Hardware Specifications - Nexcom ICES 670 Series User Manual

Chapter 1: Product Introduction

Hardware Specifications

CPU Support
▪ Support Intel
® BGA 1364, 4th generation Intel
(Haswell-M/Shark Bay-MB)
Main Memory
▪ Dual ECC-DDR3L/SO-DIMMs, support 1333/1600MHz memory up to
16GB
Platform Control Hub
▪ Intel
® 8 series (Lynx Point-M) PCH chipset
BIOS
▪ AMI system UEFI BIOS
▪ Plug and play support
▪ Advanced power management and advanced configuration & power
interface support
Display
▪ Intel
GT1/GT2/GT3 integrated graphics processing unit (iGPU)
®
▪ One PCI Express x16 (Gen. 3.0) lane down to the carrier board
▪ Support VGA and eDP/LVDS interface
▪ 3 x DDI (Digital Display Interface), support HDMI/DVI, DP/eDP interfaces
Audio
▪ HD audio interface
Onboard LAN
▪ Intel
® Clarkville (I217) Gigabit Ethernet, support next generation vPro/
iAMT
Copyright © 2020 NEXCOM International Co., Ltd. All Rights Reserved.
▪ Support PXE boot from LAN, wake on LAN function
® Core™ processors
▪ Signals down to I/O board
COM Express Connector
▪ AB
VGA/LVDS/8 x USB 2.0/HD Audio/4 x SATA/GbE/GPIO/LPC bus,
1 x PCIe x4/2 x PCIe x1/SMBus (I2C)/SPI BIOS/SPK out
▪ CD
PCIe x16/3 x DDI/4 x USB 3.0/1 x PCIe x1
Power Requirements
▪ +12V, +5VSB, +3.3V RTC power
Dimensions
▪ 95mm (W) x 125mm (L)
Environment
▪ Board level operating temperatures: -15°C to 60°C
▪ Storage temperatures: -20°C to 80°C
▪ Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)
Certifications
▪ Meet CE
▪ FCC Class A
2
ICES 670 User Manual