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Super X13DSF-A User's Manual
Motherboard Features
CPU
•
Supports dual 4th Gen. Intel Xeon Scalable Processors (in Socket E LGA 4677) with four UPIs (16GT/s max.) and a
thermal design power (TDP) of up to 270W
Note: Please refer to your X13 motherboard specification to choose proper processors. Also, please be sure to use
the same processors on a multi-socket motherboard.
Memory
•
Supports up to 8TB memory capacity with 32DIMMs of 256Gb 3DS RDIMM/RDIMM DDR5 ECC memory
Note: Memory speed and capacity support depend on the processors used in the system.
DIMM Size
•
Up to 256Gb DDR5 memory module
Note: For the latest CPU/memory updates, please refer to our website at
motherboard.
Chipset
•
Intel C741 chipset
Expansion Slots
•
Two GenZ x16 PCIe 5.0 slots: P1_PE1 0-15 (J1) and P2_PE1 0-15 (J3)
•
Twelve PCIe 5.0 x8 MCIO NVMe connectors with support of 24 connections (P1_NVME0/1 – P1_NVME10/11, P2_
NVME0/1 – P2_NVME10/11)
•
Two NVMe PCIe 3.0 x4 / SATA 3.0 hybrid M.2 slots (support M-Key 2280 and 22110)
•
Two PCIe 5.0 x16 AIOM connectors (OCP 3.0 SFF compliant; for rear I/O support): P1-AIOM (J139) and P2-AIOM (J7)
•
One SlimSAS connector for rear I/O support via the Supermicro AOM-DSF-IO rear I/O module
Baseboard Management Controller (BMC)/Network
•
ASPEED AST2600 BMC
•
One dedicated BMC LAN port on the Supermicro AOM-DSF-IO rear I/O module
Graphics
•
Graphics controller and VGA support via ASPEED AST2600
I/O Devices
•
One SlimSAS connector with SATA ports 0~3, located at JS1, supports RAID 0, RAID 1, RAID 5, and RAID 10
•
One serial port header (COM1) and one VGA port (VGA) on the Supermicro AOM-DSF-IO rear I/O module
Peripheral Devices
•
Two USB 3.0 ports on the Supermicro AOM-DSF-IO rear I/O module (USB0, USB1)
•
One front-accessible USB header with support of two USB 3.0 connections (USB2, USB3)
Motherboard Features
14
https://www.supermicro.com/products/
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