Environmental Specifications; Mechanical Specifications; Mtbf - Digi ConnectCore 8X Hardware Reference Manual

Module specifications

Environmental specifications

Operating temperature: -40 to 85 C.
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CAUTION! Your final product may require additional thermal management such as
passive (heatsink/spreader) or active (airflow) cooling to achieve the maximum
operating temperature without exceeding the processor junction temp limit.
The ConnectCore 8X module shall be built in an enclosure so the shield is not accessible to the
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end user.

Mechanical specifications

See the ConnectCore 8X product page

MTBF

MTBF (Mean Time Before Failure) has been estimate using the method of prediction Telcordia
Reliability Prediction Procedure, SR-332, Issue 4, "Parts Count" Method.
The following assumptions have been made:
An average ambient temperature of +23°C.
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Electrical Stress of 50%
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Quality Level II for all components
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Mission profile considered in this analysis is a yearly continuous operation i.e. always operating
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On, 365 days per year.
Average module temperature rise = 17°C
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Two different environmental factors have been considered:
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An environmental factor of π~E~ = 1.2 is defined in SR-332 for Ground, Fixed, Uncontrolled
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(limited) environments (GL).
An environmental factor of π~E~ = 2 is defined in SR-332 for Ground, Mobile environments
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(GM).
Product variant
ConnectCore 8X
wireless
ConnectCore 8x non-
wireless
Failure rate and MTTF (Mean Time To Failure) for different operational temperature:
ConnectCore® 8X System-on-Module Hardware Reference Manual
for links to mechanical drawings and other design documents.
Ground fixed, Uncontrolled (limited) –
MTTF (hours)
1 926 782
2 409 639
Environmental specifications
Ground Mobile – MTTF
(hours)
1 156 069
1 445 087
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