Quectel EG91 Series Hardware Design page 91

LTE Standard Module Series
Figure 39: Referenced Heatsink Design (Heatsink at the Top of the Module)
Figure 40: Referenced Heatsink Design (Heatsink at the Backside of Customers' PCB)
NOTE
1. The module offers the best performance when the internal BB chip stays below 105 °C. When the
maximum temperature of the BB chip reaches or exceeds 105 °C, the module works normal but
provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB
chip temperature reaches or exceeds 115 °C, the module will disconnect from the network, and it will
recover to network connected state after the maximum temperature falls below 115 °C. Therefore,
the thermal design should be maximally optimized to make sure the maximum BB chip temperature
always maintains below 105 °C. You can execute AT+QTEMP and get the maximum BB chip
temperature from the first returned value.
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EG91_Series_Hardware_Design