Packaging - Quectel EG91 Series Hardware Design

Table 52: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 °C and 200 °C)
Reflow Zone
Max slope
Reflow time (D: over 217 °C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTE
1. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing
into the module.
2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance
for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [8].

8.3. Packaging

EG91 series module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be
opened until the devices are ready to be soldered onto the application.
The reel is 330 mm in diameter and each reel contains 250 modules. The following figures show the
packaging details, measured in mm.
EG91_Series_Hardware_Design
LTE Standard Module Series
Recommendation
1–3 °C/s
70–120 s
2–3 °C/s
40–70 s
235 °C to 246 °C
-1.5 to -3 °C/s
1
100 / 105