Device Development Process - ST STM32L4 Series User Manual

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Device development process

STM32 series product development process (see
interrelated activities dedicated to transform customer specification and market or industry domain requirements
into a semiconductor device and all its associated elements (package, module, sub-system, hardware, software,
and documentation), qualified with ST internal procedures and fitting ST internal or subcontracted manufacturing
technologies.
·Key characteristics and
requirements related to future
uses of the device
·Industry domain(s), specific
customer requirements and
definition of controls and tests
needed for compliance
·Product target specification
and strategy
·Project manager
appointment to drive product
development
·Evaluation of the
technologies, design tools
and IPs to be used
·Design objective
specification and product
validation strategy
·Design for quality
techniques (DFD, DFT, DFR,
DFM, ...) definition
·Architecture and positioning
to make sure the software
and hardware system
solutions meet the target
specification
·Product approval strategy
and project plan
UM2305 - Rev 10
Figure 1. STMicroelectronics product development process
1 Conception
·Semiconductor design
·Hardware development
·Software development
·Analysis of new product
·Reliability plan, reliability
·Use of tools and
·Detection of potential
·Assessment of Engineering
·Statistical analysis of
·Failure analysis on failed
·Physical destructive
·Electrostatic discharge
Figure 1), compliant with the IATF 16949 standard, is a set of
2 Design and
validation
development
specification to forecast
reliability performance
design rules, prediction of
failure rates for operating life
test using Arrhenius's law and
other applicable models
methodologies such as
APQP, DFM, DFT, DFMEA
reliability issues and solution
to overcome them
Samples (ES) to identify the
main potential failure
mechanisms
electrical parameter drifts for
early warning in case of fast
parametric degradation (such
as retention tests)
parts to clarify failure modes
and mechanisms and identify
the root causes
analysis on good parts after
reliability tests when required
(ESD) and latch-up sensitivity
measurement
UM2305
Device development process
3 Qualification
·Successful completion of
the product qualification
plan
·Secure product deliveries
on advanced technologies
using stress methodologies
to detect potential weak
parts
·Successful completion of
electrical characterization
·Global evaluation of new
product performance to
guarantee reliability of
customer manufacturing
process and final application
of use (mission profile)
·Final disposition for
product test, control and
monitoring
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