Smt Pick And Place; Smt Process Parameter Reference; Reflow Profile - Digi ConnectCore 8X Hardware Reference Manual

Assembly instructions
optimal solder paste volume.

SMT pick and place

Placement nozzle: Largest available on the machine
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Nozzle pick surface: Center of shield
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Placement speed: Slowest speed for the machine
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Placement alignment: 10% of pad diameter (compensating for module weight and supporting
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alignment). The module should be placed last as part of the assembly/mounting process to
eliminate unexpected shifting.

SMT process parameter reference

Process SMT process
Screen print Solder paste
Stencil thickness
Stencil diameter
Paste alignment
PnP Placement nozzle
Nozzle pick surface
Speed
Placement sequence
Placement alignment 10% maximum off center of pad
Reflow See the

Reflow profile

Digi recommends the following:
SoM temperature below 238°C during reflow cycle.
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Time Above Liquidus (TAL) between 55 and 65 seconds.
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Use of 40AWG K-type thermal couple and M.O.L.E. or equivalent thermal profiler.
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ConnectCore® 8X System-on-Module Hardware Reference Manual
Specification recommendations
SAC305 No-Clean (Alpha OM-340 or equivalent)
0.15 mm / 5 mil
1.47 mm / 58mil
20% maximum off center of the pad
Largest available on machine
Shield center
Slowest possible with PnP machine
Last, if possible
Reflow profile
SMT pick and place
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