AXEL LITE Hardware Manual
8.3.2
Set 2
This section will be completed in a future version of this manual.
8.4
Heat Dissipation
Qualification of the microprocessors has been deeply changed with
respect to some years ago. Silicon manufactures today qualify ICs
measuring the temperature at dye level, that is conceptually correct since
we are dealing with silicon. On the other hand, users are loosing the
straightforward relationship with the "ambient temperature", that is the
end- user parameter still popular and evaluated when they must choose
a platform for their needs.
Therefore, a deep knowledge of the heat transfer mechanism from
junction to environment is absolutely needed. Also, to know how to save
power consumption and to dissipate heating is of primary importance.
Application Note AN4579
understanding thermal dissipation of iMX6 components.
We strongly recommend to read, understand, and follow all
suggestions described in that guide.
AN4579 deals with the twofold aspects of the problem. The first aspect is
related to the power saving strategy to be implemented. That are
implemented in software on an hardware properly set.
DAVE Embedded Systems has implemented in the Linux BSP, and
maintained in the time, many of the Software Thermal Management
Techniques listed in the Application Notes. Check with your DAVE
Embedded Systems' Technical Support which are currently maintained
and which are the default settings.
Once power has been managed at best as mentioned above, heat
dissipation is also to be managed. Starting from the standard
consumption described in the "use cases" above [see also AN4576
AN4509
http://wiki.dave.eu/index.php/Power_consumption_(AxelLite)
1
AN4579: Thermal Management Guidelines
2
AN4576: i.MX6 Dual Lite Power Consumption Measurement
3
AN4509: i.MX6 Dual/Quad Power Consumption Measurement
4
AN4715: i.MX6 Solo Consumption Measurement
1
3
and AN4715
4
and
released by NXP is a fundamental guide in
October, 2016
v. 0.9.5
2
,
] , using
60/63
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