Table Of Contents - Kontron COMh-caRP User Manual

Table of Contents

1. General Information
1.1 Disclaimer ................................................................................................................................
1.2 Intended Use
1.3 Terms and Conditions
1.4 Customer Support
1.5 Customer Service
1.6 Customer Comments
1.7 Symbols ....................................................................................................................................
1.8 For Your Safety
1.9 High Voltage Safety Instructions
1.10 Special Handling and Unpacking Instruction
1.11 Lithium Battery Precautions
1.12 General Instructions on Usage
1.13 Quality and Environmental Management
1.13.1 Disposal and Recycling
1.13.2 WEEE Compliance
2. Introduction ..................................................................................................................................
2.1 Product Naming Clarification
2.2 Product description
2.3 COM-HPC® Documentation
2.4 COM-HPC® Client Functionality
2.5 COM-HPC® Benefits
3. Product specification
3.1 Module Variants
3.1.1 Commercial Grade Modules (0°C to +60°C)
3.1.2 Extended temperature Grade Modules (E1, -25°C to 75°C)
3.1.3 Industrial Temperature Grade Modules (E2, -40°C to +85°C)
3.2 Accessories ............................................................................................................................
3.2.1 Cooling ...............................................................................................................................
3.2.2 Evaluation Carrier
3.2.3 SO-DIMM Memory
3.3 Functional Specification
3.3.1 Technical Data
3.3.2 Block Diagram
3.3.3 Front Side ...........................................................................................................................
3.3.4 Back Side ...........................................................................................................................
3.3.5 Processor (CPU)
3.3.6 System Memory
3.3.7 High-Speed Interface Overview
3.4 Interfaces ...............................................................................................................................
3.4.1 PCIe ....................................................................................................................................
3.4.2 USB ....................................................................................................................................
3.4.5 Graphics Interfaces
3.4.3 SATA ..................................................................................................................................
3.4.6 Audio Interfaces
3.4.7 UART ..................................................................................................................................
3.4.8 General Purpose SPI interface
3.4.9 Boot SPI ..............................................................................................................................
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COMh-caAP User Guide
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