Epm-31 Thermal Characterization - VersaLogic BayCat VL-EPM-31ECP Hardware Reference Manual

EPM-31 Thermal Characterization

The EPM-31 board underwent the following thermal characterization tests:

Test Scenario 1: Single core EPM-31EAP + HDW-412 heat sink

Test Scenario 2: Dual core EPM-31EBP + HDW-412 heat sink, with/without HDW-407
fan

Test Scenario 3: Quad core EPM-31ECP + HDW-412 heat sink, with/without HDW-407
fan
Table 25 describes the thermal testing setup for the board.
Hardware configuration
BIOS
Operating system
Test software
Test environment
The test results reflect the test environment within the temperature chamber used. This particular
chamber has an airflow of about 0.5 meters per second (~100 linear feet per minute). Thermal
performance can be greatly enhanced by increasing the overall airflow beyond 0.5 meters per
second.
The system power dissipation is primarily dependent on the application program; that is, its use
of computing or I/O resources. The stress levels used in this testing are considered to be at the
top of the range of a typical user's needs.
EPM-31 Hardware Reference Manual
Table 25: EPM-31 Thermal Testing Setup
EPM 31 (BayCat) single/dual/quad core CPU with:
-

4 GB of DDR3 DRAM (VersaLogic part number VL-MM9-4EBN)

HDW-412 (passive heat sink)

HDW-407 (heat sink fan)

One attached DisplayPort device

Two RS-232 ports in loopback configuration

Two active Ethernet ports

Three USB 2.0 ports in loopback configuration

ID string: BayCat_3.1.0.334.r1.101

Passive thermal trip point setting: 105 ºC

Critical thermal trip point setting: 110 ºC
Microsoft Windows 8.1 Enterprise

Passmark BurnIn Test v7.1 b1017
- CPU utilization ~90%

Intel Thermal Analysis Tool (TAT) v5.0.1014
- Primarily used to read the CPU core temperature
Thermal chamber
Thermal Considerations
71