Usb Interface - Quectel RM510Q-GL Hardware Design

⚫
Keep (U)SIM card signals away from RF and VCC traces.
⚫
Make sure the ground between the module and the (U)SIM card connector is short and wide. Keep
the trace width of ground and USIM_VDD no less than 0.5 mm to maintain the same electric
potential.
⚫
To avoid cross-talk between USIM_DATA and USIM_CLK, keep them away from each other and
shield them with surrounded ground.
⚫
To offer better ESD protection, add a TVS diode array of which the parasitic capacitance should be
not higher than 10 pF. Add 22 Ω resistors in series between the module and the (U)SIM card
connector to suppress EMI such as spurious transmission, and to enhance ESD protection. The 33
pF capacitors are used to filter out RF interference.
⚫ For USIM_DATA, a 10–20 kΩ pull-up resistor must be added near the (U)SIM card connector.

4.2. USB Interface

The module provides one integrated Universal Serial Bus (USB) interface which complies with the USB
3.1 & 2.0 specifications and supports super speed (10 Gbps) on USB 3.1 and high speed (480 Mbps) and
full speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication,
data transmission, GNSS NMEA sentence output, software debugging, firmware upgrade.
For more details about the USB 3.1 & 2.0 specifications, please visit http://www.usb.org/home.
Table 15: Pin Definition of USB Interface
Pin No. Pin Name
7 USB_DP
9 USB_DM
29 USB_SS_TX_M
31 USB_SS_TX_P
35 USB_SS_RX_M
37 USB_SS_RX_P
The USB 2.0 interface is recommended to be reserved for firmware upgrade in designs. The following
figure shows a reference circuit of USB 3.1 & 2.0 interface.
RM510Q-GL_Hardware_Design
I/O Description
AIO USB differential data bus (+)
AIO USB differential data bus (-)
AO USB 3.1 super-speed transmit (-)
AO USB 3.1 super-speed transmit (+)
AI USB 3.1 super-speed receive (-)
AI USB 3.1 super-speed receive (+)
5G Module Series
RM510Q-GL Hardware Design
Comment
Require differential
impedance of 90 Ω
40 / 88