Digi ConnectCore 8X Hardware Reference Manual page 105

Assembly instructions
Digi recommends you use two (2) thermocouple locations to achieve proper attachment of SoM:
Attach thermocouple to bottom of SoM located in the center of the cutout with the
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thermocouple touching the SoM.
Drill hole through bottom of carrier PCB near corner of SoM deep enough to reach SoM.
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Insert thermocouple into hole touching SoM and secure.
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Digi recommends X-ray analysis after reflow to confirm proper mounting and solder reflow.
The ConnectCore 8X system-on-module is approved to withstand a total of four (4) reflow cycles. Two
(2) reflow cycles are required for manufacturing the module. Two (2) reflow cycles are remaining for
mounting the module on the carrier board. Digi strongly recommends soldering the module during
the last reflow cycles of the carrier board manufacturing process.
ConnectCore® 8X System-on-Module Hardware Reference Manual
Reflow profile
105