Thermal Specifications, Restrictions, And Conditions; Overall Restrictions And Conditions; Heat Plate Only Restrictions And Conditions; Heat Sink Only Considerations - VersaLogic BayCat VL-EPM-31ECP Hardware Reference Manual

T S
HERMAL PECIFICATIONS
Graphical test data is in the section titled EPM-31 Thermal Characterization, beginning on page
71. Refer to that section for the details behind these specifications. These specifications are the
thermal limits for using the EPM-31 with one of the defined thermal solutions.
Due to the unknown nature of the entire thermal system, or the performance requirement of the
application, VersaLogic cannot recommend a particular thermal solution. This information is
provided for user guidance in the design of their overall thermal system solution.
Board
- -
VL EPM 31EAP
- -
VL EPM 31EBP
- -
VL EPM 31ECP
O R
VERALL ESTRICTIONS AND

Ranges shown assume less than 90% CPU utilization.

Keep the maximum CPU core temperature below 100ºC.

The ambient air surrounding the EPM-31 needs to be maintained at 85 ºC or below. This
includes the space between this CPU board and any board it is stacked on top of it.
Included is the space beneath an installed Mini PCIe expansion board and the installed
SODIMM. A recommended overall air flow of 100 Linear Feet per Minute (LFM) /
0.5 Linear Meters per Second (LMS) addresses this requirement. If this air flow is not
provided, other means to keep the adjacent air at 85 ºC or below must be implemented.
H P O
EAT LATE

The heat plate must be kept below 90 °C. This applies to a heat plate mounted directly to
another surface.
H S O
EAT INK NLY

At 85°C air temperature and 90% CPU utilization, there will be little – if any – thermal
margin to a CPU core temperature of 100 °C or the passive trip point (see test data). If
this is the use case, consider adding a fan or other additional air flow.
H S
EAT INK WITH

The heat sink and fan combination cools the CPU when it is running in high temperature
environments, or when the application software is heavily utilizing the CPU or video
circuitry. The fan assists in cooling the heat sink and provides additional air movement
within the system.

Integrator's Note:
The ambient air surrounding the EPM
EPM-31 Hardware Reference Manual
, R
ESTRICTIONS
Table 24: Absolute Minimum and Maximum Air Temperatures
With Heat Plate
-40 ° to +85 °C
-40 ° to +85 °C
-40 ° to +85 °C
C
ONDITIONS
R
NLY ESTRICTIONS AND
C :
ONSIDERATIONS
F C
AN ONSIDERATIONS
, C
AND ONDITIONS
With Heat Sink
(HDW-412)
-40 ° to +85 °C
-40 ° to +85 °C
-40 ° to +85 °C
C :
ONDITIONS
:
-
31 needs to be maintained at 85 ºC or below.
Thermal Considerations
With Heat Sink + Fan
(HDW-412 + HDW-407)
-40 ° to +85 °C
-40 ° to +85 °C
-40 ° to +85 °C
70