Moisture Sensitivity And Shelf Life; Mounting; Coplanarity; Solder Paste Print - Digi ConnectCore 8X Hardware Reference Manual

Assembly instructions

Moisture sensitivity and shelf life

The ConnectCore 8X system-on-module module is classified as a Level 3 Moisture Sensitive Device in
accordance with IPC/JEDEC J-STD-020.
1. Calculated shelf life in sealed packaging: 12 months at <40°C and <90% relative humidity (RH).
2. Environmental condition during production: 30°C / 60% RH according to IPC/JEDEC J-STD-
033C paragraph 5.
3. After module is removed from sealed packaging, modules that will be subjected to reflow
solder temperatures are required to be:
a. Mounted within 168 hours
b. Stored per J-STD-033
4. Baking is required, before mounting if:
a. the packaging humidity indicator indicates 10% RH or higher.
b. either 3a or 3b are not met
5. If baking is required, bake modules in trays for 4-6 hours at 125°C; maximum stacking height is
10 trays.

Mounting

The ConnectCore 8X system-on-module module has been designed with easy integration into existing
SMT processes in mind.This section contains guidance for mounting the module on your carrier
board.
Modules are not sealed and therefore they should not be subjected to a wash cycle or similar
treatment where condensation could occur. Contact Digi International for guidance to discuss
conformal coating approaches and options, if needed.

Coplanarity

The coplanarity measured is <0.003" bow and twist (98% confidence interval). It is important that the
carrier board is also coplanar. It is recommended that the assembly be supported during the reflow
process with a fixture to minimize the potential bow of the carrier card.

Solder paste print

The following solder paste type has been approved for mounting the module on a carrier board:
SAC305 No-Clean solder paste (Lead-free: Alpha OM-340 Type 4 or equivalent)
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The following solder paste printing parameters are recommended:
Stencil thickness: 0.125 mm/5 mil
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Stencil diameter: One to one of pad diameter (to +20% of pad)
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Paste alignment: 20% off the pad max (offset <20% pad diameter)
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Stencil

The recommendation is to use a laser cut and/or electro-formed stencil. Based on the actual
coplanarity characteristics of your carrier board, adjustments may be required to determine the
ConnectCore® 8X System-on-Module Hardware Reference Manual
Moisture sensitivity and shelf life
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