Quectel EG91 Series Hardware Design page 15

LTE Standard Module Series
Figure 42: EG91-E Bottom Dimensions (Top View)............................................................................................ 93
Figure 43: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom Dimensions (Top View)................ 94
Figure 44: Recommended Footprint (Top View).................................................................................................. 95
Figure 45: Top View of the Module......................................................................................................................... 96
Figure 46: EG91-E Bottom View.............................................................................................................................96
Figure 47: EG91-AUX/-EX/-NA/-NAL/-NAX/-NAXD/-NAXDL/-VX Bottom View.................................................97
Figure 48: Recommended Reflow Soldering Thermal Profile........................................................................... 99
Figure 49: Tape Dimensions..................................................................................................................................101
Figure 50: Reel Dimensions.................................................................................................................................. 101
Figure 51: Tape and Reel Directions....................................................................................................................102
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EG91_Series_Hardware_Design