Assembly; Overview; Bottom Cover; Top Cover - DFI EC700-AL User Manual

Fanless embedded system
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X Assembly

Overview

The system is assembled in the following procedure. To disassemble, please carry out the pro-
cedure in the reversed order.
1. Attach the front and rear panels to the system board.
2. Attach the assembly to the top cover.
3. Attach the bottom cover.

Bottom Cover

The internal I/O of the system is mainly accessed on the bottom side. The bottom metal
cover is secured onto the chassis with 14 F3*5 zinc-coated screws located at both sides and
on the bottom. Use a Phillips screwdriver to unscrew them.
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Top Cover

The system board assembly is secured onto the top cover by fastening four screws (C) into
four brass stand-offs (A) at four corners. An additional screw (B) located in the vincinity of the
CPU shall also be fastened through the board into the top cover to make sure CPU heat is ef-
ficiently dissipated through the contact with the thermal pad on the inside of the top cover.
To install the top cover, we suggest that the top cover be placed on a worksufrace with the in-
side facing upward. The location of the stand-offs and the top cover screw holes are as shown
below. Orient the assembly of system board and panels so that
1. the CPU on the system board sits right on top of the thermal pad on the inside of the top
cover;
2. the front and rear panels sit into the indentations along the long edges of the top cover.
3. the brass stand-offs, their screws, and the CPU screw are securely fastened onto the top
cover.
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Indentation Rail
Chapter 2
HARDWARE INSTALLATION
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