Hardware Specifications; L3 Cpu Module (L3Pu11/L3Pu21); Serial I/O Expansion Module (If735) - Toshiba V Series User Manual

A.3 Hardware Specifications
A.3.1

L3 CPU Module (L3PU11/L3PU21)

Processor
Memory ROM
I/O
Communication port
Memory data retention time during
power failure
Current consumption
Size
A.3.2

Serial I/O Expansion Module (IF735)

Memory
Serial bus
Current consumption
Size
6F8C0882
Table A-3 L3 CPU Module Hardware Specifications
Item
General-purpose 32-bit processor
2 MB
RAM 8 MB (DRAM)
2 MB (SRAM with battery backup)
Serial bus One line for standard specification
Expandable with three additional lines (by using IF735)
Direct bus One line for standard specification
Expandable with four additional lines (by using IF741)
RS-232 compliant port × 2 channels
(1) D-sub connector (9 pins)
(2) Modular connector (8 pins)
• Transmission rate: 9600 bps or 19.2 kbps (switched by
30 min or more (with no backup current from the power
supply module)
5 Vdc - 3 A
Mass 1.0 kg or less
249H × 35W × 109.5D (mm)
Dimensions
Table A-4 Serial I/O Expansion Module Hardware Specifications
Item
Buffer RAM
Number of lines
Transmission method
Interface
Transmission rate
Number of connection
nodes
Transmission line length 30 m max. (in console)
Transmission size
Signal code
Redundancy of bus
Terminal resistor
Mass
Dimensions
Specification
software)
Specification
16 KB (SRAM) per channel
3 (Standard)
IEEE802.4 compliant
RS-485 compliant
1 Mbps
15 nodes/channel max.
64 byte max.
Manchester code
Duplex in standard configuration
100 Ω
5 Vdc - 2 A, 3.3 Vdc - 0.5 A
0.5 kg or less
249H × 35W × 109.5D (mm)
A.3 Hardware Specifications
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