Special Handling Of Static-Sensitive Devices - Keithley S535 Administrative Manual

Section 4: Maintenance
Take the following precautions when servicing any system component:
Do not store or operate the system in an environment where dust could settle on the components.
Use dry nitrogen gas to clean dust off the components, if necessary.
Handle cards only by the side edges and shields.
Do not touch any board surfaces, components, or connectors.
Do not touch areas adjacent to electrical contacts.
Wear clean-room approved gloves when servicing any component.
If necessary, make solder repairs on a circuit board using lead-free solder. Remove the solder
from the work areas when the repair is complete. Use pure water and clean cotton swabs or a
clean, soft brush to remove the solder. Take care not to spread the solder to other areas of the
components. Once the solder is removed, use a swab moistened with methanol or isopropyl
alcohol to wipe only the repaired area, and then blow-dry the board with dry nitrogen gas.
After cleaning, place the components in a 50 °C low-humidity environment for several minutes
before use.

Special handling of static-sensitive devices

System components can be damaged by electrostatic discharge (ESD). Wear a ground strap
and attach the clip lead to the grounding bar in the test head or the system cabinet frame
before working on the system. Assume all parts are static sensitive.
High-impedance devices are subject to possible static discharge damage because of the
high-impedance levels involved. When handling such devices, assume all parts are static sensitive:
Static-sensitive components should be transported and handled only in containers designed to
prevent or dissipate static buildup. Typically, these components are received in anti-static
containers made of plastic or foam. Keep these parts in their original containers until ready for
installation or use.
Remove the components from their protective containers only at a properly grounded workstation.
Also, ground yourself with an appropriate wrist strap while working with these components.
Handle the connectors only by their bodies. Do not touch the boards, pins, or terminals.
Any printed circuit board into which the device is to be inserted must first be grounded to the
bench or table.
Use only anti-static type desoldering tools and grounded-tip soldering irons.
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S535 Wafer Acceptance Test System Administrative Guide
S535-924-01 Rev. B / January 2019