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3.3 Functional Specification
3.3.1 Technical Data
Function
Definition
Compliance
COM HPC Client, Size A
Dimension
120mm x 95 mm
(H X W)
Processors
Board comes Intel® 12
Chipset
lntel® 600/700 Series Chipset Family - On-Package Platform Controller Hub
Main Memory
2x DDR5 SODIMM dual channel up to 64 GByte ECC or non ECC
Graphics Controller Intel® Iris XeGraphics architecture with up to 96 EUs, 4 Independent Displays (up to 8K)
DDI1: DP++
DDI2: DP++
Displays
DDI3: DP++
eDP
Ethernet Controller 2x Intel® I226
Ethernet
Up to 2x 2.5 Gb Ethernet with TSN support
Storage
2x SATA 6 Gb/s (optional)
Flash On-board
Up to 1 TByte NVMe SSD (on request)
1x 8 PCIe Gen 4.0 (Alder Lake H-Series, 35-45 W)
2x 4 PCIe Gen 4.0 → 1×4 shared with onboard NVMe
PCI Express
8x PCIe Gen3.0
Optional 1x PCIe for BMC
2x USB 4.0/ Thunderbolt ™; 2x USB 3.2
USB
8x USB 2.0
Serial
2x serial interface (RX/TX only)
Other Features
(G) SPI, SMB, Fast I²C, Staged Watchdog, RTC
Special Features
Trusted Platform Module (TPM) 2.0
vPRO (AMT/TXT/AES Support), up to 3x PCIe x1 additional w/o Ethernet & SATA, NVMe SSD, Fail Save via 2nd SPI
Features on Request
Flash
Power Management ACPI 6.0
Power Supply
8.0 V – 20 V Wide Range, Single Supply Power
BIOS
AMI UEFI
Operating Systems
Windows®10, Linux
Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
Temperature
Optional E1: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating
E2: NA
Humidity
93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)
Table 7: Technical Data
www.kontron.com
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generation Alderlake H/P/U Core® I processors
COMh-caAP User Guide
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