Quectel 5G Series Hardware Design page 85

MLCC
MO
MSB
MT
PAP
PCB
PCIe
PCM
PDU
PPP
QMI
RC
RF
RFFE
R/LHCP
Rx
SAR
SCS
SDR
SIMO
SMS
Tx
UART
UHB
UL
RM500Q-GL_Hardware_Design
Multilayer Ceramic Chip Capacitor
Mobile Originated
Most Signification Bit
Mobile Terminated
Password Authentication Protocol
Printed Circuit Board
Peripheral Component Interconnect Express
Pulse Code Modulation
Protocol Data Unit
Point-to-Point Protocol
Qualcomm MSM (Mobile Station Modems) Interface
Root Complex
Radio Frequency
RF Front-End
Right/Left Hand Circular Polarization
Receive
Specific Absorption Rate
Subcarrier Spacing
Software-Defined Radio
Single-Input Multiple-Output
Short Message Service
Transmit
Universal Asynchronous Receiver & Transmitter
Ultra-High Band
Uplink
5G Module Series
RM500Q-GL Hardware Design
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