximum Voltage Vmin Minimum Voltage Vnom Nominal Voltage High-level Output Voltage Low-level Output Voltage VSWR Voltage Standing Wave Ratio...
  • Page 48 Wi-Fi&Bluetooth Module Series FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.
  • Page 49 Wi-Fi&Bluetooth Module Series that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.
  • Page 50 Wi-Fi&Bluetooth Module Series The host product shall be properly labelled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains”...

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