Kontron COMh-caRP User Manual page 3

3.4.10 eSPI ..................................................................................................................................
3.4.11 I2C ....................................................................................................................................
3.4.12 GPIO .................................................................................................................................
3.4.13 SMB ..................................................................................................................................
3.5 Features .................................................................................................................................
3.5.1 ACPI Power States
3.5.2 Embedded Controller - Hardware Monitor
3.5.3 TPM ....................................................................................................................................
3.5.4 Watchdog ...........................................................................................................................
3.5.5 Real-Time Clock (RTC)
3.5.6 NVME .................................................................................................................................
3.5.7 Features on Request
3.6 Electrical Specification
3.6.1 Power Supply Specification
3.6.2 Power Management
3.7 Thermal Management
3.7.1 Heatspreader Plate Assembly
3.7.2 Active/Passive Cooling Solutions
3.7.3 Operating with Kontron Heatspreader Plate (HSP) Assembly
3.7.4 Operating without Kontron Heatspreader Plate (HSP) Assembly
3.7.5 Temperature Sensors
3.7.6 On-Module Fan Connector
3.8 Mechanical Specification
3.8.1 Module Dimensions
3.8.2 Module Height
3.8.3 Heatspreader Plate Assembly Dimension
3.9 Environmental Specification
3.10 Compliance
3.11 MTBF .....................................................................................................................................
4. COM-HPC Interface Connector
4.1 Connecting COM-HPC Interface Connector to Carrier Board
4.2 J1 and J2 signals
4.3 Connector J1
4.3.1 Pins A1 - A100
4.3.2 Pins B1 - B100
4.3.3 Pins C1 - C100
4.3.4 Pins D1 - D100
4.4 Connector J2
4.4.1 Pins E1 - E100
4.4.2 Pins F1 - F100
4.4.3 Pins G1 - G100
4.4.4 Pins H1 - H100
5. UEFI BIOS .....................................................................................................................................
5.1 Starting the UEFI BIOS
5.2 Navigating the UEFI BIOS
5.3 Setup Menus
5.4 Getting Help
5.5 UEFI Shell ...............................................................................................................................
5.5.1 Entering the UEFI Shell
5.5.2 Exiting the UEFI Shell
5.6 UEFI Shell Scripting
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COMh-caAP User Guide
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