Glossary - Intel S7200AP System Integration And Service Manual

Glossary

Acronym Description
AC Alternating Current, a type of electrical current in which the current repeatedly changes direction
ACM Authenticated Code Mode
ACPI Advanced Configuration Power Interface
AP Application Processor
BDS Boot Device Selection
BIB Burn in Board
BIOS Basic Input/Output System – Firmware interface to the system hardware
BIST Built-in Self-Test
BMC Baseboard Management Controller
Boot strap processor. The processor selected at boot time to be the primary processor in a multi-processor
BSP
system.
BTU/hour A unit of power. 1 watt is approximately 3.41214 BTU/h[, and 1000 BTU/h is approximately 293.071 W
CLTT Closed Loop Thermal Throttling
CMOS Complementary Metal-oxide-semiconductor
CPU Central Processing Unit
Configuration RAM - a programmable bit inside an FPGA that controls its behavior
CRAM
CSM Compatibility Support Module
DC Direct current, the flow of electric charge is only in one direction.
Dual In-line Memory Module, a plug-in memory module with signal and power pins on both sides of the
DIMM
internal printed circuit board (front and back).
DQ Data Quality
DQS Bi-directional Data Strobe
DXE Driver Execution Environment. Component of Intel
EI Enhanced Intel
ESD Electrostatic Discharge
FRU Field Replaceable Unit
GT/s GigaTransfers per second
HBA Hot Bus Adapter
HPC High Performance Computing
IDE Integrated Drive Electronics, a disk interface standard
IFT Intel Fabric Through
IMC Integrated Memory Controller – memory controller integrated into the processor chip
IPL Initial Program Load
IPMB Intelligent Platform Management Bus
ISTA International Safe Transit Association
JEDEC Joint Electron Device Engineering Council, industry organization for memory standards
Keyboard, Video, and Mouse – an attachment that mimics those devices, and connects them to a remote I/O
KVM
user
LAN Local Area Network
LED Light Emitting Diode
Platform Innovation Framework for EFI architecture
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