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Quectel FCU760K-N Hardware Design

Quectel FCU760K-N Hardware Design

Wi-fi & bluetooth module
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FCU760K-N
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2023-06-27
Status: Preliminary

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Summary of Contents for Quectel FCU760K-N

  • Page 1 FCU760K-N Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-06-27 Status: Preliminary...

  • Page 2: Legal Notices

    Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...

  • Page 3: Third-Party Rights

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description 2023-06-27 Echo XIANG/James XIONG Creation of the document 1.0.0 2023-06-27 Echo XIANG/James XIONG Preliminary FCU760K-N_Hardware_Design 4 / 45...

  • Page 6: Table Of Contents

    Wi-Fi&Bluetooth Module Series Contents Safety Information ............................3 About the Document ..........................4 Contents ..............................5 Table Index ..............................7 Figure Index ..............................8 Introduction ............................9 Product Overview ..........................10 2.1. Key Features ..........................11 2.2. Functional Diagram ........................12 RF Performances ..........................
  • Page 7 Wi-Fi&Bluetooth Module Series 7.3. Packaging Specifications ......................39 7.3.1. Carrier Tape ........................39 7.3.2. Plastic Reel ........................40 7.3.3. Mounting Direction ......................40 7.3.4. Packaging Process ....................... 41 Appendix References ........................42 FCU760K-N_Hardware_Design 6 / 45...
  • Page 8 Wi-Fi&Bluetooth Module Series Table Index Table 1: Basic Information ......................... 10 Table 2: Key Features ..........................11 Table 3: Wi-Fi Performances ........................13 Table 5: Bluetooth Performances ......................15 Table 7: I/O Parameters Definition ......................17 Table 8: Pin Description ..........................17 Table 9: Antenna Design Requirements ....................
  • Page 9 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ........................12 Figure 2: Pin Assignment (Top View) ......................16 Figure 3: Reference Circuit of Power Supply ..................... 19 Figure 4: Power-up Timing ......................... 19 Figure 5: Wi-Fi Application Interface Connection ..................20 Figure 6: Bluetooth Application Interface Connection ................

  • Page 10: Introduction

    Wi-Fi&Bluetooth Module Series Introduction This document defines the FCU760K-N and describes its air interfaces and hardware interfaces which are connected with your applications. With this document, you can quickly understand module interface specifications, electrical and mechanical details, as well as other related information of the module. The document, coupled with application notes and user guides, makes it easy to design and set up mobile applications with the module.

  • Page 11: Product Overview

    Wi-Fi&Bluetooth Module Series Product Overview FCU760K-N is a low-energy, high-performance IEEE 802.11a/b/g/n/ac/ax Wi-Fi 6 and Bluetooth 5.4 module. It supports 2.4 GHz, 5 GHz Wi-Fi and 1T1R with maximum data transmission rate up to 286.8 Mbps. It provides USB 2.0 interface for Wi-Fi function and Bluetooth function.

  • Page 12: Key Features

    Within this range, the module’s indicators comply with IEEE and Bluetooth specification requirements. The dedicated Bluetooth antenna interface is optional. For more details, contact Quectel Technical Support. FCU760K-N_Hardware_Design...

  • Page 13: Functional Diagram

    Wi-Fi&Bluetooth Module Series 2.2. Functional Diagram Figure 1 : Functional Diagram NOTE The function of UART interface is under development. FCU760K-N_Hardware_Design 12 / 45...

  • Page 14: Rf Performances

    Wi-Fi&Bluetooth Module Series RF Performances 3.1. Wi-Fi Performances Table 3: Wi-Fi Performances Operating Frequency 2.4 GHz: 2.400–2.4835 GHz 5 GHz: 5.150–5.850 GHz Modulation DSSS、CCK、BPSK、QPSK、16QAM、64QAM、256QAM、1024QAM Operating Mode   Transmission Data Rate  802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps ...

  • Page 15: Bluetooth Performances

    Wi-Fi&Bluetooth Module Series 802.11n, HT20 @ MCS 7 ≤ -27 dB 802.11n, HT40 @ MCS 0 ≤ -5 dB 802.11n, HT40 @ MCS 7 ≤ -27 dB 802.11ax, HE20 @ MCS 0 ≤ -5 dB 802.11ax, HE20 @ MCS 11 ≤...
  • Page 16 Wi-Fi&Bluetooth Module Series Table 4: Bluetooth Performances Operating Frequency 2.400–2.4835 GHz Modulation GFSK, 8-DPSK, π/4-DQPSK Operating Mode  Classic Bluetooth (BR + EDR)  Bluetooth Low Energy (BLE) Unit: dBm, Tolerance: ±2 dB Condition Receiving Sensitivity @ Typ. EDR (π/4-DQPSK) EDR (8-DPSK) BLE (1 Mbps) BLE (2 Mbps)

  • Page 17: Application Interfaces

    Wi-Fi&Bluetooth Module Series Application Interfaces 4.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE 1. Keep all RESERVED or unused pins unconnected. 2. The function of UART interface is under development. FCU760K-N_Hardware_Design 16 / 45...

  • Page 18: Pin Description

    Wi-Fi&Bluetooth Module Series 4.2. Pin Description Table 5: I/O Parameters Definition Type Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 6: Pin Description Power Supply Pin Name Pin No. Description DC Characteristics Comment...

  • Page 19: Power Supply

    RESERVED Keep it open. *ANT_BT is not used in FCU760K-N module’s CE testing. It’s just reserved for client’s design. 4.3. Power Supply The module is powered by VBAT. It is recommended to use a 3.3 V power supply chip with sufficient up to 0.5 A.
  • Page 20 Wi-Fi&Bluetooth Module Series Figure 3: Reference Circuit of Power Supply The power-up timing of the module is shown below. 200 μ s 8 ms VBAT CHIP_EN Power-up Power-off Power-up Power-off Power-off Figure 4: Power-up Timing FCU760K-N_Hardware_Design 19 / 45...

  • Page 21: Wi-Fi/Bluetooth Application Interface

    Wi-Fi&Bluetooth Module Series 4.4. Wi-Fi/Bluetooth Application Interface The module provides USB 2.0 interface communicating with the host for Wi-Fi/Bluetooth function. Figure 5: Wi-Fi Application Interface Connection Figure 6: Bluetooth Application Interface Connection FCU760K-N_Hardware_Design 20 / 45...

  • Page 22: Usb Interface

    Analysis, evaluation and determination are still necessary when designing target products. The module provides two antenna pins (ANT_WIFI/BT, ANT_BT), among which the ANT_BT is optional for two-antenna module (FCU760K-N). The impedance of antenna port is 50 Ω. FCU760K-N_Hardware_Design 21 / 45...

  • Page 23: Reference Design

    Wi-Fi&Bluetooth Module Series Table 7: Antenna Design Requirements Parameter Requirement  2.400–2.4835 Frequency Ranges (GHz) 5.150–5.850  Cable Insertion Loss (dB) < 1 VSWR ≤ 2 (Typ.) 2.4GHZ : ≤0.73 dBi Gain (dBi) 5G HZ: ≤ 1.14dBi Max Input Power (W) Input Impedance (Ω) Polarization Type Vertical...

  • Page 24: Rf Routing Guidelines

    Wi-Fi&Bluetooth Module Series 4.5.2. RF Routing Guidelines For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).

  • Page 25: Rf Connector Recommendation

    Wi-Fi&Bluetooth Module Series Figure 12: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design:  Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.
  • Page 26 Wi-Fi&Bluetooth Module Series Figure 13: Dimensions of the Receptacle (Unit: mm) U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 14: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. FCU760K-N_Hardware_Design 25 / 45...
  • Page 27 Wi-Fi&Bluetooth Module Series Figure 15: Space Factor of Mated Connectors (Unit: mm) For more details, please visit http://www.hirose.com. FCU760K-N_Hardware_Design 26 / 45...

  • Page 28: Electrical Characteristics & Reliability

    Wi-Fi&Bluetooth Module Series Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 8: Absolute Maximum Ratings (Unit: V) Parameter Min. Max. VBAT -0.3 Voltage at Digital Pins -0.3 5.2. Power Supply Ratings Table 9: Module Power Supply Ratings (Unit: V) Parameter Min.

  • Page 29: Power Consumption

    Wi-Fi&Bluetooth Module Series Table 10: Electrostatics Discharge Characteristics (Unit: kV) Model Test Result Standard Human Body Model (HBM) > ±3 ESDA/JEDEC JS-001-2017 Charged Device Model (CDM) > ±0.8 ESDA/JEDEC JS-002-2018 5.4. Power Consumption 5.4.1. Wi-Fi Power Consumption Table 11: Wi-Fi Power Consumption Protocol Condition Unit...

  • Page 30: Bluetooth Power Consumption

    Wi-Fi&Bluetooth Module Series 306.54 Tx HT20 @ MCS 0 164.02 Tx HT20 @ MCS 7 802.11n 276.46 Tx HT40 @ MCS 0 135.03 Tx HT40 @ MCS 7 306.35 Tx VHT20 @ MCS 0 148.78 Tx VHT20 @ MCS 8 802.11ac 310.60 Tx VHT40 @ MCS 0...

  • Page 31: Digital I/O Characteristics

    Wi-Fi&Bluetooth Module Series 5.54 75.57 BLE (2 Mbps) 5.06 75.69 5.5. Digital I/O Characteristics Table 13: Digital I/O Characteristics (Unit: V) Parameter Description Min. Max. High-level Input Voltage 0.7 × VBAT VBAT Low-level Input Voltage 0.3 × VBAT High-level Output Voltage Low-level Output Voltage 5.6.
  • Page 32 Wi-Fi&Bluetooth Module Series Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Screw Heatsink Heatsink Module Module Figure 16: Placement and Fixing of the Heatsink FCU760K-N_Hardware_Design 31 / 45...

  • Page 33: Mechanical Information

    Wi-Fi&Bluetooth Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 17: Top and Side Dimensions NOTE The package warpage level of the module conforms to JEITA ED-7306 standard.
  • Page 34 Wi-Fi&Bluetooth Module Series Figure 18: Bottom Dimension (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. FCU760K-N_Hardware_Design 33 / 45...

  • Page 35: Recommended Footprint

    Wi-Fi&Bluetooth Module Series 6.2. Recommended Footprint Figure 19: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCU760K-N_Hardware_Design 34 / 45...

  • Page 36: Top And Bottom Views

    6.3. Top and Bottom Views Figure 20: Top and Bottom Views NOTE Images above are for illustrative purposes only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCU760K-N_Hardware_Design 35 / 45...

  • Page 37: Storage, Manufacturing & Packaging

    Wi-Fi&Bluetooth Module Series Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

  • Page 38: Manufacturing And Soldering

    Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
  • Page 39 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2].

  • Page 40: Packaging Specifications

    Wi-Fi&Bluetooth Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 7.3.1.

  • Page 41: Plastic Reel

    Wi-Fi&Bluetooth Module Series 7.3.2. Plastic Reel Figure 23: Plastic Reel Dimension Drawing Table 16: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 32.5 7.3.3. Mounting Direction Figure 24: Mounting Direction FCU760K-N_Hardware_Design 40 / 45...

  • Page 42: Packaging Process

    Wi-Fi&Bluetooth Module Series 7.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules. Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it.

  • Page 43: Appendix References

    Wi-Fi&Bluetooth Module Series Appendix References Table 17: Related Documents Document Name [1] Quectel_RF_Layout_Application_Note [2] Quectel_Module_SMT_Application_Note Table 18: Terms and Abbreviations Abbreviation Description Access Point Bluetooth Low Energy BPSK Binary Phase Shift Keying Basic Rate Complementary Code Keying DPSK Differential Phase Shift Keying DQPSK Differential Quadrature Phase Shift Keying DSSS...
  • Page 44 Wi-Fi&Bluetooth Module Series High Efficiency High Throughput IEEE Institute of Electrical and Electronics Engineers Input/Output Mbps Million Bits Per Second Modulation and Coding Scheme Moisture Sensitivity Levels Printed Circuit Board Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RoHS Restriction of Hazardous Substances Serial Port Profile Station Receive...
  • Page 45 Wi-Fi&Bluetooth Module Series Vmax Maximum Voltage Vmin Minimum Voltage Vnom Normal Voltage High-level Output Voltage Low-level Output Voltage VSWR Voltage Standing Wave Ratio Wi-Fi Wireless Fidelity FCU760K-N_Hardware_Design 44 / 45...
  • Page 46 Wi-Fi&Bluetooth Module Series FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.
  • Page 47 Wi-Fi&Bluetooth Module Series that changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as on a computer disk or over the Internet, the information required by this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form.
  • Page 48 Wi-Fi&Bluetooth Module Series The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number for the module, preceded by the word “Contains”...

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