Quectel 5G Series Hardware Design page 8

6.7. Operating and Storage Temperatures ...................................................................................... 78
7 Mechanical Dimensions and Packaging ......................................................................................... 79
7.1. Mechanical Dimensions of the Module ..................................................................................... 79
7.2. Top and Bottom Views of the Module ....................................................................................... 80
7.3. M.2 Connector ........................................................................................................................... 80
7.4. Packaging ................................................................................................................................. 81
8 Appendix References ........................................................................................................................ 82
RM500Q-GL_Hardware_Design
5G Module Series
RM500Q-GL Hardware Design
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