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3.3.4 Bottom Side
Figure 3: COMh-sdID Bottom Side
1.
COM-HPC connectors
2.
4 mounting holes - for heatspreader mounting to module backplate (Kontron specific)
3.
4 mounting holes - for module mounting to carrier
4.
4 mounting holes - for heatspreader to module, module to carrier mounting
3.3.5 Processor (CPU)
The COMh-sdID is based on the Intel® Xeon® D-2700 processor family, the next generation System-
on-Chip (SoC) with processor cores built using Intel 10-nanometer process technology. The three
major complexes in this highly-integrated SoC are referred to as CPU, PCH and NAC.
The Central Processing Unit (CPU) complex contains up to 20 next-generation 64-bit processor cores
(code name Ice Lake Server).
The Platform Controller Hub (PCH) of the SoC is architected with a rich set of interconnect
technologies.
The Network Accelerator Complex (NAC) includes technologies for security and packet processing.
The SoC architecture is highly scalable and efficient, providing a unified solution across an array of
products. Product SKUs are targeted for long life supply availability with extended reliability in
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