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Quectel EG06 Series Manual

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EG06
Manual
LTE-A Module Series
Rev. EG06_Hardware_Design_V1.0
Date: 2018-05-16
Status: Released

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Summary of Contents for Quectel EG06 Series

  • Page 1 EG06 Manual LTE-A Module Series Rev. EG06_Hardware_Design_V1.0 Date: 2018-05-16 Status: Released...
  • Page 2 www.quectel.com...
  • Page 3 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 4: About The Document

    LTE-A Module Series EG06 Hardware Design About the Document History Revision Date Author Description King MA/ 2018-04-11 Initial Wison HE EG06_Hardware_Design 2 / 89...

  • Page 5: Table Of Contents

    LTE-A Module Series EG06 Hardware Design Contents About the Document ........................... 2 Contents ............................... 3 Table Index ..............................6 Figure Index ..............................8 Introduction ............................10 1.1. Safety Information........................11 Product Concept ..........................13 2.1. General Description ......................... 13 2.2. Key Features ...........................
  • Page 6 LTE-A Module Series EG06 Hardware Design 3.16. Behavior of the RI ........................54 3.17. PCIe Interface* ........................55 3.18. WLAN Control Interface* ......................56 3.19. SD Card Interface ........................57 3.20. SPI Interface ..........................59 3.21. USB_BOOT Interface ......................60 GNSS Receiver ...........................
  • Page 7 LTE-A Module Series EG06 Hardware Design 10.6. USERS MANUAL OF THE END PRODUCT: ................. 94 10.7. LABEL OF THE END PRODUCT: ................... 95 EG06_Hardware_Design 5 / 89...
  • Page 8 LTE-A Module Series EG06 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EG06 SERIES MODULE ............... 13 TABLE 2: KEY FEATURES OF EG06 MODULE ....................14 TABLE 3: I/O PARAMETERS DEFINITION ...................... 20 TABLE 4: PIN DESCRIPTION ........................... 20 TABLE 5: OVERVIEW OF OPERATING MODES ....................
  • Page 9 LTE-A Module Series EG06 Hardware Design TABLE 42: TERMS AND ABBREVIATIONS ..................... 89 EG06_Hardware_Design 7 / 89...
  • Page 10 LTE-A Module Series EG06 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ....................... 17 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) ....................19 FIGURE 3: DRX RUN TIME AND CURRENT CONSUMPTION IN SLEEP MODE ......... 31 FIGURE 4: SLEEP MODE APPLICATION VIA UART ..................32 FIGURE 5: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP ............
  • Page 11 LTE-A Module Series EG06 Hardware Design FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS ................72 FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ............73 FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ....81 FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB) ...................................

  • Page 12: Introduction

    LTE-A Module Series EG06 Hardware Design Introduction This document defines the EG06 module and describes its air interface and hardware interface which are connected with customers’ applications. This document can help customers quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EG06 module. Associated with application note and user guide, customers can use EG06 module to design and set up mobile applications easily.

  • Page 13: Safety Information

    If not so, Quectel assumes no liability for the customers’ failure to comply with these precautions.
  • Page 14 LTE-A Module Series EG06 Hardware Design Please do not discard. Maybe wireless devices have an impact on the environment so please do not arbitrarily discarded. EG06_Hardware_Design 12 / 89...

  • Page 15: Product Concept

    EG06 contains five variants: EG06-E, EG06-A, EG06-LA, EG06-APAC and EG06-AUTL. Customers can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EG06 series module. Table 1: Frequency Bands of EG06 Series Module...

  • Page 16: Key Features

    QZSS NOTES GNSS function is optional. EG06 series module (EG06-E/EG06-A/EG06-LA/EG06-APAC/EG06-AUTL) contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. B32 and B29 support Rx only, and in 2×CA they are only for secondary component carrier.
  • Page 17 LTE-A Module Series EG06 Hardware Design FDD: Max 300Mbps (DL)/50Mbps (UL) TDD: Max 226Mbps (DL)/28Mbps (UL) Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA Support QPSK, 16-QAM and 64-QAM modulation UMTS Features DC-HSDPA: Max 42Mbps (DL) HSUPA: Max 5.76Mbps (UL) WCDMA: Max 384Kbps (DL)/384Kbps (UL) Support PPP/QMI/TCP*/UDP*/FTP*/HTTP*/NTP*/PING*/HTTPS*/SMTP*/ MMS*/FTPS*/SMTPS*/SSL* protocols...

  • Page 18: Functional Diagram

    Used for Ethernet or WLAN communication Rx-diversity Support LTE/WCDMA Rx-diversity Gen8C-Lite of Qualcomm GNSS Features Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT AT Commands commands Two pins including NET_MODE and NET_STATUS to indicate network Network Indication connectivity status...

  • Page 19: Evaluation Board

    NOTE “*” means under development. 2.4. Evaluation Board In order to help customers develop applications with EG06, Quectel supplies an evaluation board (EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. EG06_Hardware_Design...

  • Page 20: Application Interface

    LTE-A Module Series EG06 Hardware Design Application Interface 3.1. General Description EG06 is equipped with 299-pin LGA pads that can be connected to cellular application platform. Sub-interfaces included in these pads are described in detail in the following chapters:  Power supply ...

  • Page 21: Pin Assignment

    LTE-A Module Series EG06 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EG06 module. VBAT_RF VBAT_RF VBAT_RF VBAT_RF RESERVED VDD_P2 DBG_RXD DBG_TXD GPIO1 SPI_CLK GPIO2 SPI_CS USB_BOOT SPI_MISO SPI_MOSI OTG_PWR_EN SLEEP_IND RESERVED COEX_UART_TX RESERVED COEX_UART_RX RESERVED RESERVED NET_MODE...

  • Page 22: Pin Description

    LTE-A Module Series EG06 Hardware Design NOTES Keep all RESERVED pins and unused pins unconnected. GND pads 215~299 should be connected to ground in the design. 3.3. Pin Description The following tables show the pin definition and description of EG06 module. Table 3: I/O Parameters Definition Type Description...
  • Page 23 LTE-A Module Series EG06 Hardware Design Power supply for Provide 1.8V for Vnorm=1.8V external GPIO’s pull up VDD_EXT external circuit. max=50mA circuits. If an SD card is used, connect VDD_P2 to It is determined by SD_VDD. VDD_P2 external circuit. If an eMMC* is used, connect VDD_P2 to VDD_EXT.
  • Page 24 LTE-A Module Series EG06 Hardware Design Status Indication Pin Name Pin No. Description DC Characteristics Comment Indicate the 1.8V power domain. min=1.35V STATUS module’s operation If unused, keep it max=0.45V status. open. Indicate the 1.8V power domain. min=1.35V module’s network NET_MODE If unused, keep it max=0.45V...
  • Page 25 LTE-A Module Series EG06 Hardware Design OTG_PWR_ max=0.45V OTG power control min=1.35V (U)SIM Interface Pin Name Pin No. Description DC Characteristics Comment Specified ground USIM_GND for (U)SIM card For 1.8V (U)SIM: Vmax=1.9V Vmin=1.7V Either 1.8V or 3.0V is Power supply for supported by the USIM_VDD (U)SIM card...
  • Page 26 LTE-A Module Series EG06 Hardware Design UART Interface Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain. max=0.45V Ring indicator If unused, keep it min=1.35V open. 1.8V power domain. Data carrier max=0.45V If unused, keep it detection min=1.35V open.
  • Page 27 LTE-A Module Series EG06 Hardware Design max=2.0V 1.8V power domain. max=0.45V BT_CTS Clear to send If unused, keep it min=1.35V open. 1.8V power domain. BT function max=0.45V Keep it open. BT_EN* enabled min=1.35V This function is under development Debug UART Interface Pin Name Pin No.
  • Page 28 LTE-A Module Series EG06 Hardware Design max=2.0V 1.8V power domain. max=0.45V In master mode, it is min=1.35V an output signal. In min=-0.3V slave mode, it is an PCM_CLK PCM clock max=0.6V input signal. If unused, keep it min=1.2V open. max=2.0V An external pull-up I2C serial clock resistor is required.
  • Page 29 LTE-A Module Series EG06 Hardware Design PCIe transmission If unused, keep it PCIE_TX_P - plus open. PCIe receiving- If unused, keep it PCIE_RX_M minus open. PCIe receiving - If unused, keep it PCIE_RX_P plus open. max=0.45V In master mode, it is min=1.35V an input signal.
  • Page 30 LTE-A Module Series EG06 Hardware Design 1.8V power domain. COEX_UART_ LTE/WLAN max=0.45V If unused, keep it coexistence signal min=1.35V open. WLAN_SLP_ max=0.45V If unused, keep it WLAN sleep clock min=1.35V open. SD Card Interface Pin Name Pin No. Description DC Characteristics Comment Either 1.8V or 3.0V is For 1.8V SD:...
  • Page 31 LTE-A Module Series EG06 Hardware Design Main antenna 50Ω impedance. ANT_MAIN interface 50Ω impedance. GNSS antenna ANT_GNSS If unused, keep it interface open. GPIO Pins Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain. min=-0.3V Pull-up by default. max=0.6V Low level wakes up WAKEUP_IN...

  • Page 32: Operating Modes

    LTE-A Module Series EG06 Hardware Design 14, 15, 18~23, 71~74, 95, RESERVED 101, 113, Reserved Keep these pins 115, 134, unconnected. 152, 159, 161, 162, 172, 176, 192~195 3.4. Operating Modes The table below briefly summarizes the various operating modes referred in the following chapters. Table 5: Overview of Operating Modes Mode Details...

  • Page 33: Power Saving

    LTE-A Module Series EG06 Hardware Design 3.5. Power Saving 3.5.1. Sleep Mode DRX on EG06 is able to reduce the current consumption to a minimum value during the sleep mode, and DRX cycle index values are broadcasted by the wireless network. The figure below shows the relationship between the DRX run time and the current consumption in sleep mode.

  • Page 34: Usb Application With Usb Remote Wakeup Function

    LTE-A Module Series EG06 Hardware Design Host Module EINT GPIO Figure 4: Sleep Mode Application via UART  Driving the host DTR to low level will wake up the module.  When EG06 has a URC to report, RI signal will wake up the host. Please refer to Chapter 3.16 for details about RI behavior.

  • Page 35: Usb Application With Usb Suspend/Resume And Ri Function

    LTE-A Module Series EG06 Hardware Design 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend/resume, but does not support remote wake-up function, the RI signal is needed to wake up the host. There are three preconditions to let the module enter into the sleep mode. ...

  • Page 36: Airplane Mode

    LTE-A Module Series EG06 Hardware Design The following figure shows the connection between the module and the host. Module Host GPIO Power USB_VBUS Switch USB_DP USB_DP USB_DM USB_DM EINT Figure 7: Sleep Mode Application without Suspend Function Switching on the power switch to supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host.

  • Page 37: Power Supply

    LTE-A Module Series EG06 Hardware Design 2. The execution of AT+CFUN command will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EG06 provides six VBAT pins dedicated to connect with the external power supply. There are two separate voltage domains for VBAT.

  • Page 38: Decrease Voltage Drop

    LTE-A Module Series EG06 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure the input voltage will never drop below 3.3V. The following figure shows the voltage drop during Tx power in 3G and 4G networks. Burst Burst Transmission...

  • Page 39: Reference Design For Power Supply

    LTE-A Module Series EG06 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply of EG06 should be able to provide sufficient current up to 2A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.
  • Page 40 LTE-A Module Series EG06 Hardware Design Table 7: PWRKEY Pin Description Pin Name Pin No. Description DC Characteristics Comment max=2.1V The output voltage is 0.8V PWRKEY Turn on/off the module min=1.3V because it is pulled up to an max=0.5V internal voltage (800mV). When EG06 is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500ms.

  • Page 41: Turn Off Module

    LTE-A Module Series EG06 Hardware Design The turn on scenario is illustrated in the following figure. NOTE VBAT ≥500ms ≥1.3V PWRKEY ≤0.5V RESET_N ≥11.5s STATUS ≥13s UART Inactive Active ≥14s Inactive Active Figure 13: Timing of Turning on Module NOTE Please make sure that VBAT is stable before pulling down PWRKEY pin.

  • Page 42: Turn Off Module Using At Command

    LTE-A Module Series EG06 Hardware Design VBAT ≥800ms ≥30s PWRKEY STATUS Module Power-down procedure RUNNING Status Figure 14: Timing of Turning off Module 3.7.2.2. Turn off Module Using AT Command It is also a safe way to use AT+QPOWD command to turn off the module, which is similar to turning off the module via PWRKEY Pin.
  • Page 43 LTE-A Module Series EG06 Hardware Design Table 8: RESET_N Pin Description Pin Name Pin No. Description DC Characteristics Comment max=2.1V RESET_N Reset the module min=1.3V max=0.5V The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N.

  • Page 44: U)Sim Interface

    LTE-A Module Series EG06 Hardware Design The reset scenario is illustrated in the following figure. VBAT ≤600ms ≥250ms ≥1.3V RESET_N ≤0.5V Module Running Resetting Restart Status Figure 17: Timing of Resetting Module NOTES Use RESET_N only when turning off the module by AT+QPOWD command and PWRKEY pin failed. Ensure that there is no large capacitance on PWRKEY and RESET_N pins.
  • Page 45 LTE-A Module Series EG06 Hardware Design EG06 supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections, and is disabled by default. Please refer to document [1] about AT+QSIMDET command for details. The following figure shows a reference design for (U)SIM card interface with an 8-pin (U)SIM card connector.

  • Page 46: Usb Interface

    LTE-A Module Series EG06 Hardware Design In order to enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in the (U)SIM circuit design:  Keep placement of (U)SIM card connector to the module as close as possible. Keep the trace length as less than 200mm as possible.
  • Page 47 LTE-A Module Series EG06 Hardware Design USB_SS_ USB 3.0 super-speed transmit - minus TX_M USB_SS_ USB 3.0 super-speed receive -plus RX_P Require differential impedance of 90Ω USB_SS_ USB 3.0 super-speed receive -minus RX_M OTG_PWR_ OTG power control Ground For more details about the USB 2.0&3.0 specifications, please visit http://www.usb.org/home. The USB interface is recommended to be reserved for firmware upgrade in customers’...

  • Page 48: Uart Interfaces

    LTE-A Module Series EG06 Hardware Design other. The extra stubs of trace must be as short as possible. The following principles should be complied with when design the USB interface, so as to meet USB 2.0 & USB 3.0 specifications. ...
  • Page 49 LTE-A Module Series EG06 Hardware Design Data carrier detection 1.8V power domain Clear to send 1.8V power domain Request to send 1.8V power domain Data terminal ready, 1.8V power domain Sleep mode control Transmit data 1.8V power domain Receive data 1.8V power domain Table 12: Pin Definition of the Debug UART Interface Pin Name...
  • Page 50 LTE-A Module Series EG06 Hardware Design 1.35 The module provides 1.8V UART interface. A level translator should be used if the application is equipped with a 3.3V UART interface. A level translator TXS0108EPWR provided by Texas Instruments is recommended. The following figure shows a reference design. VDD_EXT VCCA VCCB...

  • Page 51: Pcm And I2C Interfaces

    LTE-A Module Series EG06 Hardware Design NOTE Transistor circuit solution is not suitable for applications with high baud rates exceeding 460Kbps. 3.12. PCM and I2C Interfaces EG06 supports audio communication via Pulse Code Modulation (PCM) digital interface and I2C interface. The PCM interface supports the following modes: ...
  • Page 52 LTE-A Module Series EG06 Hardware Design 125us PCM_CLK PCM_SYNC PCM_OUT PCM_IN Figure 24: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 15: Pin Definition of PCM and I2C Interfaces Pin Name Pin No.

  • Page 53: Adc Interfaces

    LTE-A Module Series EG06 Hardware Design The following figure shows a reference design of PCM interface with an external codec IC. MICBIAS PCM_CLK BCLK PCM_SYNC LRCK PCM_OUT PCM_IN LOUTP I2C_SCL I2C_SDA LOUTN Module Codec 1.8V Figure 25: Reference Circuit of PCM Application with Audio Codec NOTES It is recommended to reserve an RC (R=22Ω, C=22pF) circuit on the PCM lines, especially for PCM_CLK.

  • Page 54: Network Status Indication

    LTE-A Module Series EG06 Hardware Design The following table describes the characteristic of the ADC interfaces. Table 17: Characteristics of ADC Interfaces Parameter Min. Typ. Max. Unit ADC0 Voltage Range 0.15 VBAT_BB ADC1 Voltage Range 0.15 VBAT_BB ADC Resolution bits NOTES The input voltage of ADC should not exceed that of VBAT_BB.

  • Page 55: Status

    LTE-A Module Series EG06 Hardware Design Always Low Others Flicker slowly (200ms High/1800ms Low) Network searching Flicker slowly (1800ms High/200ms Low) Idle NET_STATUS Flicker quickly (125ms High/125ms Low) Data transfer is ongoing Always High Voice calling A reference circuit is shown in the following figure. Module VBAT 2.2K...

  • Page 56: Behavior Of The Ri

    LTE-A Module Series EG06 Hardware Design A reference circuit is shown as below. VBAT Module 2.2K 4.7K STATUS Figure 27: Reference Circuits of STATUS 3.16. Behavior of the RI AT+QCFG="risignaltype","physical" command can be used to configure RI behavior. No matter on which port a URC is presented, the URC will trigger the behavior of RI pin. NOTE The URC can be output from UART port, USB AT port and USB modem port by AT+QURCCFG command.

  • Page 57: Pcie Interface

    LTE-A Module Series EG06 Hardware Design 3.17. PCIe Interface* EG06 includes a PCIe interface which is compliant with PCI Express Specification Revision 2.1. The key features of the PCIe interface are shown below:  PCI Express Specification Revision 2.1 compliance ...

  • Page 58: Wlan Control Interface

    LTE-A Module Series EG06 Hardware Design  Keep PCIe data and control signals away from sensitive circuits and signals, such as RF, audio, and 19.2MHz clock signals.  A capacitance should be added in series on Tx/Rx traces to remove any DC bias. ...

  • Page 59: Sd Card Interface

    LTE-A Module Series EG06 Hardware Design NOTE “*” means under development. 3.19. SD Card Interface EG06 provides one SD card interface which supports SD 3.0 protocol. The following tables show the pin definition. Table 24: Pin Definition of the SD CardInterface Pin Name Pin No.
  • Page 60 LTE-A Module Series EG06 Hardware Design The following figure shows a reference design of SD card interface with EG06 module. Module SD Card Connector VDD_EXT VDD_2V85 SD_VDD 100uF 100nF 33pF 10pF 100K 100K 100K 100K 100K 470K R1 0R SD_DATA3 CD/DAT3 R2 0R SD_DATA2...

  • Page 61: Spi Interface

    LTE-A Module Series EG06 Hardware Design 3.20. SPI Interface EG06 provides one SPI interface which only supports master mode with a maximum clock frequency up to 50MHz. The following table shows the pin definition of SPI interface. Table 25: Pin Definition of the SPI Interface Pin Name Pin No.

  • Page 62: Usb_Boot Interface

    LTE-A Module Series EG06 Hardware Design Table 26: Parameters of SPI Interface Timing Parameter Description Min. Typ. Max. Unit SPI clock period 20.0 t(ch) SPI clock high level time t(cl) SPI clock low level time t(mov) SPI master data output valid time -5.0 t(mis) SPI master data input setup time...
  • Page 63 LTE-A Module Series EG06 Hardware Design Table 27: Pin Definition of USB_BOOT Interface Pin Name Pin No. Description Comment 1.8V power domain. Force the module to enter into USB_BOOT Active high. emergency download mode If unused, keep it open. The following figure shows a reference circuit of USB_BOOT interface. Module VDD_EXT Test point...

  • Page 64: Gnss Receiver

    LTE-A Module Series EG06 Hardware Design GNSS Receiver 4.1. General Description EG06 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EG06 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default.

  • Page 65: Layout Guidelines

    LTE-A Module Series EG06 Hardware Design Autonomous Hot start @open sky XTRA enabled Accuracy Autonomous CEP-50 (GNSS) @open sky NOTES Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.

  • Page 66: Antenna Interfaces

    LTE-A Module Series EG06 Hardware Design Antenna Interfaces EG06 includes a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface. The impedance of antenna port is 50Ω.
  • Page 67 LTE-A Module Series EG06 Hardware Design WCDMA B8 880~915 925~960 WCDMA B9 1750~1785 1845~1880 WCDMA B19 830~845 875~890 LTE B1 1920~1980 2110~2170 LTE B2 1850~1910 1930~1990 LTE B3 1710~1785 1805~1880 LTE B4 1710~1755 2110~2155 LTE B5 824~849 869~894 LTE B7 2500~2570 2620~2690 LTE B8...

  • Page 68: Reference Design Of Rf Antenna Interface

    LTE-A Module Series EG06 Hardware Design 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. It should reserve a π-type matching circuit for better RF performance. The capacitors are not mounted by default. Main Module Antenna...
  • Page 69 LTE-A Module Series EG06 Hardware Design Figure 33: Microstrip Line Design on a 2-layer PCB Figure 34: Coplanar Waveguide Line Design on a 2-layer PCB Figure 35: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground) EG06_Hardware_Design 67 / 89...

  • Page 70: Gnss Antenna Interface

    LTE-A Module Series EG06 Hardware Design Figure 36: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ...

  • Page 71: Antenna Installation

    LTE-A Module Series EG06 Hardware Design Table 32: GNSS Frequency Type Frequency Unit GPS/Galileo/QZSS 1575.42± 1.023 GLONASS 1597.5~1605.8 BeiDou 1561.098± 2.046 A reference design of GNSS antenna is shown as below. 0.1uF GNSS Antenna Module 47nH 100pF ANT_GNSS Figure 37: Reference Circuit of GNSS Antenna NOTES An external LDO can be selected to supply power according to the active antenna requirement.
  • Page 72 LTE-A Module Series EG06 Hardware Design Table 33: Antenna Requirements Type Requirements Frequency range: 1561MHz ~ 1615MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) GNSS Passive antenna gain: > 0dBi Active antenna noise figure: < 1.5dB Active antenna gain: > 0dBi Active antenna embedded LNA gain: <...

  • Page 73: Recommended Rf Connector For Antenna Installation

    LTE-A Module Series EG06 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use the U.FL-R-SMT connector provided by Hirose. Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connector listed in the following figure can be used to match the U.FL-R-SMT.
  • Page 74 LTE-A Module Series EG06 Hardware Design Figure 39: Mechanicals of U.FL-LP Connectors EG06_Hardware_Design 72 / 89...
  • Page 75 LTE-A Module Series EG06 Hardware Design The following figure describes the space factor of mated connector. Figure 40: Space Factor of Mated Connector (Unit: mm) For more details, please visit https://www.hirose.com. EG06_Hardware_Design 73 / 89...

  • Page 76: Electrical, Reliability And Radio Characteristics

    LTE-A Module Series EG06 Hardware Design Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 34: Absolute Maximum Ratings Parameter Min.

  • Page 77: Power Supply Ratings

    LTE-A Module Series EG06 Hardware Design 6.2. Power Supply Ratings Table 35: The Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages VBAT_BB and must stay between the VBAT VBAT_RF minimum and maximum values. USB connection USB_VBUS 5.25...

  • Page 78: Current Consumption

    LTE-A Module Series EG06 Hardware Design 6.4. Current Consumption Table 37: EG06-E Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) WCDMA PF=512 (USB disconnected) LTE-FDD PF=32 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected)
  • Page 79 LTE-A Module Series EG06 Hardware Design WCDMA B5 HSUPA CH4407 @22.3dBm WCDMA B8 HSDPA CH3012 @22.6dBm WCDMA B8 HSUPA CH3012 @22.4dBm LTE-FDD B1 CH300 @23.5dBm LTE-FDD B3 CH1575 @23.7dBm LTE-FDD B5 CH2525 @22.7dBm LTE-FDD B7 CH3100 @23.48dBm 803.2 LTE data LTE-FDD B8 CH3625 @23.83dBm 616.9 transfer...

  • Page 80: Rf Output Power

    Table 38: RF Output Power Frequency Max. Min. WCDMA bands 24dBm+1/-3dB <-50dBm LTE FDD bands 23dBm± 2dB <-40dBm LTE TDD bands 23dBm± 2dB <-40dBm 6.6. RF Receiving Sensitivity The following tables show conducted RF receiving sensitivity of EG06 series module. EG06_Hardware_Design 78 / 89...

  • Page 81: Electrostatic Discharge

    LTE-A Module Series EG06 Hardware Design Table 39: EG06-E Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) WCDMA B1 -109.5dBm -106.7dBm WCDMA B3 -109.5dBm -103.7dBm WCDMA B5 -109.0dBm -104.7dBm WCDMA B8 -110.5dBm -103.7dBm LTE-FDD B1 (10M) -97.2dBm -98.8dBm -101.5dBm -96.3dBm LTE-FDD B3 (10M)

  • Page 82: Thermal Consideration

    LTE-A Module Series EG06 Hardware Design Table 40: Electrostatic Discharge Characteristics Tested Points Contact Discharge Air Discharge Unit VBAT, GND ± 5 ± 10 Antenna Interfaces ± 4 ± 8 Other Interfaces ± 0.5 ± 1 6.8. Thermal Consideration In order to achieve better performance of the module, it is recommended to comply with the following principles for thermal consideration: ...
  • Page 83 LTE-A Module Series EG06 Hardware Design EG06 Module Heatsink Heatsink Thermal Pad Shielding Cover Application Board Application Board Figure 41: Referenced Heatsink Design (Heatsink at the Top of the Module) Thermal Pad Thermal Pad EG06 Module Heatsink Heatsink Application Board Shielding Cover Application Board Figure 42: Referenced Heatsink Design (Heatsink at the Backside of Customers’...

  • Page 84: Mechanical Dimensions

    LTE-A Module Series EG06 Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the tolerances for dimensions without tolerance values are ± 0.05mm. 7.1. Mechanical Dimensions of the Module Figure 43: Module Top and Side Dimensions EG06_Hardware_Design 82 / 89...
  • Page 85 LTE-A Module Series EG06 Hardware Design Figure 44: Module Bottom Dimensions (Top View) EG06_Hardware_Design 83 / 89...

  • Page 86: Recommended Footprint

    LTE-A Module Series EG06 Hardware Design 7.2. Recommended Footprint Figure 45: Recommended Footprint (Top View) NOTE For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB. EG06_Hardware_Design 84 / 89...

  • Page 87: Design Effect Drawings Of The Module

    Figure 46: Top View of the Module Figure 47: Bottom View of the Module NOTE These are design effect drawings of EG06 module. For more accurate pictures, please refer to the module that you get from Quectel. EG06_Hardware_Design 85 / 89...

  • Page 88: Storage, Manufacturing And Packaging

    LTE-A Module Series EG06 Hardware Design Storage, Manufacturing and Packaging 8.1. Storage EG06 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40º C/90%RH. After the vacuum-sealed bag is opened, devices that will be subjected to reflow soldering or other high temperature processes must be: Mounted within 168 hours at the factory environment of ≤30º...

  • Page 89: Manufacturing And Soldering

    LTE-A Module Series EG06 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass.
  • Page 90 LTE-A Module Series EG06 Hardware Design Figure 49: Tape Specifications Figure 50: Reel Specifications EG06_Hardware_Design 88 / 89...

  • Page 91: Appendix A References

    LTE Module Sires EG06Hardware Design Appendix A References Table 41: Related Documents Document Name Remark Quectel_Ex06_AT_Commands_Manual EG06 AT Commands Manual Quectel_Ex06_GNSS_AT_Commands_ EG06 GNSS AT Commands Manual Manual Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Quectel_EG06_Reference_Design EG06 Reference Design Quectel_RF_Layout_Application_Note RF Layout Application Note Table 42: Terms and Abbreviations Abbreviation Description...
  • Page 92 LTE Module Sires EG06Hardware Design Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global GLONASS Navigation Satellite System GMSK Gaussian Minimum Shift Keying GNSS Global Navigation Satellite System Global Positioning System Half Rate HSPA High Speed Packet Access...
  • Page 93 LTE Module Sires EG06Hardware Design Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency RHCP Right Hand Circularly Polarized Receive SGMII Serial Gigabit Media Independent Interface SIMO Single Input Multiple Output Short Message Service Time Division Duplexing TDMA Time Division Multiple Access TD-SCDMA...
  • Page 94 LTE Module Sires EG06Hardware Design Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network...

  • Page 95: Ic & Fcc Requirement

    LTE Module Sires EG06Hardware Design IC & FCC Requirement 10.1. FCC Regulations: This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.

  • Page 96: Ised Radiation Exposure Statement

    LTE Module Sires EG06Hardware Design Le présent appareil est conforme aux CNR Innovation, Sciences et Dé veloppement économique Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en This Class B digital apparatus complies with Canadian ICES-003.
  • Page 97 LTE Module Sires EG06Hardware Design the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. 10.7. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following " Contains Transmitter Module FCC ID: XMR201807EG06A.

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