This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
2.1 Package Components ................................................................................................................... 22
2.3 Name of Each Part ....................................................................................................................... 23
(1) System Configuration ........................................................................................................... 23
(1) Making an MCU File ............................................................................................................ 25
(2) Setting the Work Area .......................................................................................................... 25
(3) Downloading Firmware ........................................................................................................ 26
(4) Self-check ............................................................................................................................. 26
Chapter 2. Preparation
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