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5
Design Consideration
5.1.1 Thermal Management
A heatspreader plate assembly is available from Kontron Embedded Modules for the nanoETXexpress-SP. The
heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM Express™-standard thermal interface
to use with a heat sink or other cooling device.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under
worst-case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of
60° C or less.
The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces
between the heatspreader plate and the major heat-generating components on the nanoETXexpress-SP. About 80
percent of the power dissipated within the module is conducted to the heatspreader plate and can be removed by the
cooling solution.
You can use many thermal-management solutions with the heatspreader plates, including active and passive
approaches. The optimum cooling solution varies, depending on the COM Express™ application and environmental
conditions. Please see the COM Express™ Design Guide for further information on thermal management.
5.1.2 Heatspreader
Documentation of nanoETXexpress-SP heatspreader and cooling solutions is provided at
http://emdcustomersection.kontron.com.
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nanoETXexpress-SP/Design Consideration
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